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Product
Specification
108-2351
19 AUG 16 Rev H1
IMPACT 100 Ohm Interconnect Systems
1. SCOPE
1.1. Content
This specification defines the performance, tests and quality requirements for the TE Connectivity (TE)
IMPACT 100 Ohm Interconnect Systems which consists of modular groupings of broad-edge coupled
signals with optional integrated guidance. These connectors are two-piece devices, which connect two
printed circuit boards (PCBs). The right angle receptacle connectors (daughtercard) and header pin
connectors (backplane) are through-hole devices with Eye-of-the-Needle (EON) compliant pin terminals.
1.2. Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
Successful qualification testing on the subject product line was completed on 25 Feb 11. The
Qualification Test Report number for this testing is 501-743. This documentation is on file at and
available from Engineering Practices and Standards (EPS).
2. APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
2.1. TE Connectivity Document
501-743: IMPACT Interconnect Systems (Qualification Test Report)
2.2. Industry Document
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
2.3. Reference Document
109-197: TE Test Specifications vs. EIA and IEC Test Methods (Test Specification)
2.4. The header pins are lubricated in the contact area with an approved lubricant according to industry
standard Telcordia GR-1217-CORE, Section 5.3.
3. REQUIREMENTS
3.1. Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
IMPACT and Molex are trademarks of Molex, Incorporated
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3.2. Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
3.3. Ratings
Agency Voltage: 29.9 volts AC, rms DC maximum
Non-Agency Voltage: 150 volts AC, rms DC maximum
Current: 0.75 ampere maximum per contact
Temperature: -55 to 85°C
3.4. Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions.
3.5. Test Requirements and Procedures Summary
Test Description
Requirement
Procedure
Initial examination of product
Meets requirements of product drawing.
Visual and dimensional (C of C)
inspection per product drawing.
Final examination of product
Meets visual requirements.
Visual inspection.
ELECTRICAL
Low Level Contact Resistance
(LLCR)
R 10 milliohms maximum.
Refer to Figure 5 for typical initial bulk
resistances.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage. See Figure 3.
Insulation resistance.
1000 megohms minimum.
500 volts DC, 2 minutes hold. Test
between adjacent contacts of
unmated specimens.
Withstanding voltage.
One minute hold with no breakdown,
flashover or leakage exceeding 5
milliamperes
500 volts AC at sea level. Test
between adjacent contacts of
unmated specimens.
Compliant pin interface
resistance.
One million maximum
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage. Contact inserted into PCB.
MECHANICAL
Sinusoidal vibration.
No discontinuities of 10 nanoseconds or
longer duration. See Note.
Subject mated specimens to 10 to
500 to 10 Hz traversed in 1 minute
with 1.5mm maximum total
excursion or 10 G peak. Three
hours in each of 3 mutually
perpendicular planes. See Figure 4.
Figure 1 (cont)
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Test Description
Requirement
Procedure
Mechanical shock.
No discontinuities of 10 nanoseconds
or longer duration. See Note.
EIA-364-27, Condition H.
Subject mated specimens to 30 G’s
half-sine shock pulses of 11 seconds
duration. Three shocks in each
direction applied along 3 mutually
perpendicular planes, 18 total shocks.
See Figure 4.
Durability
See Note.
EIA-364-9.
Mate and unmate specimens for the
numbers of cycles specified in Figure 2
at a maximum rate of 500 cycles per
hour.
Mating force.
35 grams maximum (average per pin,
over entire assembly)
EIA-364-13.
Measure force necessary to mate
daughtercard and backplane at a
maximum rate of 25.4mm per minute.
Unmating force.
15 grams minimum initial,
8 grams minimum final (average per
pin, over entire assembly)
EIA-364-13.
Measure force necessary to unmate
daughtercard and backplane at a
maximum rate of 25.4mm per minute.
Compliant pin insertion force.
26.7 N maximum for headers.
17.8 N maximum for receptacles
These max values are intended for
press sizing only. The peak force
value will occur prior to the final
seating of the connector. Plating
surface finish and PCB materials will
impact actual values.
EIA-364-5.
Measure force required to insert a
contact into the PCB at a maximum
rate 5.08mm per minute.
Compliant pin retention force.
3.6 N minimum for both headers and
receptacles. Data reflects minimum
average values for retention forces
when tested in plated through holes
drilled and plated as described in the
appropriate impact application
specification. Plating surface finish
and PCB materials will impact actual
values.
Radial hole deformation: 1.5 mils
maximum
Axial hole deformation: 1.0 mil
maximum
EIA-364-5.
Measure force required to remove a
contact from the PCB at a maximum
rate 5.08mm per minute.
Minute/thermal disturbance.
See Note.
EIA-364-110. (Thermal Cycling),
condition A, Duration A. Subject
mated specimens to 10 cycles
between 15 and 85°C. Dwell until
acclimated, transition approximately 10
degrees per minute.
Figure 1 (cont)

2007842-3

Mfr. #:
Manufacturer:
TE Connectivity
Description:
IMP100S,H,V5P10C,LG,REW46,5.5
Lifecycle:
New from this manufacturer.
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