2006-02-14
Page 2
IPI70N10SL-16
IPP70N10SL-16, IPB70N10SL-16
Thermal Characteristics
Parameter
Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - case
R
thJC
- - 0.6 K/W
Thermal resistance, junction - ambient, leaded
R
thJA
- - 62.5
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
R
thJA
-
-
-
-
62
40
Electrical Characteristics, at
T
= 25 °C, unless otherwise specified
Parameter
Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
V
GS
=0V, I
D
=2mA
V
(BR)DSS
100 - - V
Gate threshold voltage,
V
GS
=
V
DS
I
D
= 2 mA
V
GS(th)
1.2 1.6 2
Zero gate voltage drain current
V
DS
=100V,
V
GS
=0V,
T
j
=25°C
V
D
=100V,
V
=0V,
T
=150°C
I
DSS
-
-
0.1
-
1
100
µA
Gate-source leakage current
V
GS
=20V,
V
DS
=0V
I
GSS
- 10 100 nA
Drain-source on-state resistance
V
GS
=4.5V, I
D
=50A
R
DS(on)
- 14 25
mΩ
Drain-source on-state resistance
V
GS
=10V, I
D
=50A
R
DS(on)
- 10 16
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.