CY14U256LA
Document Number: 001-86200 Rev. *B Page 19 of 22
Package Diagrams
Figure 13. 48-ball FBGA (6 × 10 × 1.2 mm) BA48B Package Outline, 51-85128
51-85128 *F
CY14U256LA
Document Number: 001-86200 Rev. *B Page 20 of 22
Acronyms Document Conventions
Units of Measure
Acronym Description
CE
Chip Enable
CMOS Complementary Metal Oxide Semiconductor
EIA Electronic Industries Alliance
FBGA Fine-Pitch Ball Grid Array
HSB
Hardware Store Busy
I/O Input/Output
nvSRAM Nonvolatile Static Random Access Memory
OE
Output Enable
SRAM Static Random Access Memory
RoHS Restriction of Hazardous Substances
RWI Read and Write Inhibited
WE
Write Enable
Symbol Unit of Measure
°C degree Celsius
k kilohm
MHz megahertz
A microampere
F microfarad
s microsecond
mA milliampere
mm millimeter
ms millisecond
ns nanosecond
ohm
% percent
pF picofarad
V volt
W watt
CY14U256LA
Document Number: 001-86200 Rev. *B Page 21 of 22
Document History Page
Document Title: CY14U256LA, 256-Kbit (32 K × 8) nvSRAM
Document Number: 001-86200
Rev. ECN No.
Orig. of
Change
Submission
Date
Description of Change
** 3918324 GVCH 03/01/2013 New data sheet.
*A 4024815 GVCH 06/10/2013 Changed status from “Summary” to “Final”.
Updated Maximum Ratings:
Removed “Ambient temperature with power applied” and added “Maximum
junction temperature”.
*B 4568158 GVCH 11/13/2014 Added related documentation hyperlink in page 1.

CY14U256LA-BA35XI

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
NVRAM 256Kb 1.95V 35ns nvSRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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