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PSMN1R0-30YLD
N-channel 30 V, 1.0 mΩ, 300 A logic level MOSFET in
LFPAK56 using NextPowerS3 Technology
14 December 2015 Product data sheet
Scan or click this QR code to view the latest information for this product
1. General description
300 Amp Logic level gate drive N-channel enhancement mode MOSFET in LFPAK56
package. NextPowerS3 portfolio utilising NXP’s unique “SchottkyPlus” technology
delivers high efficiency, low spiking performance usually associated with MOSFETs
with an integrated Schottky or Schottky-like diode but without problematic high leakage
current. NextPowerS3 is particularly suited to high efficiency applications at high
switching frequencies.
2. Features and benefits
300 Amp capability
Avalanche rated, 100 % tested at I(as) = 190 Amps
Ultra low Q
G
, Q
GD
and Q
OSS
for high system efficiency, especially at higher switching
frequencies
Superfast switching with soft-recovery; s-factor > 1
Low spiking and ringing for low EMI designs
Unique “SchottkyPlus” technology; Schottky-like performance with < 1 µA leakage at
25 °C
Optimised for 4.5 V gate drive
Low parasitic inductance and resistance
High reliability clip bonded and solder die attach Power SO8 package; no glue, no
wire bonds, qualified to 175 °C
Wave solderable; exposed leads for optimal visual solder inspection
3. Applications
On-board DC-to-DC solutions for server and telecommunications
Secondary-side synchronous rectification in telecommunication applications
Voltage regulator modules (VRM)
Point-of-Load (POL) modules
Power delivery for V-core, ASIC, DDR, GPU, VGA and system components
Brushed and brushless motor control
Power OR-ing
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
DS
drain-source voltage 25 °C ≤ T
j
≤ 175 °C - - 30 V
NXP Semiconductors
PSMN1R0-30YLD
N-channel 30 V, 1.0 mΩ, 300 A logic level MOSFET in LFPAK56 using
NextPowerS3 Technology
PSMN1R0-30YLD All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 14 December 2015 2 / 13
Symbol Parameter Conditions Min Typ Max Unit
I
D
drain current T
mb
= 25 °C; V
GS
= 10 V; Fig. 2 [1] - - 300 A
P
tot
total power dissipation T
mb
= 25 °C; Fig. 1 - - 238 W
T
j
junction temperature -55 - 175 °C
Static characteristics
V
GS
= 4.5 V; I
D
= 25 A; T
j
= 25 °C;
Fig. 10
- 1 1.3 R
DSon
drain-source on-state
resistance
V
GS
= 10 V; I
D
= 25 A; T
j
= 25 °C;
Fig. 10
- 0.79 1.02
Dynamic characteristics
Q
GD
gate-drain charge V
GS
= 4.5 V; I
D
= 25 A; V
DS
= 15 V;
Fig. 12; Fig. 13
- 10.9 16.35 nC
Q
G(tot)
total gate charge V
GS
= 4.5 V; I
D
= 25 A; V
DS
= 15 V;
Fig. 12; Fig. 13
- 38.2 57.3 nC
Source-drain diode
S softness factor I
S
= 25 A; V
GS
= 0 V; dI
S
/dt = -100 A/µs;
V
DS
= 15 V; Fig. 16
- 0.95 -
[1] 300A Continuous current has been successfully demonstrated during application tests. Practically the
current will be limited by PCB, Thermal design and operating temperature.
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 S source
2 S source
3 S source
4 G gate
mb D mounting base; connected to
drain
mb
1 2 3 4
LFPAK56; Power-
SO8 (SOT669)
S
D
G
mbb076
6. Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
PSMN1R0-30YLD LFPAK56;
Power-SO8
Plastic single-ended surface-mounted package
(LFPAK56; Power-SO8); 4 leads
SOT669

PSMN1R0-30YLDX

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET N-CH 30V 1.0 mOhm logic level MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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