MUBW15-12A6

© 2007 IXYS All rights reserved
4 - 9
20071113a
MUBW15-12A6K
IXYS reserves the right to change limits, test conditions and dimensions.
Temperature Sensor NTC
Ratings
Symbol Definitions Conditions min. typ. max. Unit
R
25
B
25/85
resistance
T
C
= 25°C 4.45 4.7
3510
5.0
kW
K
Module
Ratings
Symbol Definitions Conditions min. typ. max. Unit
T
VJ
T
VJM
T
stg
operating temperature
max. virtual junction temperature
storage temperature
-40
-40
125
150
125
°C
°C
°C
V
ISOL
isolation voltage
I
ISOL
< 1 mA; 50/60 Hz 2500 V~
M
d
mounting torque
(M4) 2.0 2.2 Nm
d
S
d
A
creep distance on surface
strike distance through air
12.7
12.7
mm
mm
Weight
40 g
Equivalent Circuits for Simulation
Ratings
Symbol Definitions Conditions min. typ. max. Unit
V
0
R
0
rectifier diode
D8 - D13 T
VJ
= 125°C 0.90
9
V
mW
V
0
R
0
IGBT
T1 - T6 T
VJ
= 125°C 1.50
120
V
mW
V
0
R
0
free wheeling diode
D1 - D6 T
VJ
= 125°C 1.46
31
V
mW
V
0
R
0
IGBT T7 T
VJ
= 125°C 1.50
120
V
mW
V
0
R
0
free wheeling diode D7 T
VJ
= 125°C 1.46
63
V
mW
I
V
0
R
0
T
C
= 25°C unless otherwise stated
Input Rectifier Bridge D8 - D13
Symbol
Definitions Conditions
Maximum Ratings
V
RRM
max. repetitive reverse voltage
1600 V
I
FAV
I
DAVM
I
FSM
average forward current
max. average DC output current
max. surge forward current
sine 180° T
C
= 80°C
rectangular; d =
1
/
3
; bridge T
C
= 80°C
t = 10 ms; sine 50 Hz T
C
= 25°C
31
89
320
A
A
A
P
tot
total power dissipation
T
C
= 25°C
80
W
Symbol Conditions Characteristic Values
min. typ. max.
V
F
forward voltage
I
F
= 30 A T
VJ
= 25°C
T
VJ
= 125°C
1.0
1.1
1.35 V
V
I
R
reverse current
V
R
= V
RRM
T
VJ
= 25°C
T
VJ
= 125°C 0.4
0.02 mA
mA
R
thJC
thermal resistance junction to case
(per diode) T
VJ
= 25°C 1.4 K/W
R
thCH
thermal resistance case to heatsink
(per diode) 0.45 K/W
© 2007 IXYS All rights reserved
5 - 9
20071113a
MUBW15-12A6K
IXYS reserves the right to change limits, test conditions and dimensions.
Ordering Part Name Marking on Product Delivering Mode Base Qty Ordering Code
Standard MUBW 15-12A6K MUBW15-12A6K Box 10 499 331
Outline Drawing Dimensions in mm (1 mm = 0.0394“)
Product Marking
© 2007 IXYS All rights reserved
6 - 9
20071113a
MUBW15-12A6K
IXYS reserves the right to change limits, test conditions and dimensions.
Fig. 2 Surge overload current Fig. 3 I
2
t versus time per diode
Fig. 5 Max. forward current
vs. case temperature
Fig. 6 Transient thermal impedance junction to case
Fig. 4 Power dissipation versus direct output current
and ambient temperature, sin 180°
0.001 0.01 0.1 1
0
50
100
150
200
2 3 4 5 6 7 8 91 10
10
2
10
3
0.0 0.6 1.2 1.8 2.4
0
20
40
60
80
0 20 40 60 80
0
40
80
120
160
0 20 40 60 80 100 120 140
0.001 0.01 0.1 1 10
0.0
0.4
0.8
1.2
1.6
I
2
t
I
FSM
I
F
A
V
F
t
s
t
ms
P
tot
W
I
D(AV)M
A
T
amb
t
s
K/W
A
2
s
0 20 40 60 80 100 120 140
0
20
40
60
80
100
I
D(AV)
T
C
A
V
A
°C
°C
Z
thJC
T
VJ
= 125°C
T
VJ
= 25°C
T
VJ
= 45°C
T
VJ
= 150°C
50Hz, 80% V
RRM
T
VJ
= 45°C
T
VJ
= 150°C
MUBW15-12A6K
R
thA
:
0.2 K/W
0.5 K/W
0.8 K/W
1.5 K/W
3 K/W
5 K/W
8 K/W
Fig. 1 Forward current versus
voltage drop per diode

MUBW15-12A6

Mfr. #:
Manufacturer:
Description:
MODULE IGBT CBI E1
Lifecycle:
New from this manufacturer.
Delivery:
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