VND810P-E Application information
Doc ID 17606 Rev 2 19/28
Recommended values are:
R
prot
= 10 kΩ
3.4 Open-load detection in off-state
Off-state open-load detection requires an external pull-up resistor (R
PU
) connected between
OUTPUT pin and a positive supply voltage (V
PU
) like the +5 V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1. No false open-load indication when load is connected: in this case we have to avoid
V
OUT
to be higher than V
Olmin
; this results in the following condition
V
OUT
= (V
PU
/ (R
L
+ R
PU
))R
L
< V
Olmin.
2. No misdetection when load is disconnected: in this case the V
OUT
has to be higher than
V
OLmax
; this results in the following condition R
PU
< (V
PU
- V
OLmax
) / I
L(off2)
.
Because I
s(OFF)
may significantly increase if V
out
is pulled high (up to several mA), the pull-
up resistor R
PU
should be connected to a supply that is switched OFF when the module is in
standby.
The values of V
OLmin
, V
OLmax
and I
L(off2)
are available in Section 2.3: Electrical
characteristics.
Figure 25. Open-load detection in off-state
V
OL
V batt. V
PU
R
PU
R
L
R
DRIVER
+
LOGIC
+
-
INPUT
STATUS
V
CC
OUT
GROUND
I
L(off2)
Application information VND810P-E
20/28 Doc ID 17606 Rev 2
3.5 Maximum demagnetization energy (V
CC
= 13.5 V)
Figure 26. Maximum turn-off current versus load inductance
(1)
1. Values are generated with R
L
= 0 Ω.
In case of repetitive pulses, T
jstart
(at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
V
IN
, I
L
t
Demagnetization
Demagnetization
Demagnetization
A = single pulse at T
Jstart
= 150 °C
B= repetitive pulse at T
Jstart
= 100 °C
C= repetitive pulse at T
Jstart
= 125 °C
1
10
0,1 1 10 100
L( mH)
I
LM AX (A )
A
B
C
VND810P-E Package and PCB thermal data
Doc ID 17606 Rev 2 21/28
4 Package and PCB thermal data
4.1 SO-16 thermal data
Figure 27. SO-16 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 1.6 mm, Cu thickness = 35 µm, Copper areas: 0.26 cm
2
, 4 cm
2
).
Figure 28. R
thj-amb
vs PCB copper area in open box free air condition
40
45
50
55
60
65
70
75
80
85
012345
PCB Cu heatsink area (cm ^2)
RTH j-am b
C/W)

VND810PTR-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Power Switch ICs - Power Distribution Double Ch High Side 36V VCC 160mOhm 3.5A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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