Package and PCB thermal data VND810P-E
22/28 Doc ID 17606 Rev 2
Figure 29. Thermal impedance junction ambient single pulse
Equation 3: pulse calculation formula
Figure 30. Thermal fitting model of a quad channel HSD in SO-16
0.01
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
0.26 cm
2
4 cm
2
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
where
δ t
p
T=
T_amb
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R2
C1 C2
R1
Tj_1
Tj_2
VND810P-E Package and PCB thermal data
Doc ID 17606 Rev 2 23/28
Table 16. Thermal parameters
Area / island (cm
2
)0.54
R1 (°C/W) 0.35
R2 (°C/W) 1.8
R3 (°C/W) 4.5
R4 (°C/W) 10
R5 (°C/W) 16
R6 (°C/W) 48 25
C1 (W.s/°C) 0.0001
C2 (W.s/°C) 7E-04
C3 (W.s/°C) 6E-03
C4 (W.s/°C) 0.2
C5 (W.s/°C) 0.7
C6 (W.s/°C) 2 4
Package and packing information VND810P-E
24/28 Doc ID 17606 Rev 2
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
5.2 SO-16 package information
Figure 31. SO-16 package dimensions

VND810PTR-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Power Switch ICs - Power Distribution Double Ch High Side 36V VCC 160mOhm 3.5A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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