© 2001 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
CES
T
J
= 25°C to 150°C 600 V
V
CGR
T
J
= 25°C to 150°C; R
GE
= 1 MΩ 600 V
V
GES
Continuous ±20 V
V
GEM
Transient ±30 V
I
C25
T
C
= 25°C55A
I
C90
T
C
= 90°C30A
I
CM
T
C
= 25°C, 1 ms 110 A
SSOA V
GE
= 15 V, T
J
= 125°C, R
G
= 2.7 Ω I
CM
= 60 A
(RBSOA) Clamped inductive load, V
CC
= 0.8 V
CES
@ 0.8 V
CES
t
SC
V
GE
= 15 V, V
CE
= 360 V, T
J
= 125°C 10µs
(SCSOA) R
G
= 33 Ω, non repetitive
P
C
T
C
= 25°C 200 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
M
d
Mounting torque (TO-247) 1.13/10 Nm/lb.in.
Weight TO-247 6 g
TO-268 4 g
Maximum lead temperature for soldering 300 °C
1.6 mm (0.062 in.) from case for 10 s
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
BV
CES
I
C
= 250 µA, V
GE
= 0 V 600 V
V
GE(th)
I
C
= 2.5 mA, V
CE
= V
GE
47V
I
CES
V
CE
= 0.8 V
CES
T
J
= 25°C 100 µA
V
GE
= 0 V T
J
= 125°C1mA
I
GES
V
CE
= 0 V, V
GE
= ±20 V ±100 nA
V
CE(sat)
V
GE
= 15 V; I
C
= I
C90
30N60B 2.0 V
30N60C 2.5 V
Features
l
International standard packages
l
Short Circuit SOA capability
l
High frequency IGBT
l
New generation HDMOS
TM
process
Applications
l
AC motor speed control
l
DC servo and robot drives
l
DC choppers
l
Uninterruptible power supplies (UPS)
l
Switch-mode and resonant-mode
power supplies
Advantages
l
Easy to mount with 1 screw
(isolated mounting screw hole)
l
Surface mountable, high power case
style
l
Reduce assembly time and cost
l
High power density
98519B (11/01)
G = Gate
S = Source TAB = Drain
TO-247 AD (IXSH)
(TAB)
TO-268 (D3) ( IXST)
(TAB)
G
S
High Speed IGBT
Short Circuit SOA Capability
V
CES
I
CES
t
fi
IXSH/IXST 30N60B 600 V 2.0 V 140 ns
IXSH/IXST 30N60C 600 V 2.5 V 70 ns