Philips Semiconductors
PIP250M
Integrated buck converter
Product data Rev. 02 — 21 February 2003 16 of 19
9397 750 10904
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
15.2 Solder paste printing
The process of printing the solder paste requires care because of the fine pitch and
small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The
stencil apertures can be made the same size as the PCB lands in Figure 15.
The type of solder paste recommended for HVQFN packages is “No clean”, Type 3,
due to the difficulty of cleaning flux residues from beneath the package.
Fig 15. PCB footprint for SOT687-1 package (reflow soldering).
0.4 SP (2×)
11.15 OA
(2×)
7.6 Cu
(2×)
10.8 Cu
(2×)
0.9 SP
(10×)
0.5 SP
(4×)
1 SP
(10×)
8.9 Cu
(2×)
1 SP
(8×)
1 SP
(8×)
0.28 Cu (68×)
0.4 SP
0.4 SP
0.6 Cu
4.1
8.63 OA
(4×)
4.1
0.6 Cu
e = 0.5
MGW820
solder lands
Cu pattern
clearance
solder paste
occupied area
0.1
0.2
0.025
Philips Semiconductors
PIP250M
Integrated buck converter
Product data Rev. 02 — 21 February 2003 17 of 19
9397 750 10904
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
16. Revision history
Table 6: Revision history
Rev Date CPCN Description
02 20030221 - Product data (9397 750 10904)
Modifications:
Table 2: Pin description OCSET changed to OCSET/ENABLE
Section 7:
Dual supply operation deleted
Regulated output voltage section added
Overcurrent protection description clarified
Figure 5 revised
Table 5:
Typical value of I
DDC
changed from 20 mA to 24 mA
Efficiency added
Figure 8 added.
01 20021018 - Objective data (9397 750 10579)
9397 750 10904
Philips Semiconductors
PIP250M
Integrated buck converter
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data Rev. 02 — 21 February 2003 18 of 19
9397 750 10904
Philips Semiconductors
PIP250M
Integrated buck converter
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Product data Rev. 02 — 21 February 2003 18 of 19
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Fax: +31 40 27 24825
17. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
18. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
19. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Level Data sheet status
[1]
Product status
[2][3]
Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

PIP250M,518

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC REG BUCK ADJ 15A 68HVQFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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