OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

A7001CMHN1/T1AGCEL

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
A700X_FAM_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product short data sheet
Rev. 3.1 — 5 July 2013
202031 13 of 18
NXP Semiconductors
A700x family
Secure authentication microcontroller
9. Abbreviations
Table 7. Abbreviations
Acronym Description
AES Advanced Encryption Standard
API Application Programming Interface
CBC Cipher-Block Chaining
CRC Cyclic Redundancy Check
DES Digital Encryption Standard
DPA Differential Power Analysis
DSS Digital Signature Standard
ECB Electronic Code Book
ECC Elliptic Curve Cryptography
EEPROM Electrically Erasable Programmable Read-Only Memory
GF Galois Function
I/O Input/Output
MAC Message Authentication Code
MD5 Message-Digest algorithm 5
MMU Memory Management Unit
OS Operating System
PKC Public Key Cryptography
PKI Public Key Infrastructure
RSA Rivest, Shamir and Adleman
SFI Single Fault Injection
SHA Secure Hash Algorithm
SMD Surface Mounted Device
SPA Simple Power Analysis
A700X_FAM_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product short data sheet
Rev. 3.1 — 5 July 2013
202031 14 of 18
NXP Semiconductors
A700x family
Secure authentication microcontroller
10. References
[1] Oracle Java Card 3.0.1 classic:
http://www.oracle.com/technetwork/java/javacard/overview/index.html
[2] Global Platform Consortium: GlobalPlatform Card Specification 2.1.1, March 2003:
http://www.globalplatform.org/
[3] GlobalPlatform Consortium: GlobalPlatform; Card Specification 2.1.1 Amendment A,
March 2004
[4] Java Card Technology for
Smart Cards, Zhiqun Chen, ISBN 0-201-70329-7
[5] SCI
2
C Protocol Specification, Rev. 1.2 — Apr-26-2012, NXP Semiconductors
[6] ISO/IEC International Standard 14443: “Identificat
ion cards - Contactless integrated
circuit(s) cards - Proximity cards - Part 1: Physical characteristics”, 2000
[7] ISO/IEC International Standard 14443: “Identificat
ion cards - Contact less integrated
circuit(s) cards - Proximity cards - Part 2: Radio frequency power and signal
interface”, 2000
[8] ISO/IEC International Standard 14443: “Identificat
ion cards - Contact less integrated
circuit(s) cards - Proximity cards - Part 3: Initialization and anticollision”, 2000
[9] ISO/IEC International Standard 14443: “Identificat
ion cards - Contact less integrated
circuit(s) cards - Proximity cards- Part 4: Transmission protocol”, 2000
[10] ISO/IEC International Standard 7816: “Identification card
s - Integrated circuit(s)
cards with contacts - Part 3: Electrical interface and transmission protocol”, 2006
[11] ISO/IEC International Standard 7816: “Identification card
s - Integrated circuit(s)
cards with contacts - Part 4: Interindustry commands for interchange”, 2005
[12] ISO/IEC International Standard 7816: “Identification card
s - Integrated circuit(s)
cards with contacts - Part 5: Registration of application providers”, 2005
[13] ISO/IEC International Standard 7816: “Identification card
s - Integrated circuit(s)
cards with contacts - Part 8: Security related interindustry commands”, 2004
[14] Application Design Guide A7001, AN195112, NXP Semiconductors
[15] A700x, Secure authentication microcontr
o
ller, Document Number 2066xx
3
, NXP
Semiconductors
[16] User manual JCOP 2.4.2 R1 for A7 family,
JCOP V2.4.2 Revision 1.0 secure
embedded MCU operating system, Document Number 2318xx
3
, NXP
Semiconductors
[17] Admin manual JCOP 2.4.2 R1 for A7 family
, JCOP V2.4.2 Revision 1.0 secure
embedded MCU operating system, Document Number 2319xx
3
, NXP
Semiconductors
[18] Application note, APDU Specification - Authentication Device, Docu
ment Number
2185xx
3
, NXP Semiconductors
3. Where XX refers to the last version; e.g. 10 refers to version 1.0.
A700X_FAM_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product short data sheet
Rev. 3.1 — 5 July 2013
202031 15 of 18
NXP Semiconductors
A700x family
Secure authentication microcontroller
11. Revision history
Table 8. Revision history
Document ID Release date Data sheet status Change notice Supersedes
A700X_FAM_SDS v.3.1 20130705 Product short data sheet - A700X_FAM_SDS v.3.0
Modifications:
• Removed chapter “Pinning Information”.
• Corrected a number of details throughout the data sheet.
A700X_FAM_SDS v.3.0 20130128 Product short data sheet - A700X_FAM_SDS v.2.2
Modifications:
• Document status promoted from Preliminary status to Product status.
• HVSON8 package (SOT685-1, 5 mm 6 mm) removed from Table 3 “Ordering information”
on page 9.
A700X_FAM_SDS v.2.2 20120521 Preliminary short data sheet - A700X_FAM_SDS v.2.1
Modifications:
• Text errors corrected.
A700X_FAM_SDS v.2.1 20120217 Preliminary short data sheet - A700X_FAM_SDS v.2.0
Modifications:
• New product type A7003/4 supporting ISO/IEC 7816 contact interface.
• New product type A7005/6 supporting ISO/IEC 7816 contact interface and ISO/IEC 14443 A
contactless interface.
• New product types upgraded to JCOP 2.4.2 R1 with IO Configuration and Control API
support.
A700X_FAM_SDS v.2.0 20110825 Preliminary short data sheet - A7001AG_SDS v.1.1
Modifications:
• New product type A7002 supporting 40 C to +90 C operational ambient temperature
range.
• Sleep mode current reduced from 50 A (typical) to 40 A (typical).
A7001AG_SDS v.1.1 20110318 Preliminary short data sheet - A7001AG_SDS v.1.0
Modifications:
• Product naming updated.
A7001AG_SDS v.1.0 20110211 Preliminary short data sheet - -
Modifications:
• Initial version.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

A7001CMHN1/T1AGCEL

Mfr. #:
Buy A7001CMHN1/T1AGCEL
Manufacturer:
NXP Semiconductors
Description:
Security ICs / Authentication ICs SecureAuthentication microcontroller
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet