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SMA661ASTR
P1-P3
P4-P6
P7-P9
P10-P12
P13-P14
Package and packing informations
SMA661AS
10/1
4
5
Package and packing informations
5.1 Package
informa
tions
In orde
r to meet e
nvironm
ental require
ments, ST offers th
ese devi
ces in d
ifferent grad
es of
ECOP
ACK
®
packages
, dependi
ng on th
eir level
of environm
ental com
pliance
. ECOP
ACK
®
speci
fication
s, grade
definitio
ns and pr
oduct stat
us are ava
ilable a
t:
www
.s
t.com
.
ECOP
ACK
®
is an
ST tra
demark.
Figure
16.
SOT666 (
Lead-free
) package outline
T
able 6.
SOT
666 (Lead
-free) mech
anical da
t
a
DIM.
mm.
MIN.
TYP
MAX.
A0
.
4
5
0
.
6
0
A3
0.08
018
b0
.
1
7
0
.
2
7
b1
0.27
0.34
D1
.
5
0
1
.
7
0
E1
.
5
0
1
.
7
0
E1
1.10
1.30
e0
.
5
0
L1
0.19
L2
0.10
0.30
L3
0.10
E1
E
L2
D
A
A3
b1
0.10
b
M
e
A
L1
L3
A
SMA661AS
Package and packing informations
11
/
1
4
Figure 17.
Recommended foo
tprint
5.2 Packing
informations
Figure
18.
Reel desc
ription
0.50
0.30
0.99
0.62
2.60
A
D
e1
C
N
W1
measured at hub
W2
measured at hub
W3 measured
at outer edge
TAPE SLOT
INTO CORE FOR
TAPE START
ACCESS HOLE
AT SLOT LOCATION
mm
A
C
D
e1
N
W1
W2
W3
Min
175
12.8
20.2
1.5
59.5
8.4
7.9
T
yp
180
13
60
8.4
9.4
Max
185
13.2
60.5
10
14.4
10.9
Package and packing informations
SMA661AS
12/1
4
Figure 19.
Carrier t
a
pe requirement
s
Figure 20.
Device orient
ation
W
T
K
Bo
Do
P2
Po
P
F
E
D1
USER DIRECTION OF FEED
Ao
Bo
Ko
Min
T
yp
Max
Ao
1.73
1
.78
1.
83
Bo
1.73
1
.78
1.
83
Do
1.5
1.5
1.6
D1
1
E
1.65
1.75
1.85
F
3.45
3.5
3.65
Ko
0.64
0.69
0.73
Po
3.9
4
4
.1
P
3.9
4
4.1
P
2
1
.
9
522
.
0
5
T
0.18
0.2
0.21
W
7.9
8
8.3
Sprocket ho
les
on the ri
ght
Sprocket ho
les
on the left
661
661
661
661
Sprock
et hole
Cavity
P1-P3
P4-P6
P7-P9
P10-P12
P13-P14
SMA661ASTR
Mfr. #:
Buy SMA661ASTR
Manufacturer:
STMicroelectronics
Description:
RF Amplifier Fully integrated GPS LNA IC
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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Union
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SMA661ASTR