Package and packing informations SMA661AS
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5 Package and packing informations
5.1 Package informations
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 16. SOT666 (Lead-free) package outline
Table 6. SOT666 (Lead-free) mechanical data
DIM.
mm.
MIN. TYP MAX.
A0.45 0.60
A3 0.08 018
b0.17 0.27
b1 0.27 0.34
D1.50 1.70
E1.50 1.70
E1 1.10 1.30
e0.50
L1 0.19
L2 0.10 0.30
L3 0.10
E1
E
L2
D
A
A3
b1
0.10
b
M
e
A
L1
L3
A
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Figure 17. Recommended footprint
5.2 Packing informations
Figure 18. Reel description
0.50
0.30
0.99
0.62
2.60
A
D
e1
C
N
W1
measured at hub
W2
measured at hub
W3 measured
at outer edge
TAPE SLOT
INTO CORE FOR
TAPE START
ACCESS HOLE
AT SLOT LOCATION
mm A C D e1 N W1 W2 W3
Min 175 12.8 20.2 1.5 59.5 8.4 7.9
Typ 180 13 60 8.4 9.4
Max 185 13.2 60.5 10 14.4 10.9
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Figure 19. Carrier tape requirements
Figure 20. Device orientation
W
T
K
Bo
Do
P2
Po
P
F
E
D1
USER DIRECTION OF FEED
Ao
Bo
Ko
Min Typ Max
Ao 1.73 1.78 1.83
Bo 1.73 1.78 1.83
Do 1.5 1.5 1.6
D1 1
E 1.65 1.75 1.85
F 3.45 3.5 3.65
Ko 0.64 0.69 0.73
Po 3.9 4 4.1
P 3.9 4 4.1
P21.9522.05
T 0.18 0.2 0.21
W 7.9 8 8.3
Sprocket holes
on the right
Sprocket holes
on the left
661
661 661
661
Sprocket hole
Cavity

SMA661ASTR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
RF Amplifier Fully integrated GPS LNA IC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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