APT35GP120B2DQ2G

050-7630 Rev A 11-2005
APT35GP120B2DQ2(G)
TYPICAL PERFORMANCE CURVES
MAXIMUM RATINGS All Ratings: T
C
= 25°C unless otherwise specified.
STATIC ELECTRICAL CHARACTERISTICS
Characteristic / Test Conditions
Collector-Emitter Breakdown Voltage (V
GE
= 0V, I
C
= 350µA)
Gate Threshold Voltage (V
CE
= V
GE
, I
C
= 1mA, T
j
= 25°C)
Collector-Emitter On Voltage (V
GE
= 15V, I
C
= 35A, T
j
= 25°C)
Collector-Emitter On Voltage (V
GE
= 15V, I
C
= 35A, T
j
= 125°C)
Collector Cut-off Current (V
CE
= 1200V, V
GE
= 0V, T
j
= 25°C)
2
Collector Cut-off Current (V
CE
= 1200V, V
GE
= 0V, T
j
= 125°C)
2
Gate-Emitter Leakage Current (V
GE
= ±20V)
Symbol
V
(BR)CES
V
GE(TH)
V
CE(ON)
I
CES
I
GES
Units
Volts
µA
nA
Symbol
V
CES
V
GE
I
C1
I
C2
I
CM
RBSOA
P
D
T
J
,T
STG
T
L
APT35GP120B2DQ2(G)
1200
±30
96
46
140
140A @ 960V
543
-55 to 150
300
UNIT
Volts
Amps
Watts
°C
Parameter
Collector-Emitter Voltage
Gate-Emitter Voltage
Continuous Collector Current @ T
C
= 25°C
Continuous Collector Current @ T
C
= 110°C
Pulsed Collector Current
1
Reverse Bias Safe Operating Area @ T
J
= 150°C
Total Power Dissipation
Operating and Storage Junction Temperature Range
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
APT Website - http://www.advancedpower.com
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
MIN TYP MAX
1200
3 4.5 6
3.3 3.9
3
350
3000
±100
The POWER MOS 7
®
IGBT is a new generation of high voltage power IGBTs. Using Punch
Through Technology this IGBT is ideal for many high frequency, high voltage switching
applications and has been optimized for high frequency switchmode power supplies.
Low Conduction Loss RBSOA Rated
Low Gate Charge
Ultrafast Tail Current shutoff
POWER MOS 7
®
IGBT
1200V
APT35GP120B2DQ2
APT35GP120B2DQ2G*
*G Denotes RoHS Compliant, Pb Free Terminal Finish.
®
C
E
G
T-Max
®
G
C
E
050-7630 Rev A 11-2005
APT35GP120B2DQ2(G)
THERMAL AND MECHANICAL CHARACTERISTICS
UNIT
°C/W
gm
MIN TYP MAX
.23
.61
5.9
Characteristic
Junction to Case (IGBT)
Junction to Case (DIODE)
Package Weight
Symbol
R
θ
JC
R
θ
JC
W
T
DYNAMIC CHARACTERISTICS
Symbol
C
ies
C
oes
C
res
V
GEP
Q
g
Q
ge
Q
gc
RBSOA
t
d(on)
t
r
t
d(off)
t
f
E
on1
E
on2
E
off
t
d(on)
t
r
t
d(off)
t
f
E
on1
E
on2
E
off
Test Conditions
Capacitance
V
GE
= 0V, V
CE
= 25V
f = 1 MHz
Gate Charge
V
GE
= 15V
V
CE
= 600V
I
C
= 35A
T
J
= 150°C, R
G
= 4.3Ω, V
GE
=
15V, L = 100µH,V
CE
= 960V
Inductive Switching (25°C)
V
CC
= 600V
V
GE
= 15V
I
C
= 35A
R
G
= 4.3
T
J
= +25°C
Inductive Switching (125°C)
V
CC
= 600V
V
GE
= 15V
I
C
= 35A
R
G
= 4.3
T
J
= +125°C
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate-to-Emitter Plateau Voltage
Total Gate Charge
3
Gate-Emitter Charge
Gate-Collector ("Miller ") Charge
Reverse Bias Safe Operating Area
Turn-on Delay Time
Current Rise Time
Turn-off Delay Time
Current Fall Time
Turn-on Switching Energy
4
Turn-on Switching Energy (Diode)
5
Turn-off Switching Energy
6
Turn-on Delay Time
Current Rise Time
Turn-off Delay Time
Current Fall Time
Turn-on Switching Energy
4
4
Turn-on Switching Energy (Diode)
55
Turn-off Switching Energy
6
MIN TYP MAX
3240
250
31
7.5
150
21
60
140
16
20
95
40
750
1305
680
16
20
145
75
750
2130
1745
UNIT
pF
V
nC
A
ns
µJ
ns
µJ
1
Repetitive Rating: Pulse width limited by maximum junction temperature.
2
For Combi devices, I
ces
includes both IGBT and FRED leakages
3
See MIL-STD-750 Method 3471.
4
E
on1
is the clamped inductive turn-on energy of the IGBT only, without the effect of a commutating diode reverse recovery current
adding to the IGBT turn-on loss. Tested in inductive switching test circuit shown in figure 21, but with a Silicon Carbide diode.
5
E
on2
is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching
loss. (See Figures 21, 22.)
6
E
off
is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.)
APT Reserves the right to change, without notice, the specifications and information contained h
050-7630 Rev A 11-2005
APT35GP120B2DQ2(G)
TYPICAL PERFORMANCE CURVES
BV
CES
, COLLECTOR-TO-EMITTER BREAKDOWN V
CE
, COLLECTOR-TO-EMITTER VOLTAGE (V) I
C
, COLLECTOR CURRENT (A) I
C
, COLLECTOR CURRENT (A)
VOLTAGE (NORMALIZED)
I
C,
DC COLLECTOR CURRENT(A) V
CE
, COLLECTOR-TO-EMITTER VOLTAGE (V) V
GE
, GATE-TO-EMITTER VOLTAGE (V) I
C
, COLLECTOR CURRENT (A)
250µs PULSE
TEST<0.5 % DUTY
CYCLE
80
70
60
50
40
30
20
10
0
120
100
80
60
40
20
0
6
5
4
3
2
1
0
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
80
70
60
50
40
30
20
10
0
16
14
12
10
8
6
4
2
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
140
120
100
80
60
40
20
0
T
J
= 125°C
T
J
= 25°C
T
J
= -55°C
T
J
= 25°C.
250µs PULSE TEST
<0.5 % DUTY CYCLE
V
GE
= 15V.
250µs PULSE TEST
<0.5 % DUTY CYCLE
T
J
= 125°C
T
J
= 25°C
T
J
= 125°C
T
J
= 25°C
V
CE
, COLLECTER-TO-EMITTER VOLTAGE (V) V
CE
, COLLECTER-TO-EMITTER VOLTAGE (V)
FIGURE 1, Output Characteristics(T
J
= 25°C) FIGURE 2, Output Characteristics (T
J
= 125°C)
V
GE
, GATE-TO-EMITTER VOLTAGE (V) GATE CHARGE (nC)
FIGURE 3, Transfer Characteristics FIGURE 4, Gate Charge
V
GE
, GATE-TO-EMITTER VOLTAGE (V) T
J
, Junction Temperature (°C)
FIGURE 5, On State Voltage vs Gate-to- Emitter Voltage FIGURE 6, On State Voltage vs Junction Temperature
T
J
, JUNCTION TEMPERATURE (°C) T
C
, CASE TEMPERATURE (°C)
FIGURE 7, Breakdown Voltage vs. Junction Temperature FIGURE 8, DC Collector Current vs Case Temperature
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 1 2 3 4 5
0 1 2 3 4 5 6 7 8 9 10 0 20 40 60 80 100 120 140 160
6 8 10 12 14 16 0 25 50 75 100 125
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 150
I
C
= 35A
T
J
= 25°C
V
CE
= 960V
V
CE
= 600V
V
CE
= 240V
I
C
= 70A
I
C
= 35A
I
C
= 17.5A
I
C
= 70A
I
C
= 35A
I
C
= 17.5A
Lead Temperature
Limited

APT35GP120B2DQ2G

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
IGBT Transistors FG, IGBT-COMBI, 1200V, TO-247 T-MAX, RoHS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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