Narrow pitch connectors P5KF (0.5mm pitch)
–6–
ACCTB23E 201602-T
NOTES
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
3. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
• Socket
Recommended PC board pattern
(TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 56%)
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Opening area ratio: 69%)
• Header
Recommended PC board pattern
(TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 58%)
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Opening area ratio: 72%)
Max. 0.03mm Max. 0.03mm
B±0.05
0.25±0.05
4.00±0.05
6.80±0.05
0.125±0.05
0.30±0.05
0.50±0.05 0.50±0.05
0.23±0.01
0.50±0.01
0.50±0.01
6.80±0.01
5.10±0.01
(0.85) (0.85)
B±0.01
0.50±0.01 0.50±0.01
0.23±0.01
4.70±0.01
6.80±0.01
(1.05)(1.05)
B±0.01
0.125±0.05
0.30±0.05
B±0.05
0.25±0.05
0.50±0.050.50±0.05
1.60±0.05
4.30±0.05
0.23±0.01
0.50±0.01 0.50±0.01
4.30±0.01
(0.85)(0.85)
2.60±0.01
B±0.01
0.50±0.01 0.50±0.01
0.23±0.01
4.30±0.01
(1.05)
2.20±0.01
(1.05)
B±0.01
* See the dimension table on page 4 for more information on the B dimension of the socket and header.
Please refer to the latest product
specifications when designing your
product.