16
LT3028
3028f
PART NUMBER DESCRIPTION COMMENTS
LT1129 700mA, Micropower, LDO V
IN
: 4.2V to 30V, V
OUT(MIN)
=
3.75V, I
Q
=
50µA, I
SD
<
16µA,
DD, SOT-223, S8,TO220, TSSOP20 Packages
LT1175 500mA, Micropower Negative LDO Guaranteed Voltage Tolerance and Line/Load Regulation
V
IN
: –20V to –4.3V, V
OUT(MIN)
=
–3.8V, I
Q
=
45µA, I
SD
<
10µA,
DD,SOT-223, S8 Packages
LT1185 3A, Negative LDO Accurate Programmable Current Limit, Remote Sense
V
IN
: –35V to –4.2V, V
OUT(MIN)
=
–2.40V, I
Q
=
2.5mA, I
SD
< 1µA, TO220-5 Package
LT1761 100mA, Low Noise Micropower, LDO Low Noise < 20µV
RMS,
Stable with 1µF Ceramic Capacitors,
V
IN
: 1.8V to 20V, V
OUT(MIN)
=
1.22V, I
Q
=
20µA, I
SD
< 1µA, ThinSOT Package
LT1762 150mA, Low Noise Micropower, LDO Low Noise < 20µV
RMS,
V
IN
: 1.8V to 20V, V
OUT(MIN)
=
1.22V, I
Q
=
25µA, I
SD
< 1µA, MS8 Package
LT1763 500mA, Low Noise Micropower, LDO Low Noise < 20µV
RMS,
V
IN
: 1.8V to 20V, V
OUT(MIN)
=
1.22V, I
Q
=
30µA, I
SD
< 1µA, S8 Package
LT1764/LT1764A 3A, Low Noise, Fast Transient Response, LDO Low Noise < 40µV
RMS,
"A" Version Stable with Ceramic Capacitors,
V
IN
: 2.7V to 20V, V
OUT(MIN)
=
1.21V, I
Q
=
1mA, I
SD
< 1µA, DD, TO220 Packages
LTC1844 150mA, Very Low Drop-Out LDO Low Noise < 30µV
RMS
, Stable with 1µF Ceramic Capacitors,
V
IN
: 1.6V to 6.5V, V
OUT(MIN)
=
1.25V, I
Q
=
40µA, I
SD
< 1µA, ThinSOT Package
LT1962 300mA, Low Noise Micropower, LDO Low Noise < 20µV
RMS,
V
IN
: 1.8V to 20V, V
OUT(MIN)
=
1.22V, I
Q
=
30µA, I
SD
< 1µA, MS8 Package
LT1963/LT1963A 1.5A, Low Noise, Fast Transient Response, LDO Low Noise < 40µV
RMS,
"A" Version Stable with Ceramic Capacitors,
V
IN
: 2.1V to 20V, V
OUT(MIN)
=
1.21V, I
Q
=
1mA, I
SD
< 1µA,
DD, TO220, SOT-223, S8 Packages
LT1964 200mA, Low Noise Micropower, Negative LDO Low Noise < 30µV
RMS,
Stable with Ceramic Capacitors,
V
IN
: –0.9V to –20V, V
OUT(MIN)
=
–1.21V, I
Q
=
30µA, I
SD
<
3µA, ThinSOT Package
LT3023 Dual 100mA, Low Noise, Micropower LDO Low Noise < 20µV
RMS,
Stable with 1µF Ceramic Capacitors,
V
IN
: 1.8V to 20V, V
OUT(MIN)
=
1.22V, I
Q
=
40µA, I
SD
< 1µA, MS10E, DFN Packages
LT3024 Dual 100mA/500mA, Low Noise, Low Noise < 20µV
RMS,
Stable with 1µF Ceramic Capacitors,
Micropower LDO V
IN
: 1.8V to 20V, V
OUT(MIN)
=
1.22V, I
Q
=
30µA, I
SD
< 1µA, DFN, TSSOP Packages
LT/TP 0904 1K • PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 2004
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
RELATED PARTS
DHC Package
16-Lead Plastic DFN (5mm × 3mm)
(Reference LTC DWG # 05-08-1706)
U
PACKAGE DESCRIPTIO
3.00 ±0.10
(2 SIDES)
5.00 ±0.10
(2 SIDES)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.20
TYP
4.40 ±0.10
(2 SIDES)
18
169
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DHC16) DFN 1103
0.25 ± 0.05
PIN 1
NOTCH
0.50 BSC
4.40 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.20 ±0.05
0.50 BSC
0.65 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
