SUD50P04-08-GE3

SUD50P04-08
www.vishay.com
Vishay Siliconix
S14-2535-Rev. B, 29-Dec-14
1
Document Number: 65594
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
P-Channel 40-V (D-S) MOSFET
Ordering Information:
SUD50P04-08-GE3 (lead (Pb)-free and halogen-free)
FEATURES
TrenchFET
®
power MOSFET
100 % R
g
and UIS tested
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
•Power switch
• Load switch in high current
applications
•DC/DC converters
Notes
a. Duty cycle 1 %.
b. See SOA curve for voltage derating.
c. When mounted on 1" square PCB (FR-4 material).
d. Package limited.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A) Q
g
(TYP.)
-40
0.0081 at V
GS
= -10 V -50
d
60
0.0117 at V
GS
= -4.5 V -48
d
TO-252
Top View
TO
G
D
S
Drain connected to tab
S
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
-40
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
-50
d
A
T
C
= 70 °C -50
d
Pulsed Drain Current I
DM
-100
Avalanche Current I
AS
-46
Single Avalanche Energy
a
L = 0.1 mH E
AS
106 mJ
Maximum Power Dissipation
a
T
C
= 25 °C
P
D
73.5
b
W
T
A
= 25 °C
c
2.5
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to +150 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL LIMIT UNIT
Junction-to-Ambient (PCB Mount)
c
R
thJA
50
°C/W
Junction-to-Case (Drain) R
thJC
1.7
SUD50P04-08
www.vishay.com
Vishay Siliconix
S14-2535-Rev. B, 29-Dec-14
2
Document Number: 65594
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= -250 μA -40 - -
V
Gate Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= -250 μA -1 - -2.5
Gate-Body Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 250 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= -40 V, V
GS
= 0 V - - -1
μAV
DS
= -40 V, V
GS
= 0 V, T
J
= 125 °C - - -50
V
DS
= -40 V, V
GS
= 0 V, T
J
= 150 °C - - -250
On-State Drain Current
a
I
D(on)
V
DS
-10 V, V
GS
= -10 V -50 - - A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= -10 V, I
D
= -22 A - 0.0067 0.0081
V
GS
= -4.5 V, I
D
= -19 A - 0.0097 0.0117
Forward Transconductance
a
g
fs
V
DS
= -15 V, I
D
= -22 A - 45 - S
Dynamic
b
Input Capacitance C
iss
V
GS
= 0 V, V
DS
= -20 V, f = 1 MHz
- 5380 -
pFOutput Capacitance C
oss
- 570 -
Reverse Transfer Capacitance C
rss
- 500 -
Total Gate Charge
c
Q
g
V
DS
= -20 V, V
GS
= -10 V, I
D
= -20 A - 106 159
nC
V
DS
= -20 V, V
GS
= -4.5 V, I
D
= -20 A
-6090
Gate-Source Charge
c
Q
gs
-22-
Gate-Drain Charge
c
Q
gd
-27-
Gate Resistance R
g
f = 1 MHz 0.4 1.8 3.6
Turn-On Delay Time
c
t
d(on)
V
DD
= -20 V, R
L
= 2
I
D
-10 A, V
GEN
= -10 V, R
g
= 1
-1523
ns
Rise Time
c
t
r
-1218
Turn-Off Delay Time
c
t
d(off)
-70105
Fall Time
c
t
f
-1827
Drain-Source Body Diode Ratings and Characteristics (T
C
= 25 °C)
b
Continuous Current I
S
---50
A
Pulsed Current I
SM
---100
Forward Voltage
a
V
SD
I
F
= -10 A, V
GS
= 0 V - -0.8 -1.5 V
Reverse Recovery Time trr
I
F
= -10 A, dI/dt = 100 A/μs
-3553ns
Peak Reverse Recovery Current I
RM(REC)
--2-3A
Reverse Recovery Charge Q
rr
-3350nC
SUD50P04-08
www.vishay.com
Vishay Siliconix
S14-2535-Rev. B, 29-Dec-14
3
Document Number: 65594
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
Transfer Characteristics
Transconductance
On-Resistance vs. Drain Current
On-Resistance vs. Gate-to-Source Voltage
Gate Charge
0
20
40
60
80
100
0.0 0.5 1.0 1.5 2.0 2.5
V
GS
=10Vthru5V
V
GS
=3V
V
GS
=4V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
0
2
4
6
8
10
01234
T
C
= 25 °C
T
C
= 125 °C
T
C
=- 55 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
0
25
50
75
100
01020304050
T
C
= 125 °C
T
C
= - 55 °C
T
C
= 25 °C
- Transconductance (S)g
fs
I
D
- Drain Current (A)
0.003
0.006
0.009
0.012
0.015
0 20406080100
V
GS
=10V
V
GS
=4.5V
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
0.000
0.006
0.012
0.018
0.024
0.030
246810
T
J
=25 °C
T
J
= 150 °C
- On-Resistance (Ω)
R
DS(on)
V
GS
- Gate-to-Source Voltage (V)
0
2
4
6
8
10
0 30 60 90 120
V
DS
=32V
I
D
=20A
V
DS
=20V
V
DS
=10V
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS

SUD50P04-08-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 40V 50A P-CH MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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