FDS8984-F085

FDS8984-F085 N-Channel PowerTrench
®
MOSFET
©2010 Semiconductor Components Industries, LLC.
September-2017, Rev. 1
Publication Order Number:
FDS8984-F085/D
1
FDS8984-F085
N-Channel PowerTrench
®
MOSFET
30V, 7A, 23m
General Description
This N-Channel MOSFET has been design
ed specifically to
improve the overall efficiency of DC/DC converters using
either synchronous or conventional switching PWM
controllers. It has been optimized for low gate charge, low
r
DS(ON)
and fast switching speed.
Features
Max r
DS(on)
= 23m, V
GS
= 10V, I
D
= 7A
Max r
DS(on)
= 30m, V
GS
= 4.5V, I
D
= 6A
Low gate charge
100% R
G
tested
Qualified to AEC Q101
MOSFET Maximum Ratings
T
A
= 25°C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
V
DS
Drain to Source Voltage 30 V
V
GS
Gate to Source Voltage ±20 V
I
D
Drain Current Continuous (Note 1a) 7 A
Pulsed 30 A
E
AS
Single Pulse Avalache Energy (Note 2) 32 mJ
P
D
Power Dissipation for Single Operation 1.6 W
Derate above 25°C 13 mW/°C
T
J
, T
STG
Operating and Storage Temperature -55 to 150 °C
R
θJA
Thermal Resistance, Junction-to-Ambient (Note 1a) 78 °C/W
R
θJC
Thermal Resistance, Junction-to-Case (Note 1) 40 °C/W
Device Marking Device Package Reel Size Tape Width Quantity
FDS8984
FDS8984-F085
SO-8 330mm 12mm 2500 units
3
6
4
7
8
2
5
1
Q2
Q1
S
D
S
S
SO-8
D
D
D
G
D1
D1
D2
D2
S1
G1
S2
G2
Pin 1
SO-8
RoHS Compliant
FDS8984-F085 N-Channel PowerTrench
®
MOSFET
www.onsemi.com
2
Electrical Characteristics T
J
= 25°C unless otherwise noted
Off Characteristics
On Characteristics
(Note 3)
Dynamic Characteristics
Switching Characteristics
(Note 3)
Drain-Source Diode Characteristics
Symbol Parameter Test Conditions Min Typ Max Units
BV
DSS
Drain to Source Breakdown Voltage I
D
= 250µA, V
GS
= 0V 30 V
BV
DSS
T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250µA, referenced to
25°C
23 mV/°C
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 24V
V
GS
= 0V
1
µA
T
J
= 125°C 250
I
GSS
Gate to Source Leakage Current V
GS
= ±20V,V
DS
= 0V ±100 nA
V
GS(th)
Gate to Source Threshold Voltage V
DS
= V
GS
, I
D
= 250µA 1.2 1.7 2.5 V
V
GS(th)
T
J
Gate to Source Threshold Voltage
Temperature Coefficient
I
D
= 250µA, referenced to
25°C
- 4.3 mV/°C
r
DS(on)
Drain to Source On Resistance
V
GS
= 10V, I
D
= 7A 19 23
m
V
GS
= 4.5V, I
D
= 6A 24 30
V
GS
= 10V, I
D
= 7A,
T
J
= 125°C
26 32
C
iss
Input Capacitance
V
DS
= 15V, V
GS
= 0V,
f = 1.0MHz
475 635 pF
C
oss
Output Capacitance 100 135 pF
C
rss
Reverse Transfer Capacitance 65 100 pF
R
G
Gate Resistance f = 1MHz 0.9 1.6
t
d(on)
Turn-On Delay Time
V
DD
= 15V, I
D
= 7A
V
GS
= 10V, R
GS
= 33
510ns
t
r
Rise Time 918ns
t
d(off)
Turn-Off Delay Time 42 68 ns
t
f
Fall Time 21 34 ns
Q
g
Total Gate Charge
V
DS
= 15V, V
GS
= 10V,
I
D
= 7A
9.2 13 nC
Q
g
Total Gate Charge
V
DS
= 15V, V
GS
= 5V,
I
D
= 7A
5.0 7 nC
Q
gs
Gate to Source Gate Charge 1.5 nC
Q
gd
Gate to Drain “Miller” Charge 2.0 nC
V
SD
Source to Drain Diode Voltage
I
SD
= 7A 0.9 1.25 V
I
SD
= 2.1A 0.8 1.0 V
t
rr
Diode Reverse Recovery Time
I
F
= 7A, di/dt = 100A/µs
33 ns
Q
rr
Diode Reverse Recovery Charge 20 nC
Notes:
1: R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while
R
θCA
is determined by the user’s board design.
Scale 1 : 1 on letter size paper
2: Starting T
J
= 25°C, L = 1mH, I
AS
= 8A, V
DD
= 27V, V
GS
= 10V.
3: Pulse Test:Pulse Width <300µs, Duty Cycle <2%.
c) 135°C/W when
mounted on a
minimun pad
b) 125°C/W when
mounted on a 0.02 in
2
pad of oz copper
a) 78°C/W when
mounted on a 0.5in
2
pad
of 2 oz copper
FDS8984-F085 N-Channel PowerTrench
®
MOSFET
Typical Characteristics T
J
= 25°C unless otherwise noted
Figure 1.
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
0
10
20
30
V
GS
=10V
V
GS
=5.0V
V
GS
=4.5V
V
GS
=4.0V
V
GS
=3.5V
V
GS
=3.0V
PULSE DURATION =80µS
DUTY CYCLE =0.5% MAX
I
D
, DRAIN CURRENT (A)
V
DS
, DRAIN-SOURCE VOLTAGE (V)
On Region Characteristics Figure 2.
5 1015202530
0.5
1.0
1.5
2.0
2.5
3.0
PULSE DURATION =80µS
DUTY CYCLE =0.5% MAX
V
GS
=3.5V
V
GS
=4.0V
V
GS
=4.5V
V
GS
=5.0V
V
GS
=10V
V
GS
=3.0V
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
I
D
, DRAIN CURRENT (A)
On-Resistance vs Drain Current and
Gate Voltage
Figure 3.
-80 -40 0 40 80 120 160
0.6
0.8
1.0
1.2
1.4
1.6
I
D
= 7A
V
GS
= 10V
T
J
, JUNCTION TEMPERATURE (
o
C)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
On Resistance vs Temperature Figure 4.
246810
15
20
25
30
35
40
45
50
55
60
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
T
J
= 125
o
C
T
J
= 25
o
C
I
D
= 7A
R
DS(on)
, DRAIN TO
SOURCE ON-RESISTANCE
(mOHM)
V
GS
, GATE TO SOURCE VOLTAGE (V)
On-Resistance vs Gate to Source
Votlage
Figure 5.
1234
0
5
10
15
20
25
30
PULSE DURATION =80µS
DUTY CYCLE =0.5% MAX
T
J
= - 55
O
C
T
J
= 25
O
C
T
J
= 150
O
C
V
DD
= 5V
I
D
, DRAIN CURRENT (A)
V
GS
, GATE TO SOURCE VOLTAGE (V)
Transfer Characteristics Figure 6.
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
1E-3
0.01
0.1
1
10
V
SD
, BODY DIODE FORWARD VOLTAGE (V)
I
S
, REVERSE DRAIN CURRENT (A)
T
J
= -55
o
C
T
J
= 25
o
C
T
J
= 150
o
C
V
GS
= 0V
30
Source to Drain Diode Forward Voltage
vs Source Current
www.onsemi.com
3

FDS8984-F085

Mfr. #:
Manufacturer:
ON Semiconductor / Fairchild
Description:
MOSFET NCH PWR TRNCH MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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