© 2009 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
0409 BU-SB09350 Page 4 of 4 Data Sheet: 4365
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-
tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-
port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Solder Reflow Profile
Temperature
t
t
P
t
s
T
C
-5°C
Time 25°C to Peak
Time
25°C
T
smin
T
smax
T
L
T
P
Preheat
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
a
b
l
e
1
-
S
t
a
n
d
a
r
d
S
n
P
b
S
o
l
d
e
r
(
T
c
)
Volume Volume
Packagemm
3
mm
3
Thickness <350 >
_
350
<2.5mm 235°C 220°C
>
_
2.5mm 220°C 220°C
T
a
b
l
e
2
-
L
e
a
d
(
P
b
)
F
r
e
e
S
o
l
d
e
r
(
T
c
)
Volume Volume Volume
Packagemm
3
mm
3
mm
3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (T
smin
) 100°C 150°C
• Temperature max. (T
smax
) 150°C 200°C
• Time (T
smin
to T
smax
) (t
s
) 60-120 Seconds 60-120 Seconds
verage ramp up rate T
smax
to T
p
3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C 217°C
Time at liquidous (t
L
) 60-150 Seconds 60-150 Seconds
Peak package body temperature (T
P
)* Table 1Table 2
Time (t
p
)** within 5 °C of the specified classification temperature (T
c
) 20 Seconds** 30 Seconds**
verage ramp-down rate (T
p
to T
smax
) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (T
p
) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t
p
) is defined as a supplier minimum and a user maximum.
