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SI8662BC-A-IS1

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36
Rev. 1.3 25
Si8660/61/62/63
4. Pin Descriptions
Name SOIC-16 Pin# Type Description
V
DD1
1 Supply Side 1 power supply.
A1 2 Digital Input Side 1 digital input.
A2 3 Digital Input Side 1 digital input.
A3 4 Digital Input Side 1 digital input.
A4 5 Digital I/O Side 1 digital input or output.
A5 6 Digital I/O Side 1 digital input or output.
A6 7 Digital I/O Side 1 digital input or output.
GND1 8 Ground Side 1 ground.
GND2 9 Ground Side 2 ground.
B6 10 Digital I/O Side 2 digital input or output.
B5 11 Digital I/O Side 2 digital input or output.
B4 12 Digital I/O Side 2 digital input or output.
B3 13 Digital Output Side 2 digital output.
B2 14 Digital Output Side 2 digital output.
B1 15 Digital Output Side 2 digital output.
V
DD2
16 Supply Side 2 power supply.
VDD1
A1
A3
A4
GND1
A2
V
DD2
B2
B1
B4
B3
GND2
I
s
o
l
a
t
i
o
n
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
Si8660
A5
RF
XMITR
RF
RCVR
B5
B6A6
RF
XMITR
RF
RCVR
VDD1
A1
A3
A4
GND1
A2
V
DD2
B2
B1
B4
B3
GND2
I
s
o
l
a
t
i
o
n
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
Si8661
RF
XMITR
RF
RCVR
A5 B5
RF
XMITR
RF
RCVR
B6
A6
RF
XMITR
RF
RCVR
VDD1
A1
A3
A4
GND1
A2
V
DD2
B2
B1
B4
B3
GND2
I
s
o
l
a
t
i
o
n
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
RF
RCVR
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
Si8662
RF
XMITR
RF
RCVR
A5
B5
B6A6
RF
XMITR
RF
RCVR
VDD1
A1
A3
A4
GND1
A2
V
DD2
B2
B1
B4
B3
GND2
I
s
o
l
a
t
i
o
n
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
RF
RCVR
RF
XMITR
RF
RCVR
RF
XMITR
RF
RCVR
Si8663
RF
XMITR
RF
RCVR
A5
B5
B6A6
RF
XMITR
RF
RCVR
26 Rev. 1.3
Si8660/61/62/63
5. Ordering Guide
Revision B devices are recommended for all new designs.
Table 13. Ordering Guide for Valid OPNs
1
Ordering Part
Number (OPN)
Number of
Inputs
VDD1 Side
Number of
Inputs
VDD2 Side
Max Data
Rate
(Mbps)
Default
Output
State
Isolation
rating
(kV)
Temp (°C) Package
Revision B Devices
2,3
Si8660BA-B-IS1 6 0 150 Low 1.0 –40 to 125 °C NB SOIC-16
Si8660BC-B-IS1 6 0 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8660EC-B-IS1 6 0 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8660BD-B-IS 6 0 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8660ED-B-IS 6 0 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8661BC-B-IS1 5 1 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8661EC-B-IS1 5 1 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8661BD-B-IS 5 1 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8661ED-B-IS 5 1 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8662BC-B-IS1 4 2 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8662EC-B-IS1 4 2 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8662BD-B-IS 4 2 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8662ED-B-IS 4 2 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8663BC-B-IS1 3 3 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8663EC-B-IS1 3 3 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8663BD-B-IS 3 3 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8663ED-B-IS 3 3 150 High 5.0 –40 to 125 °C WB SOIC-16
Notes:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard
classifications and peak solder temperatures.
Moisture sensitivity level is MSL3 for wide-body SOIC-16 packages.
Moisture sensitivity level is MSL2A for narrow-body SOIC-16 packages.
2. Revision A devices are supported for existing designs, but Revision B is recommended for all new designs.
3. All devices >1 kV
RMS
are AEC-Q100 qualified.
Rev. 1.3 27
Si8660/61/62/63
Revision A Devices
2,3
Si8660BA-A-IS1 6 0 150 Low 1.0 –40 to 125 °C NB SOIC-16
Si8660BC-A-IS1 6 0 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8660EC-A-IS1 6 0 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8660BD-A-IS 6 0 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8660ED-A-IS 6 0 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8661BC-A-IS1 5 1 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8661EC-A-IS1 5 1 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8661BD-A-IS 5 1 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8661ED-A-IS 5 1 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8662BC-A-IS1 4 2 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8662EC-A-IS1 4 2 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8662BD-A-IS 4 2 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8662ED-A-IS 4 2 150 High 5.0 –40 to 125 °C WB SOIC-16
Si8663BC-A-IS1 3 3 150 Low 3.75 –40 to 125 °C NB SOIC-16
Si8663EC-A-IS1 3 3 150 High 3.75 –40 to 125 °C NB SOIC-16
Si8663BD-A-IS 3 3 150 Low 5.0 –40 to 125 °C WB SOIC-16
Si8663ED-A-IS 3 3 150 High 5.0 –40 to 125 °C WB SOIC-16
Table 13. Ordering Guide for Valid OPNs
1
(Continued)
Ordering Part
Number (OPN)
Number of
Inputs
VDD1 Side
Number of
Inputs
VDD2 Side
Max Data
Rate
(Mbps)
Default
Output
State
Isolation
rating
(kV)
Temp (°C) Package
Notes:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard
classifications and peak solder temperatures.
Moisture sensitivity level is MSL3 for wide-body SOIC-16 packages.
Moisture sensitivity level is MSL2A for narrow-body SOIC-16 packages.
2. Revision A devices are supported for existing designs, but Revision B is recommended for all new designs.
3. All devices >1 kV
RMS
are AEC-Q100 qualified.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36

SI8662BC-A-IS1

Mfr. #:
Buy SI8662BC-A-IS1
Manufacturer:
Silicon Labs
Description:
Digital Isolators
Lifecycle:
New from this manufacturer.
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