SFC3233-02
No.
KYOCERA CORPORATION
2
12/12
13-6. Recommendable rework condition
1) Following status is recommended for the rework.
○Reflow solder
Please reflow by the recommended reflow profile
○Heat gun (Spot heater)
Pre-heating : 150deg.C +/- 10deg.C min 60sec
Hot air : 280deg.C +/- 10deg.C max 30 sec
2) The chip might break from the mechanical stress if there are too much solder on the land pattern.
Please design the land pattern area and solder volume within the recommended status.
3) Please mount this product by reflow. Characteristic degradation or damaging the product might
occur when rapid temperature change happens by short pre-heating.
Please inform the department in charge if there are plans to use this product far from the
condition described above.
4) The heating limit time when using heat gun repeatedly, will be the sum total time.
13-7. Recommended washing conditions
1) While washing the board after soldering, following conditions are recommended.
Avoid using Fluorocarbon and Trichloroethane from the environmental protection.
Washing medicine Kao.CO. Clean through 750H
Isopropyl alcohol、
ethyl alcohol
Washing condition medicine wash 60 deg.C, 90 sec
pure water wash 60 deg.C, 90 sec
drying 80 deg.C, 30 min
2) Washing after reflow might cause product degradation from rapid temperature change.
Please make sure the products are fully cooled to the room temperature.
3) Supersonic may cause characteristic degradation. Avoid supersonic wash.
4) Please dry the product within 60 minute after washing.
5) Please test and estimate the quality by actual product board before washing.
13-8. General information
If we stop the production of this product, we will let you know in writing a part number, the lifecycle
reason, the discontinued time and the supply period for discontinued after six months ago as a
general rule.
13-9. Warning about approval sheet
1) Test with actual product board before using.
2) Do not use without any depart from this specification sheet.
