EL7562CUZ-T13

7
Block Diagram
Applications Information
Circuit Description
General
The EL7562 is a fixed frequency, current mode controlled
DC-DC converter with integrated N-channel power
MOSFETs and a high precision reference. The device
incorporates all the active circuitry required to implement a
cost effective, user-programmable 2A synchronous step-
down regulator suitable for use in DSP core power supplies.
Theory of Operation
The EL7562 is composed of 5 major blocks:
1. PWM Controller
2. NMOS Power FETs and Drive Circuitry
3. Bandgap Reference
4. Oscillator
5. Thermal Shut-down
PWM Controller
The EL7562 regulates output voltage through the use of
current-mode controlled pulse width modulation. The three
main elements in a PWM controller are the feedback loop
and reference, a pulse width modulator whose duty cycle is
controlled by the feedback error signal, and a filter which
averages the logic level modulator output. In a step-down
(buck) converter, the feedback loop forces the time-
averaged output of the modulator to equal the desired output
voltage. Unlike pure voltage-mode control systems, current-
mode control utilizes dual feedback loops to provide both
output voltage and inductor current information to the
controller. The voltage loop minimizes DC and transient
errors in the output voltage by adjusting the PWM duty-cycle
in response to changes in line or load conditions. Since the
output voltage is equal to the time-averaged of the modulator
output, the relatively large LC time constant found in power
supply applications generally results in low bandwidth and
poor transient response. By directly monitoring changes in
inductor current via a series sense resistor the controller's
response time is not entirely limited by the output LC filter
and can react more quickly to changes in line and load
conditions. This feed-forward characteristic also simplifies
AC loop compensation since it adds a zero to the overall
loop response. Through proper selection of the current-
feedback to voltage-feedback ratio the overall loop response
will approach a one-pole system. The resulting system offers
several advantages over traditional voltage control systems,
including simpler loop compensation, pulse by pulse current
limiting, rapid response to line variation and good load step
response.
Drivers
PWM
Controlle
Current
Sense
Junction
Temperature
Voltage
Reference
Oscillator
0.1µF
39Ω
Controller
Supply
SGND
Power
Power
FET
FET
270pF0.1µF
0.1µF
4.7µH
V
OUT
2370Ω
1kΩ
100µF
VREF COSC
VHI
VIN
PGND
VDD
VDRV
FB
EN
5V
8
The heart of the controller is an input direct summing
comparator which sum voltage feedback, current feedback,
slope compensation ramp and power tracking signals
together. Slope compensation is required to prevent system
instability that occurs in current-mode topologies operating
at duty-cycles greater than 50% and is also used to define
the open-loop gain of the overall system. The slope
compensation is fixed internally and optimized for 500mA
inductor ripple current. The power tracking will not contribute
any input to the comparator steady-state operation. Current
feedback is measured by the patented sensing scheme that
senses the inductor current flowing through the high-side
switch whenever it is conducting. At the beginning of each
oscillator period the high-side NMOS switch is turned on.
The comparator inputs are gated off for a minimum period of
time of about 150ns (LEB) after the high-side switch is
turned on to allow the system to settle. The Leading Edge
Blanking (LEB) period prevents the detection of erroneous
voltages at the comparator inputs due to switching noise. If
the inductor current exceeds the maximum current limit
(I
LMAX
) a secondary over-current comparator will terminate
the high-side switch on time. If I
LMAX
has not been reached,
the feedback voltage FB derived from the regulator output
voltage V
OUT
is then compared to the internal feedback
reference voltage. The resultant error voltage is summed
with the current feedback and slope compensation ramp.
The high-side switch remains on until all four comparator
inputs have summed to zero, at which time the high-side
switch is turned off and the low-side switch is turned on.
However, the maximum on-duty ratio of the high-side switch
is limited to 95%. In order to eliminate cross-conduction of
the high-side and low-side switches a 15ns break-before-
make delay is incorporated in the switch drive circuitry. The
output enable (EN) input allows the regulator output to be
disabled by an external logic control signal.
Output Voltage Setting
In general:
However, due to the relatively low open loop gain of the
system, gain errors will occur as the output voltage and loop-
gain is changed. This is shown in the performance curves. A
100nA pull-up current from FB to V
DD
forces V
OUT
to GND
in the event that FB is floating.
NMOS Power FETs and Drive Circuitry
The EL7562 integrates low on-resistance (60mΩ) NMOS
FETs to achieve high efficiency at 2A. In order to use an
NMOS switch for the high-side drive it is necessary to drive
the gate voltage above the source voltage (LX). This is
accomplished by bootstrapping the V
HI
pin above the LX
voltage with an external capacitor C
VHI
and internal switch
and diode. When the low-side switch is turned on and the LX
voltage is close to GND potential, capacitor C
VHI
is charged
through internal switch to V
DRV
, typically 5V. At the
beginning of the next cycle the high-side switch turns on and
the LX pins begin to rise from GND to V
IN
potential. As the
LX pin rises the positive plate of capacitor C
VHI
follows and
eventually reaches a value of V
DRV
+V
IN
, typically 10V, for
V
DRV
=V
IN
=5V. This voltage is then level shifted and used to
drive the gate of the high-side FET, via the V
HI
pin. A value
of 0.1µF for C
VHI
is recommended.
Reference
A 1.5% temperature compensated bandgap reference is
integrated in the EL7562. The external V
REF
capacitor acts
as the dominant pole of the amplifier and can be increased
in size to maximize transient noise rejection. A value of
0.1µF is recommended.
Oscillator
The system clock is generated by an internal relaxation
oscillator with a maximum duty-cycle of approximately 95%.
Operating frequency can be adjusted through the C
OSC
pin
or can be driven by an external source. If the oscillator is
driven by an external source care must be taken in selecting
the ramp amplitude. Since C
SLOPE
value is derived from the
C
OSC
ramp, changes to C
OSC
ramp will change the
C
SLOPE
compensation ramp which determine the open-loop
gain of the system.
When external synchronization is required, always choose
C
OSC
such that the free-running frequency is at least 20%
lower than that of sync source to accommodate component
and temperature variations. Figure 1 shows a typical
connection.
V
OUT
0.985 1
R
2
R
1
-------+
⎝⎠
⎜⎟
⎛⎞
×=
For V
IN
= 5V
V
OUT
0.975 1
R
2
R
1
-------+
⎝⎠
⎜⎟
⎛⎞
×=
FOR V
IN
= 3.3V
FIGURE 1. OSCILLATOR SYNCHRONIZATION
2
3
11
10
9
6
7
8
15
14
EL7562
1
16
External
Oscillato
BAT54100p
9
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Thermal Shut-down
An internal temperature sensor continuously monitors die
temperature. In the event that die temperature exceeds the
thermal trip-point, the system is in fault state and will be shut
down. The upper and low trip-points are set to 135°C and
115°C respectively.
Start-up Delay
A capacitor can be added to the EN pin to delay the
converter start-up (Figure 2) by utilizing the pull-up current.
The delay time is approximately:
Layout Considerations
The layout is very important for the converter to function
properly. Power Ground ( ) and Signal Ground (---)
should be separated to ensure that the high pulse current in
the Power Ground never interferes with the sensitive signals
connected to Signal Ground. They should only be connected
at one point (normally at the negative side of either the input
or output capacitor).
The trace connected to pin 14 (FB) is the most sensitive
trace. It needs to be as short as possible and in a “quiet”
place, preferably between PGND or SGND traces.
In addition, the bypass capacitor connected to the V
DD
pin
needs to be as close to the pin as possible.
The heat of the chip is mainly dissipated through the PGND
pins. Maximizing the copper area around these pins is
preferable. In addition, a solid ground plane is always helpful
for the EMI performance.
The demo board is a good example of layout based on these
principles. Please refer to the EL7562 Application Brief for
the layout.
t
d
ms()1200 C μF()×=
FIGURE 2. START-UP DELAY
TIME
V
O
V
IN
t
d
V
OU
C
2
3
1
1
9
6
7
8
1
1
EL7562
1 1

EL7562CUZ-T13

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Voltage Regulators 2A DC-DC CNVRTR
Lifecycle:
New from this manufacturer.
Delivery:
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