PRODUCTION D
A
TA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
Copyright © 2000
Rev. 1.0, 2005-08-10
WWW.Microsemi .COM
LX1672
Multiple Output LoadSHARE™ PWM
TM
®
DESCRIPTION
The LX1672 is a highly integrated
power supply controller IC featuring
two PWM switching regulator stages
with an additional onboard linear
regulator driver.
The two constant frequency voltage-
mode PWM phases can be easily
configured as a single Bi-Phase high
current output, two independently
regulated outputs, or as a DDR memory
I/O supply with a tracking DDR
termination voltage supply. Power loss
and noise, due to the ESR of the input
capacitors, are minimized by operating
each PWM output 180° out of phase.
This architecture also minimizes
capacitor requirements while
maximizing regulator response.
In bi-phase operation, the high
current output utilizes a patented current
sharing architecture, called Forced
Current Sharing
, to allow accurate
current sharing without the use of
expensive current sense resistors.
This patented approach also gives
system designers maximum flexibility with
respect to MOSFET supply. Each phase
can utilize different supply voltages, for
efficient use of available supplies, while
programming the ratio of current pulled
from each using one of three methods (see
application section).
The LX1672 incorporates fully
programmable soft-start sequencing
capabilities. Each output can be
configured to come up in any order
necessary as required by the application.
The LX1672 features an additional
Linear Regulator Driver output, which
when coupled with an inexpensive
MOSFET is capable of supplying up to 5A
for I/O, memory, and other supplies
surrounding today’s micro-processor
designs.
Each regulator voltage output is
programmed via a simple voltage-divider
network. The LX1672, utilizing MOSFET
RDS(ON) impedance, monitors maximum
current limit conditions, in each PWM
phase without the use of expensive current
sense resistors.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
U.S
Patents: 6,285,571,6,292,378
KEY FEATURES
Up to Three Independently
Regulated Outputs
DDR Termination Compliant
Bi-phase Current Sharing
Outputs As Low As 0.8V
Generated From An Internal 1%
Reference
Multiphase High Current Output
Reduces Required Capacitance
Integrated High Current MOSFET
Drivers
300KHz, 500KHz and 600KHz
High Frequency Operation
Minimizes External Component
Requirements
Independent Phase Programmable
Soft-Start and Power Sequencing
Adjustable Linear Regulator Driver
Output
No current-sense resistors
APPLICATIONS/BENEFITS
Multi-Output Power Supplies
Video Card Power Supplies
DDR, VDDQ and Termination
Supply
PC Peripherals
Portable PC Processor and I/O
Supply
PRODUCT HIGHLIGHT
Memory Bus
....
DDR Termination
Memory Core
12V
3.3V
I/O
Graphics
Controller
DDR MemoryLX1672
Refer to Typical
Application for
complete circuit.
5V
PACKAGE ORDER INFO
PW
Plastic TSSOP
28-Pin
LQ
Plastic MLPQ
38-Pin T
A
(°C)
Switching
Frequency (kHz)
RoHS Compliant / Pb-free Transition DC: 0518 RoHS Compliant / Pb-free Transition DC: 0512
0 to 70 300
LX1672-03CPW LX1672-03CLQ
0 to 70 500
LX1672-05CPW
0 to 70 600
LX1672-06CLQ
NOTE: Available in Tape & Reel. Append the letters “TR” to the part number (i.e. LX1672-06CLQ-TR)
L
L
X
X
1
1
6
6
7
7
2
2
PRODUCTION D
A
TA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright © 2000
Rev. 1.0, 2005-08-10
WWW.Microsemi .COM
LX1672
Multiple Output LoadSHARE™ PWM
TM
®
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (V
CC
) DC.................................................................-0.3V to 5.5V
Driver Supply Voltage (V
Cx
, V
CCL
) DC ............................................-0.3V to 12V
Current Sense Inputs (V
SX
, C
SX
) ....................................................... -0.3V to 12V
Error Amplifier Inputs (FB
X
, RF
2
, LDFB)........................................-0.3V to 5.5V
Input Voltage (SS / Enable, LDDIS) .................................................-0.3V to5.5V
Output Drive Peak Current Source (HO
x, LOx)....................................1A (500ns)
Output Drive Peak Current Sink (HO
x, LOx) .......................................1A (500ns)
Operating Junction Temperature.................................................................. 150°C
Storage Temperature Range...........................................................-65°C to 150°C
Peak Package Solder Reflow Temp.(40 second max. exposure) .... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of specified
terminal.
x= Denote Phases 1 & 2
THERMAL DATA
PW
Plastic TSSOP 28-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ
JA
85°C/W
LQ
Plastic MLPQ 38-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ
JA
35°C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x θ
JC
).
The θ
JA
numbers are guidelines for the thermal performance of the device/pc-
b
oard system.
All of the above assume no ambient airflow.
PACKAGE PIN OUT
HO2
2
3
4
5
6
7
8
9
10
11
12
13
14
1
27
26
25
24
23
22
21
20
19
18
17
16
15
28
LO2
PG2
LDGD
LDFB
LDDIS
DGND
AGND
DIS2
SS2
RF2
FB2
EO2
CS2
VC2
VC1
HO1
LO1
PG1
VCCL
VCC
VS1
CS1
EO1
FB1
SS1
DIS1
VS2
PW PACKAGE
(Top View)
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
SS2
RF2
FB2
EO2
N.C.
N.C.
N.C.
N.C.
DIS1
DIS2
VCC
VCCL
N.C.
N.C.
N.C
.
VC1
HO1
LO1
PG1
LO2
CS2
VS2
SS1
FB1
EO1
CS1
VS1
RSVD
N.C.
1
2
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18 19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
343536
3738
Connect Bottom to
Power GND
PWGD
N.C.
(N.C. – No Internal Connection
N/U – Not Used)
RoHS / Pb-free 100% Matte Tin Lead Finish
P
P
A
A
C
C
K
K
A
A
G
G
E
E
D
D
A
A
T
T
A
A
PRODUCTION D
A
TA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
Copyright © 2000
Rev. 1.0, 2005-08-10
WWW.Microsemi .COM
LX1672
Multiple Output LoadSHARE™ PWM
TM
®
FUNCTIONAL PIN DESCRIPTION
NAME DESCRIPTION
FB1
Bi-Phase Operation: Phase 1 and 2 Voltage Feedback
Single Phase Operation: Phase 1 Voltage Feedback – connected to the output through a resistor network to
set desired output voltage of Phase 1
EOX Error Amplifier Output – Sets external compensation for the corresponding phase denoted by “X”.
FB2
Bi-phase Operation: Load Sharing Voltage Sense Feedback – Connect filtered phase 2 switching output (pre-
inductor) to FB
2
to ensure proper current sharing between phase 1 and phase 2.
Single Phase Operation: Phase 2 Voltage Feedback – connected to the output through a resistor network (post
inductor) to set desired output voltage of Phase 2.
RF2
Bi-Phase Operation: Load Sharing Voltage Sense Feedback Reference – Sets reference for current sharing
control loop. Connecting filtered phase 1 switching output (pre-inductor) to REF
2
forces average current in
phase 2 to be equal to phase 1.
Single Phase Operation: Phase 2 Voltage Reference – connected to SS2 pin as reference.
VCC IC supply voltage (nominal 5V).
VCCL Power supply pin for all Low side drivers.
LDFB Low Dropout Regulator Voltage Feedback – Sets output voltage of external MOSFET via resistor network.
CSX
Over-Current Limit Set – Connecting a resistor between CS pin and the source of the high-side MOSFET sets the
current-limit threshold for the corresponding phase denoted by “X”. Exceeding the current-limit threshold forces
the corresponding phase into hiccup mode protection. A minimum of 1KΩ must be in series with this input.
SSX
Soft-start/Hiccup Capacitor Pin – During start-up, the voltage on this pin controls the output voltage of its
respective regulator. An internal 20kΩ resistor and the external capacitor set the time constant for soft-start
function. The Soft-start function does not initialize until the supply voltage exceeds the UVLO threshold. When
an over-current condition occurs, this capacitor is used for the timing of hiccup mode protection.
AGND Analog ground reference.
DGND Digital ground reference.
LDGD
Low Dropout Regulator Gate Drive – Connects to gate of external N-Channel MOSFET for linear regulator
function.
PGX
Driver Power Ground. Connects to the source of the bottom N-channel MOSFETS of phase 1 where X=1, and
phase 2 where X=2 for the TSSOP. The MLPQ package has a common PG output .
HOX High Side MOSFET Gate Driver – “X” denotes corresponding phase.
LOX Low Side MOSFET Gate Driver – “X” denotes corresponding phase.
VCX
Phase High-Side MOSFET Gate Driver Supply – Connect to separate supply or boot strap supply to ensure
proper high-side gate driver supply voltage. “X” denotes corresponding phase. If the phase is not used connect to
VCC.
LDDIS
LDO Disable input. High disables the LDO output. This pin has a 100KΩ nominal pull down resistor
VSX
Voltage reference for Current sense. This is also the supply pin for the Current Sense Comparator.
“X” denotes corresponding phase. This pin cannot be left floating, if the phase is not used connect to VCC
DISX
PWM Disable Input – High disables the PWM output. This pin has a nominal 80KΩ pull down resistor. “X”
denotes corresponding phase.
PWGD
Open drain output , high at end of Soft Start and no Fault. Pulls low if any Fault condition occurs.
This output is present on the MLP package only.
P
P
A
A
C
C
K
K
A
A
G
G
E
E
D
D
A
A
T
T
A
A

LX1672-03CLQ

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Switching Controllers
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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