PRODUCTION D
A
TA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 16
Copyright © 2000
Rev. 1.0, 2005-08-10
WWW.Microsemi .COM
LX1672
Multiple Output LoadSHARE™ PWM
TM
®
APPLICATION NOTE (CONTINUED)
INPUT CAPACITOR
The input capacitor and the input inductor, if used, are to filter
the pulsating current generated by the buck converter to reduce
interference to other circuits connected to the same 5V rail. In
addition, the input capacitor provides local de-coupling for the
buck converter. The capacitor should be rated to handle the RMS
current requirements. The RMS current is:
d)d(1II
LRMS
=
Where I
L
is the inductor current and d is the duty cycle. The
maximum value occurs when d = 50%, then I
RMS
=0.5I
L
. For 5V
input and output in the range of 2 to 3V, the required RMS
current is very close to 0.5I
L
.
SOFT-START CAPACITOR
The value of the soft-start capacitor determines how fast the
output voltage rises and how large the inductor current is required
to charge the output capacitor. The output voltage will follow the
voltage at the SS pin if the required inductor current does not
exceed the maximum allowable current for the inductor. The SS
pin voltage can be expressed as:
(
)
SSSS
SS
Ct/R
e1VV
= ref
Where R
SS
and C
SS
are the soft-start resistor and capacitor.
The current required to charge the output capacitor during the soft
start interval is.
dt
dVss
CoutIout =
Taking the derivative with respect to time results in
SSSS
Ct/R
e
RssCss
VrefCout
Iout
=
and at t=0
RssCss
VrefCout
axIm =
The required inductor current for the output capacitor to follow
the soft start voltage equals the required capacitor current plus the
load current. The soft-start capacitor should be selected to
provide the desired power on sequencing and insure that the
overall inductor current does not exceed its maximum allowable
rating.
Values of Css equal to .1µF or greater are unlikely to result in
saturation of the output inductor unless very large output capacitors
are used..
OVER-CURRENT PROTECTION
Current limiting occurs at current level I
CL
when the voltage
detected by the current sense comparator is greater than the current
sense comparator threshold, V
TRIP
(300mV).
TRIPSETSETDS(ON)CL
VRIRI =×+×
So,
µA50
RImV003
I
RIV
R
DS(ON)CL
SET
DS(ON)CLTRIP
SET
×
=
×
=
Example:
For 10A current limit, using FDS6670A MOSFET (10mΩ
R
DS(ON)
):
K4
1050
100.01030.
R
6
SET
=
×
×
=
Note: Maximum R
SET
is 6KΩ. Any resistor 6KΩ or greater will not
allow startup since I
CL
will equal zero (50µA x 6KΩ = 300mV).
At higher PWM frequencies or low duty cycles, where the upper
gate drive is less than 350nS wide, the 350nS delay for current
limit enable may result in current pulses exceeding the desired
current limit set point. If the upper MOSFET on time is less than
350nS and a short circuit condition occurs the duty cycle will
increase, since V
OUT
will be low. The current limit circuit will be
enabled when the upper gate drive exceeds 350nS although the
actual peak current limit value will be higher than calculated with
the above equation.
Short circuit protection still exists due to the narrow pulse width
even though the magnitude of the current pulses will be higher than
the calculated value.
If OCP is not desired connect both VSX and VCX to VCC. Do not
leave them floating.
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PRODUCTION D
A
TA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 17
Copyright © 2000
Rev. 1.0, 2005-08-10
WWW.Microsemi .COM
LX1672
Multiple Output LoadSHARE™ PWM
TM
®
APPLICATION NOTE (CONTINUED)
O
UTPUT DISABLE
The LX1672 PWM MOSFET driver outputs are shut off by
pulling the disable (DIS
X) pins above 1.2V.
The LDO voltage regulator has its own Disable pin (LDDIS)
for control of this output voltage. Pulling this pin above 3V
disables the LDO.
PROGRAMMING THE OUTPUT VOLTAGE
The output Voltage is sensed by the feedback pin (FB
X
) which
is compared to a 0.8V reference. The output voltage can be set to
any voltage above 0.8V (and lower than the input voltage) by
means of a resistor divider R1 - R2 (see Figure 1).
)/RR(1VV
21REFOUT
+=
Note: Keep R
1
and R
2
close to 1kΩ (order of magnitude)
DDR V
TT
TERMINATION VOLTAGE
Double Data Rate (DDR) SDRAM requires a termination
voltage (V
TT
)
in addition to the line driver supply voltage
(VDDQ) and receiver supply voltage (VDD). Although it is not a
requirement VDD is generally equal to VDDQ; so that only V
TT
and VDDQ are required..
The LX1672 can supply both voltages by using two of the three
PWM phases. Since the currents for V
TT
and (VDD plus VDDQ)
are quite often several amps, (2A to 6A is common) a switching
regulator is a logical choice
V
TT
for DDR memory can be generated with the LX1672 by
using the positive input of the phase 2 error amplifier RF2 as a
reference input from an external reference voltage V
REF
which is
defined as one half of VDDQ. Using V
REF
as the reference input
will insure that all voltages are correct and track each other as
specified in the JEDEC (EIA/JESD8-9A) specification. The phase
2 output will then be equal to V
REF
and track the VDDQ supply as
required.
When an external reference is used the Soft Start will not be
functional for that phase.
See Microsemi Application Note 17 for more details.
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PRODUCTION D
A
TA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 18
Copyright © 2000
Rev. 1.0, 2005-08-10
WWW.Microsemi .COM
LX1672
Multiple Output LoadSHARE™ PWM
TM
®
APPLICATION NOTE CONSIDERATIONS
1. The power N-MOSFET transistor’s total gate charge spec,
(Qg) should not exceed 40Nc when VCx = +12V. This
condition will guarantee operation over the specified ambient
temperature range. The Qg value of the N-MOSFET is
directly related to the amount of power dissipation inside the
IC package, from the two sets of MOSFET drivers. The
equation relating Qg to the power dissipation of a MOSFET
driver is: Pd = f * Qg * Vd . f = 300KHs and Vd is the
supply voltage for the MOSFET driver. The two bottom
MOSFET drivers are powered by the VCCL pin that is
connected to +5V. The upper MOSFET drivers can be
connected to the +12V supply or to a bootstrap supply
generated by its output bridge. The bootstrap supply will be at
+17V. Depending on the thermal environment of the
application circuit, the Qg value of the N-MOSFETs will have
to be less than the 40nC value. A typical configuration of the
input voltage rails to generate the output voltages required is
having the 5volt supply on phase 1 and the 3.3 volt supply on
phase 2. At the max Qg value, the two bottom MOSFET
drivers will dissipate 60mw each. The upper MOSFET drivers
for phases 1 and 2 operate off of +12volts. Their dissipation
is 144mw each. The total power dissipation for gate drive is
408 mw. Icc x Vcc =15ma x 5 V= 75mW. Total package
power dissipation = 483mW. Using the thermal equation of:
T
J
= T
A
+ Pd * Oja, the Junction temperature for this IC
package is = 23 + .483 * 85 which = 64°C. This means that
the ambient temperature rise has to be less than 86°C.
2.
The Soft-Start reference input has a 300mv threshold, above
which the PWM starts to operate. The internal operating
reference level is set at 800mV. This means that the output
voltage is 37.5% low when the PWM becomes active. This
starts each phase up in the current limit mode without Hiccup
operation. If more than one phase is using the 5volt rail for
conversion, then their soft-start capacitor values should be
changed so that the two phases do not start up together. This
will help reduce the amount of 5 volt input capacitance
required. Also the VCC pin and the VCCL pin should be kept
separated and should be decoupled separately. This will
prevent the VCC pin from drooping back below the UVLO set
point during start up.
3.
If a phase is not used connect VSX and VCX pins to VCC.
Do not leave them floating. A floating VS
X pin will result in
operation resembling a hiccup condition.
4.
When phases 1 and 2 are used in the Bi-phase mode to current
share into the same output load, the phase 2 current is forced to
follow the phase 1 current. It is important to use a larger soft-
start capacitor on phase 2 than phase 1 so that the phase 1
current becomes active before phase 2 becomes active. This will
minimize any start up transient. It is also important to disable
phase 1 and 2 at the same time. Disabling phase 1 without
disabling phase 2, in the Bi-phase mode, allows phase 2 to turn
on and off randomly because it has lost its reference.
5.
The minimum R
SET
resistor value is 1k ohm for the current
limit sensing. If this resistor becomes shorted, it will do
permanent damage to the IC.
6.
A resistor has been put in series with the gate of the LDO pass
transistor to reduce the output noise level. The resistor value
can be changed to optimize the output transient response versus
output noise.
7.
The LDO controller inside the IC uses the voltage at VC1 as
the drive voltage. Due to noise considerations ideally the
voltage on the VC1 pin would be a fixed +12volt supply. When
VC1 is connected to a bootstrap supply the LDO output will
reflect significant switching noise without filtering.
8.
To delay the turn on of the LDO controller output, a capacitor
should be connected between the LDDIS pin and the +5volts.
The LDDIS input has a 100K pull down resistor, which keeps
the LDO active until this pin is pulled high. During the power
up sequence the capacitor connected to the LDDIS pin will keep
the LDO off until this capacitor, being charge by the 100K pull
down resistor, goes through the low input threshold level.
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LX1672-03CLQ

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Switching Controllers
Lifecycle:
New from this manufacturer.
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