ADG611/ADG612/ADG613
Rev. A | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted
Table 4.
Parameter Rating
V
DD
to V
SS
13 V
V
DD
to GND −0.3 V to +6.5 V
V
SS
to GND +0.3 V to −6.5 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V
Digital Inputs
1
GND − 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D
20 mA (pulsed at 1 ms, 10%
duty cycle maximum)
Continuous Current, S or D 10 mA
3 V operation 85°C to 125°C 7.5 mA
Operating Temperature Range
Automotive (Y Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
θ
JA
Thermal Impedance
16-Lead TSSOP 150.4°C/W
16-Lead SOIC, 4-Layer Board 80.6°C/W
Lead Soldering
Lead Temperature, Soldering
(10 sec)
300°C
IR Reflow, Peak Temperature
(<20 sec)
220°C
(Pb-Free) Soldering
Reflow, Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 20 sec to 40 sec
1
Overvoltages at IN, S, or D are clamped by internal diodes. The current
should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
ESD CAUTION