SI4630DY-T1-E3

Vishay Siliconix
Si4630DY
Document Number: 73685
S09-0138-Rev. C, 02-Feb-09
www.vishay.com
1
N-Channel 25-V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ)
25
0.0027 at V
GS
= 10 V 36
49 nC
0.0032 at V
GS
= 4.5 V 29
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 80 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
25
V
Gate-Source Voltage
V
GS
± 16
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
40
A
T
C
= 70 °C 32
T
A
= 25 °C
27
b, c
T
A
= 70 °C
21
b, c
Pulsed Drain Current
I
DM
70
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
7.0
T
A
= 25 °C
3.0
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
30
Avalanche Energy
E
AS
45
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
7.8
W
T
C
= 70 °C 5.0
T
A
= 25 °C
3.5
b, c
T
A
= 70 °C
2.2
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 10 s
R
thJA
29 35
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
13 16
N-Channel MOSFET
G
D
S
SO-8
SD
SD
SD
GD
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4630DY-T1-E3 (Lead (Pb)-free)
Si4630DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
Halogen-free According to IEC 61249-2-21
Available
•TrenchFET
®
Power MOSFET
100 % R
g
Tes t ed
APPLICATIONS
Synchronous Buck - Low Side
- Notebook
- Server
- Workstation
Synchronous Rectifier - POL
www.vishay.com
2
Document Number: 73685
S09-0138-Rev. C, 02-Feb-09
Vishay Siliconix
Si4630DY
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
25 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
28
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 6
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.0 2.2 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 16 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 25 V, V
GS
= 0 V
1
µA
V
DS
= 25 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V 30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 20 A
0.0022 0.0027
Ω
V
GS
= 4.5 V, I
D
= 15 A
0.0026 0.0032
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 20 A
120 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
6670
pFOutput Capacitance
C
oss
997
Reverse Transfer Capacitance
C
rss
531
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 20 A
107.5 161
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 20 A
49 73
Gate-Source Charge
Q
gs
15.7
Gate-Drain Charge
Q
gd
13.6
Gate Resistance
R
g
f = 1 MHz 1.5 2.25 Ω
Tur n- O n De l ay Tim e
t
d(on)
V
DD
= 15 V, R
L
= 1.5Ω
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1 Ω
37 56
ns
Rise Time
t
r
122 185
Turn-Off DelayTime
t
d(off)
47 71
Fall Time
t
f
15 23
Tur n- O n D el ay T i me
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
10 A, V
GEN
= 10 V, R
g
= 1 Ω
17 26
Rise Time
t
r
93 140
Turn-Off DelayTime
t
d(off)
60 90
Fall Time
t
f
915
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
I
S
T
C
= 25 °C
7
A
Pulse Diode Forward Current
a
I
SM
70
Body Diode Voltage
V
SD
I
S
= 3 A
0.72 1.1 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 13 A, dI/dt = 100 A/µs, T
J
= 25 °C
47 70 ns
Body Diode Reverse Recovery Charge
Q
rr
50 75 nC
Reverse Recovery Fall Time
t
a
23
ns
Reverse Recovery Rise Time
t
b
24
Document Number: 73685
S09-0138-Rev. C, 02-Feb-09
www.vishay.com
3
Vishay Siliconix
Si4630DY
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
10
20
30
40
50
60
7
0
0.0 0.5 1.0 1.5 2.0 2.5
V
GS
= 10 thru 3 V
V
DS
- Drain-to-Source Voltage (V)
)A( tnerruC niarD -I
D
0 102030405060
V
GS
= 10 V
I
D
- Drain Current (A)
V
GS
= 4.5 V
R
)no(SD
mΩ( ecnatsiseR-nO
-)
0.0022
0.0018
0.0026
0.0030
0.0034
0
2
4
6
8
10
0 22446688 110
I
D
= 20 A
)V
(
e
ga
tl
oV
ec
ru
oS
-o
t-e
ta
G
-
Q
g
- Total Gate Charge (nC)
V
SG
V
DS
= 10 V
V
GS
= 20 V
V
DS
= 15 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.0 0.6 1.2 1.8 2.4 3.0
25 °C
T
C
= 125 °C
- 55 °C
V
GS
- Gate-to-Source Voltage (V)
)A( tnerruC niarD -I
D
C
rss
0
1700
3400
5100
6800
8500
0 5 10 15 20 25
C
iss
V
DS
- Drain-to-Source Voltage (V)
)Fp( ec
na
t
i
c
apaC
-
C
C
oss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
V
GS
= 4.5 V
T
J
- Junction Temperature (°C)
R
)no(SD
ecn
at
si
seR-n
O -
)dezilam
r
oN(
V
GS
= 10 V
I
D
= 20 A

SI4630DY-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 25V Vds 16V Vgs SO-8
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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