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FERD20U50DJF-TR

P1-P3P4-P6P7-P8
Characteristics FERD20U50
4/8 DocID026021 Rev 3
Figure 7. Thermal resistance junction to ambient versus copper surface under tab
(typical values)
0
25
50
75
100
125
150
012345678910
R
t
h
(
j
-
a
)
(°C/W)
S
Cu
(cm²)
Epoxy printed board Fr4, copper thickness = 35 µm
DocID026021 Rev 3 5/8
FERD20U50 Package information
8
2 Package information
• Epoxy meets UL94, V0
• Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
2.1 PowerFLAT-8L package information
Figure 8. PowerFLAT-8L package outline
D2
E2
K
L
b
e
D
E
A
A1
A2
Package information FERD20U50
6/8 DocID026021 Rev 3
Figure 9. Footprint (dimensions in mm)
Table 5. PowerFLAT-8L package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.80 1.00 0.031 0.039
A1 0.02 0.05 0.001 0.002
A2 0.25 0.010
b 0.30 0.50 0.012 0.020
D 5.20 0.205
D2 4.11 4.31 0.162 0.170
e 1.27 0.050
E 6.15 0.242
E2 3.50 3.70 0.138 0.146
L 0.50 0.80 0.020 0.031
K 1.275 1.575 0.050 0.062
1.27
0.62
0.95
0.98
6.29
4.33
3.86
5.35
4.41
P1-P3P4-P6P7-P8

FERD20U50DJF-TR

Mfr. #:
Buy FERD20U50DJF-TR
Manufacturer:
STMicroelectronics
Description:
Rectifiers Field Effect Rectifier
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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