NBSG11
http://onsemi.com
10
t
PHL
Figure 5. AC Reference Measurement
CLK
CLK
Q
Q
t
PLH
V
INPP
= V
IH
(CLK) - V
IL
(CLK)
V
OUTPP
= V
OH
(Q) - V
OL
(Q)
Figure 6. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D - Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
CC
- 2.0 V
ORDERING INFORMATION
Device Package Shipping
NBSG11BA FCBGA-16 100 Units / Tray (Contact Sales Representative)
NBSG11BAR2 FCBGA-16 100 / Tape & Reel
(Contact Sales Representative)
NBSG11MAG FCLGA-16, 4x4 mm
(Pb-Free)
100 Units / Tray (Contact Sales Representative)
NBSG11MAHTBG FCLGA-16, 4x4 mm
(Pb-Free)
100 / Tape & Reel
NBSG11MN QFN-16 123 Units / Rail
NBSG11MNG QFN-16
(Pb-Free)
123 Units / Rail
NBSG11MNR2 QFN-16 3000 / Tape & Reel
NBSG11MNR2G QFN-16
(Pb-Free)
3000 / Tape & Reel
Board Description
NBSG11BAEVB NBSG11BA Evaluation Board
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NBSG11
http://onsemi.com
11
PACKAGE DIMENSIONS
FCBGA-16
BA SUFFIX
PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE
CASE 489-01
ISSUE O
0.20
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
D
E
M
A1
A2
A
0.10 Z
0.15 Z
ROTATED 90 CLOCKWISE
DETAIL K
_
5
VIEW M-M
e3 X
S
M
X0.15 YZ
0.08 Z
3
b16 X
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
4321
A
B
C
D
4
16 X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM MIN MAX
MILLIMETERS
A 1.40 MAX
A1 0.25 0.35
A2 1.20 REF
b 0.30 0.50
D 4.00 BSC
E 4.00 BSC
e 1.00 BSC
S 0.50 BSC
K
-X-
-Y-
M
M
-Z-
NBSG11
http://onsemi.com
12
PACKAGE DIMENSIONS
16 PIN LGA 4x4, 1.0P
CASE 526AB-01
ISSUE C
DIM MIN TYP
MILLIMETERS
A 0.89 0.96
A1 0.22 0.26
A2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
E
D
0.10 C
A2
A
A1
0.10 C
4X
SEATING
PLANE
D1
e
E1
e
0.05 C
0.03 C
A B
16X b
C
B
A
12 3
D 4.00 BSC
E
0.67 0.70
b 0.30 0.40
e 1.00 BSC
D1
E1 3.00 BSC
SIDE VIEW
TOP VIEW
BOTTOM VIEW
4
D
e/2
e/2
4.00 BSC
3.00 BSC
1.03
0.30
0.73
0.50
MAX
A
B
TERMINAL A1
LOCATOR
C
0.40
16X
PITCH
1.00
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
A
1
PITCH
1.00

NBSG11BA

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 2.5V/3.3V SiGE 1:2
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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