OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

DAC8248FS-REEL

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
Parameter Symbol Conditions DAC8248 Units
V
DD
= +5 V V
DD
= +15 V
Switching Characteristics +258C –408C to +858C –558C to +1258C All Temps
(Notes 2, 8) (Note 9) (Note 10)
LSB/MSB Select to
Write Set-Up Time t
CBS
130 170 180 80 ns min
LSB/MSB Select to
Write Hold Time t
CBH
0 0 0 0 ns min
DAC Select to
Write Set-Up Time t
AS
180 210 220 80 ns min
DAC Select to
Write Hold Time t
AH
0 0 0 0 ns min
LDAC to
Write Set-Up Time t
LS
120 150 160 80 ns min
LDAC to
Write Hold Time t
LH
0 0 0 0 ns min
Data Valid to
Write Set-Up Time t
DS
160 210 220 70 ns min
Data Valid to
Write Hold Time t
DH
0 0 0 10 ns min
Write Pulse Width t
WR
130 150 170 90 ns min
LDAC Pulse Width t
LWD
100 110 130 60 ns min
Reset Pulse Width t
RWD
80 90 90 60 ns min
NOTES
11
Measured using internal R
FB A
and R
FB B
. Both DAC digital inputs = 1111 1111 1111.
12
Guaranteed and not tested.
13
Gain TC is measured from +25°C to T
MIN
or from +25°C to T
MAX
.
14
Absolute Temperature Coefficient is approximately +50 ppm/°C.
15
From 50% of digital input to 90% of final analog output current. V
REF A
= V
REF B
= +10 V; OUT A, OUT B load = 100 Ω, C
EXT
= 13 pF.
16
WR, LDAC = 0 V; DB0–DB7 = 0 V to V
DD
or V
DD
to 0 V.
17
Settling time is measured from 50% of the digital input change to where the output settles within 1/2 LSB of full scale.
18
See Timing Diagram.
19
These limits apply for the commercial and industrial grade products.
10
These limits also apply as typical values for V
DD
= +12 V with +5 V CMOS logic levels and T
A
= +25°C.
Specifications subject to change without notice.
Burn-In Circuit
DAC8248
–3–
REV. B
DAC8248
–4–
REV. B
ORDERING GUIDE
1
Relative
Accuracy Gain Error Temperature Package
Model (+5 V or +15 V) (+5 V or +15 V) Range Description
DAC8248AW
2
±1/2 LSB ±1 LSB –55°C to +125°C 24-Pin Cerdip
DAC8248EW ±1/2 LSB ±1 LSB –40°C to +85°C 24-Pin Cerdip
DAC8248GP ±1/2 LSB ±2 LSB 0°C to +70°C 24-Pin Plastic DIP
DAC8248FW ±1 LSB ±4 LSB –40°C to +85°C 24-Pin Cerdip
DAC8248HP ±1 LSB ±4 LSB 0°C to +70°C 24-Pin Plastic DIP
DAC8248FP ±1 LSB ±4 LSB –40°C to +85°C 24-Pin Plastic DIP
DAC8248HS
3
±1 LSB ±4 LSB 0°C to +70°C 24-Pin SOL
NOTES
1
Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.
2
For devices processed in total compliance to MIL-STD-883, add/883 after part number. Consult factory for 883 data sheet.
3
For availability and burn-in information on SO and PLCC packages, contact your local sales office.
(continued from page 1)
operates on a single supply from +5 V to +15 V, and it dissi-
pates less than 0.5 mW at +5 V (using zero or V
DD
logic levels).
The device is packaged in a space-saving 0.3", 24-pin DIP.
The DAC8248 is manufactured with PMI’s highly stable thin-
film resistors on an advanced oxide-isolated, silicon-gate,
CMOS technology. PMI’s improved latch-up resistant design
eliminates the need for external protective Schottky diodes.
ABSOLUTE MAXIMUM RATINGS
(T
A
= +25°C, unless otherwise noted.)
V
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
+0.3 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, V
DD
+0.3 V
I
OUT A
, I
OUT B
to AGND . . . . . . . . . . . . . . –0.3 V, V
DD
+0.3 V
V
REF A
, V
REF B
to AGND . . . . . . . . . . . . . . . . . . . . . . . . ±25 V
V
RFB A
, V
RFB B
to AGND . . . . . . . . . . . . . . . . . . . . . . . . ±25 V
Operating Temperature Range
AW Version . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
EW, FW, FP Versions . . . . . . . . . . . . . . . . –40°C to +85°C
GP, HP, HS Versions . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Package Type u
JA
1
u
JC
Units
24-Pin Hermetic DIP (W) 69 10 °C/W
24-Pin Plastic DIP (P) 62 32 °C/W
24-Pin SOL (S) 72 24 °C/W
NOTE
1
u
JA
specified for worst case mounting conditions, i.e., u
JA
is specified for device in
socket for cerdip and P-DIP packages; u
JA
is specified for device soldered to printed
circuit board for SOL package.
CAUTION
1. Do not apply voltages higher than V
DD
or less than GND
potential on any terminal except V
REF
and R
FB
.
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets; remove
power before insertion or removal.
4. Use proper antistatic handling procedures.
5. Devices can suffer permanent damage and/or reliability deg-
radation if stressed above the limits listed under Absolute
Maximum Ratings for extended periods. This is a stress rat-
ing only and functional operation at or above this specifica-
tion is not implied.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8248 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
DAC8248
–5–
REV. B
11. AGND 13. NC
12. I
OUTA
14. DB1
13. R
FB A
15. DB0(LSB)
14. V
REF A
16. RESET
15. DGND 17.
LSB/MSB
16. DB7(MSB) 18.
DAC A/DAC B
17. DB6 19.
LDAC
18. DB5 20.
WR
19. DB4 21. V
DD
10. DB3 22. V
REF B
11. DB2 23. R
FB B
12. NC 24. I
OUT B
SUBSTRATE (DIE BACKSIDE) IS INTERNALLY
CONNECTED TO V
DD
.
DICE CHARACTERISTICS
WAFER TEST LIMITS
@ V
DD
= +5 V or +15 V, V
REF A
= V
REF B
= +10 V, V
OUT A
= V
OUT B
= 0 V; AGND = DGND = 0 V; T
A
= 258C.
DAC8248G
Parameter Symbol Conditions Limit Units
Relative Accuracy INL Endpoint Linearity Error ±1 LSB max
Differential Nonlinearity DNL All Grades are Guaranteed Monotonic ±1 LSB max
Full-Scale Gain Error
1
G
FSE
Digital Inputs = 1111 1111 1111 ±4 LSB max
Output Leakage Digital Inputs = 0000 0000 0000
(I
OUT A
, I
OUT B
)I
LKG
Pads 2 and 24 ±50 nA max
Input Resistance
(V
REF A
, V
REF B
)R
REF
Pads 4 and 22 8/15 kΩ min/kΩ max
V
REF A
, V
REF B
Input ∆R
REF
Resistance Match R
REF
±1 % max
Digital Input High V
INH
V
DD
= +5 V 2.4 V min
V
DD
= +15 V 13.5 V min
Digital Input Low V
INL
V
DD
= +5 V 0.8 V max
V
DD
= +15 V 1.5 V max
Digital Input Current I
IN
V
IN
= 0 V or V
DD
; V
INL
or V
INH
±1 µA max
Supply Current I
DD
All Digital Inputs V
INL
or V
INH
2 mA max
All Digital Inputs 0 V or V
DD
0.1 mA max
DC Supply Rejection
(∆Gain/∆V
DD
) PSR ∆V
DD
= ±5% 0.002 %/% max
NOTES
1
Measured using internal R
FB A
and R
FB B
.
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
Die Size 0.124
×
0.132 inch, 16,368 sq. mils
(3.15
×
3.55 mm, 10.56 sq. mm)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

DAC8248FS-REEL

Mfr. #:
Buy DAC8248FS-REEL
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC Dual 12B (8B Byte) Dbl-Buffered CMOS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet