MC100EP016A
http://onsemi.com
10
APPLICATIONS INFORMATION (continued)
EP01
Q0 to Q7
P0 to P7
CLK
TC
PECE
Figure 7. 32‐Bit Cascaded EP016A Programmable Divider
LO
CLK
CLK
CLK
MSB
LSB
EP016
EP01 EP01
Q0 to Q7 Q0 to Q7 Q0 to Q7 Q0 to Q7
P0 to P7 P0 to P7 P0 to P7
EP016 EP016 EP016
CLK
TC
PECE
CLK
CLK
TC
PECE
CLK
CLK
TC
PECE
CLK
Figure 7 shows a typical block diagram of a 32‐bit divider
chain. Once again to maximize the frequency of operation
EP01 OR gates were used. For lower frequency applications
a slower OR gate could replace the EP01. Note that for a
16‐bit divider the OR function feeding the PE (program
enable) input CANNOT be replaced by a wire OR tie as the
TC output of the least significant EP016A must also feed the
CE input of the most significant EP016A. If the two TC
outputs were OR tied the cascaded count operation would
not operate properly. Because in the cascaded form the PE
feedback is external and requires external gating, the
maximum frequency of operation will be significantly less
than the same operation in a single device.
Maximizing EP016A Count Frequency
The EP016A device produces 9 fast transitioning single
ended outputs, thus V
CC
noise can become significant in
situations where all of the outputs switch simultaneously in
the same direction. This V
CC
noise can negatively impact
the maximum frequency of operation of the device. Since
the device does not need to have the Q outputs terminated to
count properly, it is recommended that if the outputs are not
going to be used in the rest of the system they should be left
unterminated. In addition, if only a subset of the Q outputs
are used in the system only those outputs should be
terminated. Not terminating the unused outputs will not only
cut down the V
CC
noise generated but will also save in total
system power dissipation. Following these guidelines will
allow designers to either be more aggressive in their designs
or provide them with an extra margin to the published data
book specifications.
Figure 8. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D - Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
CC
- 2.0 V
MC100EP016A
http://onsemi.com
11
ORDERING INFORMATION
Device Package Shipping
MC100EP016AFA LQFP-32 250 Units / Tray
MC100EP016AFAG LQFP-32
(Pb-Free)
250 Units / Tray
MC100EP016AFAR2 LQFP-32 2000 / Tape & Reel
MC100EP016AFAR2G LQFP-32
(Pb-Free)
2000 / Tape & Reel
MC100EP016AMNG QFN-32
(Pb-Free)
74 Units / Rail
MC100EP016AMNR4G QFN-32
(Pb-Free)
1000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D - ECL Clock Distribution Techniques
AN1406/D - Designing with PECL (ECL at +5.0 V)
AN1503/D -
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D - Metastability and the ECLinPS Family
AN1568/D - Interfacing Between LVDS and ECL
AN1672/D - The ECL Translator Guide
AND8001/D - Odd Number Counters Design
AND8002/D - Marking and Date Codes
AND8020/D - Termination of ECL Logic Devices
AND8066/D - Interfacing with ECLinPS
AND8090/D - AC Characteristics of ECL Devices
MC100EP016A
http://onsemi.com
12
PACKAGE DIMENSIONS
DETAIL Y
A
S1
VB
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
N
J
DF
METAL
SECTION AE-AE
G
SEATING
PLANE
R
Q
_
W
K
X
0.250 (0.010)
GAUGE PLANE
E
C
H
DETAIL AD
DETAIL AD
A1
B1
V1
4X
S
4X
9
-T-
-Z-
-U-
T-U0.20 (0.008) ZAC
T-U0.20 (0.008) ZAB
0.10 (0.004) AC
-AC-
-AB-
M
_
8X
-T-, -U-, -Z-
T-U
M
0.20 (0.008) ZAC
NOTES:
1.
DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2.
CONTROLLING DIMENSION:
MILLIMETER.
3.
DATUM PLANE -AB- IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4.
DATUMS -T-, -U-, AND -Z- TO BE
DETERMINED AT DATUM PLANE -AB-.
5.
DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE -AC-.
6.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-.
7.
DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8.
MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9.
EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
DIM
A
MIN MAX MIN MAX
INCHES
7.000 BSC 0.276 BSC
MILLIMETERS
B 7.000 BSC 0.276 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC 0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.450 0.750 0.018 0.030
M 12 REF 12 REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC 0.016 BSC
Q 1 5 1 5
R 0.150 0.250 0.006 0.010
V 9.000 BSC 0.354 BSC
V1 4.500 BSC 0.177 BSC
__
____
B1 3.500 BSC 0.138 BSC
A1 3.500 BSC 0.138 BSC
S 9.000 BSC 0.354 BSC
S1 4.500 BSC 0.177 BSC
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF
32 LEAD LQFP
CASE 873A-02
ISSUE C

MC100EP016AFAG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Counter Shift Registers 3.3V/5V ECL 8-Bit Up Counter
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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