CY62126EV30LL-45ZSXIT

CY62126EV30 MoBL
Document #: 38-05486 Rev. *H Page 4 of 16
Maximum Ratings
Exceeding maximum ratings may shorten the battery life of the
device. These user guidelines are not tested.
Storage temperature ................................ –65 °C to +150 °C
Ambient temperature with
power applied ........................................... –55 °C to +125 °C
Supply voltage to ground
potential..............................–0.3 V to 3.6 V (V
CCmax
+ 0.3 V)
DC voltage applied to outputs
in High Z state
[3, 4]
..............–0.3 V to 3.6 V (V
CCmax
+ 0.3 V)
DC input voltage
[3, 4]
 0.3 V to 3.6 V (V
CCmax
+ 0.3 V)
Output current into outputs (LOW) ..............................20 mA
Static discharge voltage.......................................... > 2001 V
(MIL-STD-883, Method 3015)
Latch up current..................................................... > 200 mA
Notes
3. V
IL(min)
= –2.0 V for pulse durations less than 20 ns.
4. V
IH(max)
= V
CC
+0.75 V for pulse durations less than 20 ns.
5. Full device AC operation assumes a 100 s ramp time from 0 to V
cc
(min) and 200 s wait time after V
cc
stabilization.
6. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ)
, T
A
= 25 °C.
7. Chip enable (CE
) needs to be tied to CMOS levels to meet the I
SB2
/ I
CCDR
spec. Other inputs can be left floating.
Operating Range
Device Range
Ambient
Temperature
V
CC
[5]
CY62126EV30LL Industrial –40 °C to +85 °C 2.2 V to
3.6 V
Automotive –40 °C to +125 °C
Electrical Characteristics
(Over the Operating Range)
Parameter Description Test Conditions
45 ns (Industrial) 55 ns (Automotive)
Unit
Min Typ
[6]
Max Min Typ
[6]
Max
V
OH
Output high voltage I
OH
= –0.1 mA 2.0 2.0 V
I
OH
= –1.0 mA, V
CC
> 2.70V 2.4 2.4 V
V
OL
Output low voltage I
OL
= 0.1 mA 0.4 0.4 V
I
OL
= 2.1mA, V
CC
> 2.70V 0.4 0.4 V
V
IH
Input high voltage V
CC
= 2.2 V to 2.7 V 1.8 V
CC
+ 0.3 1.8 V
CC
+ 0.3 V
V
CC
= 2.7 V to 3.6 V 2.2 V
CC
+ 0.3 2.2 V
CC
+ 0.3 V
V
IL
Input low voltage V
CC
= 2.2 V to 2.7 V –0.3 0.6 –0.3 0.6 V
V
CC
= 2.7 V to 3.6 V –0.3 0.8 –0.3 0.8 V
I
IX
Input leakage current GND < V
I
< V
CC
–1 +1 –4 +4 A
I
OZ
Output leakage current GND < V
O
< V
CC
, Output Disabled –1 +1 –4 +4 A
I
CC
V
CC
operating supply
current
f = f
max
= 1/t
RC
V
CC
= V
CCmax
I
OUT
= 0 mA
CMOS levels
11 16 11 35 mA
f = 1 MHz 1.3 2.0 1.3 4.0
I
SB1
Automatic CE power
down current —CMOS
inputs
CE > V
CC
0.2 V,
V
IN
> V
CC
– 0.2 V, V
IN
< 0.2 V)
f = f
max
(Address and Data Only),
f = 0 (OE
, BHE, BLE and WE),
V
CC
= 3.60V
–1 4 –1 35 A
I
SB2
[7]
Automatic CE power
down current —CMOS
inputs
CE > V
CC
– 0.2 V,
V
IN
> V
CC
– 0.2 V or V
IN
< 0.2 V,
f = 0, V
CC
= 3.60V
–1 4 –1 30 A
CY62126EV30 MoBL
Document #: 38-05486 Rev. *H Page 5 of 16
Capacitance
For all packages. Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions Max Unit
C
IN
Input capacitance T
A
= 25 °C, f = 1 MHz, V
CC
= V
CC(typ)
10 pF
C
OUT
Output capacitance 10 pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions
VFBGA
Package
TSOP II
Package
Unit
JA
Thermal resistance
(Junction to ambient)
Still Air, soldered on a 4.25 × 1.125 inch,
two-layer printed circuit board
58.85 28.2 °C/W
JC
Thermal resistance
(Junction to case)
17.01 3.4 °C/W
Figure 3. AC Test Loads and Waveforms
Parameters 2.2 V - 2.7 V 2.7 V - 3.6 V Unit
R1 16600 1103
R2 15400 1554
R
TH
8000 645
V
TH
1.2 1.75 V
V
CC
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT V
TH
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
CY62126EV30 MoBL
Document #: 38-05486 Rev. *H Page 6 of 16
Notes
8. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ)
, T
A
= 25 °C.
9. Tested initially and after any design or process changes that may affect these parameters.
10. Full device AC operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100 s.
Data Retention Characteristics
Over the Operating Range
Parameter Description Conditions Min Typ
[8]
Max Unit
V
DR
V
CC
for data retention 1.5 V
I
CCDR
[9]
Data retention current V
CC
= V
DR
, CE > V
CC
– 0.2 V,
V
IN
> V
CC
– 0.2 V or V
IN
< 0.2 V
Industrial 3 A
Automotive 30 A
t
CDR
[10]
Chip deselect to data
retention time
0– ns
t
R
[10]
Operation recovery time t
RC
––ns
Figure 4. Data Retention Waveform
V
CC(min)
V
CC(min)
t
CDR
V
DR
> 1.5 V
DATA RETENTION MODE
t
R
V
CC
CE

CY62126EV30LL-45ZSXIT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 1Mb 3V 45ns 64K x 16 LP SRAM
Lifecycle:
New from this manufacturer.
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