CY62126EV30 MoBL
Document #: 38-05486 Rev. *H Page 13 of 16
Package Diagrams
Figure 11. 48-Ball VFBGA (6 x 8 x 1 mm), 51-85150
51-85150 *F
CY62126EV30 MoBL
Document #: 38-05486 Rev. *H Page 14 of 16
Figure 12. 44-Pin TSOP II, 51-85087
Acronyms
MAX
MIN.
DIMENSION IN MM (INCH)
(OPTIONAL)
CAN BE LOCATED
ANYWHERE IN THE
BOTTOM PKG
EJECTOR MARK
Z
A
Z
Z
Z
Z
X
A
10.058 (0.396)
10.262 (0.404)
0.597 (0.0235)
0.406 (0.0160)
0.210 (0.0083)
0.120 (0.0047)
TOP VIEW
BOTTOM VIEW
PLANE
SEATING
18.517 (0.729)
0.800 BSC
0°-5°
0.400(0.016)
0.300 (0.012)
1.194 (0.047)
0.991 (0.039)
0.150 (0.0059)
0.050 (0.0020)
(0.0315)
18.313 (0.721)
BASE PLANE
0.10 (.004)
11.938 (0.470)
PIN 1 I.D.
44
1
11.735 (0.462)
10.058 (0.396)
10.262 (0.404)
22
23
51-85087-*C
Acronym Description
BHE
byte high enable
BLE
byte low enable
CMOS complementary metal oxide semiconductor
CE
chip enable
I/O input/output
OE
output enable
SRAM static random access memory
TSOP thin small outline package
VFBGA very fine ball gird array
WE
write enable
CY62126EV30 MoBL
Document #: 38-05486 Rev. *H Page 15 of 16
Document History Page
Document Title: CY62126EV30 MoBL
®
, 1-Mbit (64K x 16) Static RAM
Document Number: 38-05486
Rev. ECN No.
Submission
Date
Orig. of
Change
Description of Change
** 202760 See ECN AJU New data sheet
*A 300835 See ECN SYT Converted from Advance Information to Preliminary
Specified Typical standby power in the Features Section
Changed E3 ball from DNU to NC in the Pin Configuration for the FBGA Package
and removed the footnote associated with it on page #2
Changed t
OHA
from 6 ns to 10 ns for both 35- and 45-ns speed bins, respectively
Changed t
DOE
, t
SD
from 15 to 18 ns for 35-ns speed bin
Changed t
HZOE
, t
HZBE
, t
HZWE
from 12 and 15 ns to 15 and 18 ns for the 35- and
45-ns speed bins, respectively
Changed t
HZCE
from 12 and 15 ns to 18 and 22 ns for the 35- and 45-ns speed
bins, respectively
Changed t
SCE
,t
BW
from 25 and 40 ns to 30 and 35 ns for the 35- and 45-ns speed
bins, respectively
Changed t
AW
from 25 to 30 ns and 40 to 35 ns for 35 and 45-ns speed bins respec-
tively
Changed t
DBE
from 35 and 45 ns to 18 and 22 ns for the 35 and 45 ns speed bins
respectively
Removed footnote that read “BHE
.BLE is the AND of both BHE and BLE. Chip can
be deselected by either disabling the chip enable signals or by disabling both BHE
and BLE
” on page # 4
Removed footnote that read “If both BHE
and BLE are toggled together, then t
LZBE
is 10 ns” on page # 5
Added Pb-free package information
*B 461631 See ECN NXR Converted from Preliminary to Final
Removed 35 ns Speed Bin
Removed “L” version of CY62126EV30
Changed I
CC (Typ)
from 8 mA to 11 mA and I
CC (max)
from 12 mA to 16 mA for f = f
max
Changed I
CC (max)
from 1.5 mA to 2.0 mA for f = 1 MHz, I
SB1
,
I
SB2 (max)
from 1 A
to 4 A, I
SB1
,
I
SB2 (Typ)
from 0.5 A to 1 A, I
CCDR (max)
from 1.5 A to 3 A, AC Test
load Capacitance value from 50 pF to 30 pF, t
LZOE
from 3 to 5 ns, t
LZCE
from 6 to
10 ns, t
HZCE
from 22 to 18 ns, t
LZBE
from 6 to 5 ns, t
PWE
from 30 to 35 ns, t
SD
from
22 to 25 ns, t
LZWE
from 6 to 10 ns, and updated the Ordering Information table.
*C 925501 See ECN VKN Added footnote #7 related to I
SB2
and
I
CCDR
Added footnote #11 related AC timing parameters
*D 1045260 See ECN VKN Added Automotive information
Updated Ordering Information table
*E 2631771 01/07/09 NXR/PYRS Changed CE condition from X to L in Truth table for Output Disable mode
Updated template
*F 2944332 06/04/2010 VKN Added Contents
Removed byte enable from footnote #2 in Electrical Characteristics
Added footnote related to chip enable in Truth Table
Updated Package Diagrams
Updated links in Sales, Solutions, and Legal Information
*G 2996166 07/29/2010 AJU Added CY62126EV30LL-45ZSXA part in Ordering Information.
Added Ordering Code Definitions.
Modified table footnote format.
*H 3113864 12/17/2010 PRAS Updated Figure 1 and Package Diagram, and fixed Typo in Figure 3..

CY62126EV30LL-55ZSXE

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 1Mb 3V 55ns 64K x 16 LP SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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