MLX74190RPF-ABA-000-RE

MLX74190
Two-Fold High Power LF Initiator
With integrated Immobilizer
390107419001 Page 10 of 14 Sept-2014
Rev. 001 Product Preview
5 Application Information
Typical application schematic is shown below:
OUT1
RS1
CS1
LF1
SCLK
SDI
SDO
NCS
IRQ
WUP
SCLK
SDI
SDO
NCS
IRQ
WUP
RBIAS
AGND
DGND
IP_SENS
MCU (A/D)
GND
ASK_RX
(Immo)
MLX74190
CLK_IN 2MHz (Opt.)
VS
Remote Data (Opt) REMOTE_DATA_IN
CLK_IN
EXT_CLK
OUT2
RS2
CS2
LF2
FSK_RX
(Immo)
FSK_FB
4MHz crystal
is optionnal
VDDD_CAP
VDDA_CAP
VDD
+5V
CLK_OUT
OSC
DOUT
VS
MCU
Figure 4: typical application schematic passive start
MLX74190
Two-Fold High Power LF Initiator
With integrated Immobilizer
390107419001 Page 11 of 14 Sept-2014
Rev. 001 Product Preview
1 Package and marking information
1.1 Package data TQFP eP 48L (7x7, 48 leads)
A
A1
A2
b
b1
D
D1
D2
E
E1
E2
e
L
N
ccc
ddd
Min
-
0.05
0.95
0.17
0.17
9.00
7.00
4.00
9.00
7.00
4.00
0.50
0.45
48
-
-
Nom
-
-
1.00
0.22
0.20
0.60
-
-
Max
1.20
0.15
1.05
0.27
0.23
0.75
0.08
0.08
Notes:
1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994,
Δ2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line.
Δ3. Datum [A-B] and [-D-] to be determined at centreline between leads where leads exist, plastic body at datum plane [-|-|-]
Δ4. To be determined at seating plane [-C-]
Δ5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould protrusion is 0.254 mm on D1 and E1 dimensions.
6. 'N' is the total number of terminals
Δ7. These dimensions to be determined at datum plane [-|-|-]
8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package.
Δ9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition, dam bar can not
be located on the lower radius of the foot.
10. Controlling dimension millimetre.
11. maximum allowable die thickness to be assembled in this package family is 0.38mm
12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD.
Δ13. A1 is defined as the distance from the seating plane to the lowest point of the package body.
Δ14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and are independent from die size.
15. Exposed pad shall be coplanar with bottom of package within 0.05.
Exposed pad need best
possible contact to ground for
exlectrical and thermal reasons
MLX74190
Two-Fold High Power LF Initiator
With integrated Immobilizer
390107419001 Page 12 of 14 Sept-2014
Rev. 001 Product Preview
1.2 Marking instruction
MLX
74190x
zzzzzzzzz
yyww
1
Lot Number
Assembly Date Code: Week number
Assembly Date Code: Year
Silicon Revision: Character [A...Z]
Figure 5: Marking example on IC package TQFP EP 7x7

MLX74190RPF-ABA-000-RE

Mfr. #:
Manufacturer:
Melexis
Description:
RFID Transponders 2x High power LF Driver IC + Immobilizer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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