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VNQ830PEP-E

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27
VNQ830PEP-E Application information
Doc ID 10871 Rev 8 19/27
3.5 Maximum demagnetization energy (V
CC
= 13.5V)
Figure 26. Maximum turn-off current versus load inductance
Note: Values are generated with R
L
= 0
In case of repetitive pulses, T
jstart
(at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves B and C.
V
IN
, I
L
t
Demagnetization
Demagnetization
Demagnetization
A = single pulse at T
Jstart
= 150ºC
B= repetitive pulse at T
Jstart
= 100ºC
C= repetitive pulse at T
Jstart
= 125ºC
1
10
100
0.01 0.1 1 10 100
L(mH)
I
LMAX (A)
A
B
C
Package and PC board thermal data VNQ830PEP-E
20/27 Doc ID 10871 Rev 8
4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 27. PowerSSO-24 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 78 mm x 78 mm, PCB
thickness=2 mm, Cu thickness=70 mm (front and back side), Copper areas: from minimum
pad lay-out to 8 cm
2
).
Figure 28.
R
thj-amb
vs PCB copper area in open box free air condition (one channel ON)
30
35
40
45
50
55
60
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)
VNQ830PEP-E Package and PC board thermal data
Doc ID 10871 Rev 8 21/27
Figure 29. PowerSSO-24 thermal impedance junction ambient single pulse (one
channel ON)
Figure 30. Thermal fitting model of a double channel HSD in PowerSSO-24
(b)
b. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
0.1
1
10
100
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/ W)
Footprint
8 cm
2
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27

VNQ830PEP-E

Mfr. #:
Buy VNQ830PEP-E
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Quad Ch HiSide Drivr
Lifecycle:
New from this manufacturer.
Delivery:
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