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MC100E241FNG

P1-P3P4-P6P7-P7
MC100E241
http://onsemi.com
4
Table 6. AC CHARACTERISTICS V
CCx
= 5.0 V; V
EE
= 0.0 V or V
CCx
= 0.0 V; V
EE
= −5.0 V (Note 5)
Symbol
Characteristic
0°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
f
MAX
Maximum Toggle Frequency 900 900 900 GHz
f
SHIFT
Max. Shift Frequency 700 900 700 900 700 900 MHz
t
PLH
Propagation Delay to Output ps
t
PHL
CLK 625 750 975 625 750 975 625 750 975
MR 600 725 975 600 725 975 600 725 975
t
s
Setup Time ps
D 175 25 175 25 175 25
SEL0 (SHIFT) 350 200 350 200 350 200
SEL1 (HOLD/LOAD) 400 250 400 250 400 250
S-IN 125 −100 125 −100 125 −100
t
h
Hold Time ps
D 200 −25 200 −25 200 −25
SEL0 (SHIFT) 100 −200 100 −200 100 −200
SEL1 (HOLD/LOAD) 50 −250 50 −250 50 −250
S-IN 300 100 300 100 300 100
t
RR
Reset Recovery Time 900 600 900 600 900 600 ps
t
PW
Minimum Pulse Width ps
CLK, MR 400 400 400
t
SKEW
Within-Device Skew (Note 6) 60 60 60 ps
t
JITTER
Random Clock Jitter (RMS) < 1 < 1 < 1 ps
t
r
Rise/Fall Times ps
t
f
(20 - 80%) 300 525 800 300 525 800 300 525 800
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. 100 Series: V
EE
can vary −0.46 V / +0.8 V.
6. Within-device skew is defined as identical transitions on similar paths through a device.
MC100E241
http://onsemi.com
5
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
CC
− 2.0 V
ORDERING INFORMATION
Device Package Shipping
†
MC100E241FN PLCC−28 37 Units / Rail
MC100E241FNG PLCC−28
(Pb−Free)
37 Units / Rail
MC100E241FNR2 PLCC−28 500 / Tape & Reel
MC100E241FNR2G PLCC−28
(Pb−Free)
500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D − ECL Clock Distribution Techniques
AN1406/D − Designing with PECL (ECL at +5.0 V)
AN1503/D −
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D − Metastability and the ECLinPS Family
AN1568/D − Interfacing Between LVDS and ECL
AN1672/D − The ECL Translator Guide
AND8001/D − Odd Number Counters Design
AND8002/D − Marking and Date Codes
AND8020/D − Termination of ECL Logic Devices
AND8066/D − Interfacing with ECLinPS
AND8090/D − AC Characteristics of ECL Devices
MC100E241
http://onsemi.com
6
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
−N−
−M−
−L−
V
W
D
D
Y BRK
28 1
VIEW S
S
L−M
S
0.010 (0.250) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
0.004 (0.100)
G1
G
J
C
Z
R
E
A
SEATING
PLANE
S
L−M
M
0.007 (0.180) N
S
T
−T−
B
S
L−M
S
0.010 (0.250) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
U
S
L−M
M
0.007 (0.180) N
S
T
Z
G1X
VIEW D−D
S
L−M
M
0.007 (0.180) N
S
T
K1
VIEW S
H
K
F
S
L−M
M
0.007 (0.180) N
S
T
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.485 0.495 12.32 12.57
B 0.485 0.495 12.32 12.57
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 −−− 0.51 −−−
K 0.025 −−− 0.64 −−−
R 0.450 0.456 11.43 11.58
U 0.450 0.456 11.43 11.58
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y −−− 0.020 −−− 0.50
Z 2 10 2 10
G1 0.410 0.430 10.42 10.92
K1 0.040 −−− 1.02 −−−
__ __
P1-P3P4-P6P7-P7

MC100E241FNG

Mfr. #:
Buy MC100E241FNG
Manufacturer:
ON Semiconductor
Description:
Registers 5V ECL 8-Bit Scannable
Lifecycle:
New from this manufacturer.
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