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74CBTLVD3861BQ,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
74CBTLVD3861 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 14 December 2011 12 of 19
NXP Semiconductors
74CBTLVD3861
10-bit level-shifting bus switch with output enable
10.2 Additional dynamic characteristics
[1] f
i
is biased at 0.5V
CC
.
10.3 Test circuit
Table 11. Additional dynamic characteristics
GND = 0 V.
Symbol Parameter Conditions T
amb
= 25 C Unit
Min Typ Max
f
(3dB)
3 dB frequency response V
CC
= 3.3 V; R
L
=50; see Figure 17
[1]
- 575 - MHz
Adjust f
i
voltage to obtain 0 dBm level at output. Increase f
i
frequency until dB meter reads 3dB.
Fig 17. Test circuit for measuring the frequency response when channel is in ON-state
001aan156
GND
OE
Bn An
V
CC
0.5V
CC
V
IL
f
i
R
L
dB
74CBTLVD3861 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 14 December 2011 13 of 19
NXP Semiconductors
74CBTLVD3861
10-bit level-shifting bus switch with output enable
11. Package outline
Fig 18. Package outline SOT556-1 (SSOP24)
UNIT A
1
A
2
A
3
H
E
L
p
b
p
cD
(1)
E
(1)
Z
(1)
eL ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
8.8
8.6
4.0
3.8
0.635 1
6.2
5.8
0.89
0.41
1.05
0.66
8
0
o
o
8
0
o
o
0.180.25 0.1
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.
SOT556-1
99-12-27
03-02-18
w M
b
p
D
H
E
E
Z
e
c
v M
A
X
A
y
1
12
24
13
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
MO-137
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT556-1
A
max.
1.73
inches
0.0098
0.0040
0.061
0.055
0.01
0.012
0.008
0.0098
0.0075
0.344
0.337
0.157
0.150
0.025 0.041
0.244
0.228
0.035
0.016
0.040
0.026
0.0070.01 0.004
0.068
74CBTLVD3861 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 14 December 2011 14 of 19
NXP Semiconductors
74CBTLVD3861
10-bit level-shifting bus switch with output enable
Fig 19. Package outline SOT355-1 (TSSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
0.4
0.3
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153
99-12-27
03-02-19
0.25
0.5
0.2
w M
b
p
Z
e
112
24
13
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
A
max.
1.1
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74CBTLVD3861BQ,118

Mfr. #:
Buy 74CBTLVD3861BQ,118
Manufacturer:
Nexperia
Description:
Digital Bus Switch ICs 10-bit level-shift bus switch
Lifecycle:
New from this manufacturer.
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