Note 1: All voltages are referenced to ground.
Note 2: DAC and OFFSET register settings must be configured to maintain the master oscillator frequency within this range.
Correct operation of the device is not guaranteed if these limits are exceeded.
Note 3: This is the absolute accuracy of the master oscillator frequency at the default settings.
Note 4: This is the change that is observed in master oscillator frequency with changes in voltage from nominal voltage at
T
A
= +25°C.
Note 5: This is the percentage frequency change from the +25°C frequency due to temperature at V
CC
= 3.3V. The maximum temper-
ature change varies with the master oscillator frequency setting. The minimum occurs at the default master oscillator frequen-
cy (f
default
). The maximum occurs at the extremes of the master oscillator frequency range (33.3MHz or 66.6MHz).
Note 6: The dither deviation of the master oscillator frequency is unidirectional and lower than the undithered frequency.
Note 7: The integral nonlinearity of the frequency is a measure of the deviation from a straight line drawn between the two end-
points (f
osc(MIN)
to f
osc(MAX)
) of the range. The error is in percentage of the span.
Note 8: This is true when the prescaler = 1.
Note 9: Frequency settles faster for small changes in value. During a change, the frequency transitions smoothly from the original
value to the new value.
Note 10: This indicates the time elapsed between power-up and the output becoming active. An on-chip delay is intentionally
introduced to allow the oscillator to stabilize. t
stab
is equivalent to approximately 512 master clock cycles and therefore
depends on the programmed clock frequency.
Note 11: Output voltage swings can be impaired at high frequencies combined with high output loading.
Note 12: A fast-mode device can be used in a standard-mode system, but the requirement t
SU:DAT
> 250ns must then be met.
This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does
stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line at least t
R MAX
+ t
SU:DAT
=
1000ns + 250ns = 1250ns before the SCL line is released.
Note 13: After this period, the first clock pulse is generated.
Note 14: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to as the V
IH MIN
of the SCL
signal) to bridge the undefined region of the falling edge of SCL.
Note 15: The maximum t
HD:DAT
need only be met if the device does not stretch the LOW period (t
LOW
) of the SCL signal.
Note 16: C
B
—total capacitance of one bus line, timing referenced to 0.9 x V
CC
and 0.1 x V
CC
.
Note 17: Typical frequency shift due to aging is ±0.5%. Aging stressing includes Level 1 moisture reflow preconditioning (24hr
+125°C bake, 168hr 85°C/85%RH moisture soak, and three solder reflow passes +240 +0/-5°C peak) followed by 1000hr
max V
CC
biased 125°C HTOL, 1000 temperature cycles at -55°C to +125°C, 96hr 130°C/85%RH/3.6V HAST and 168hr
121°C/2 ATM Steam/Unbiased Autoclave.
Note 18: t
stab
is the time required after exiting power-down to the beginning of output oscillations. In addition, a delay of t
DACstab
is required before the frequency will be within its specified tolerance.
