4
FN9007.8
October 21, 2015
Absolute Maximum Ratings Thermal Information
Supply Voltage, V
CC,
PV
CC
. . . . . . . . . . . . . . . . GND -0.3V to +7.0V
PGND to GND  0.3V
Peak GATE Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1A
ESD Classification . . . . . . . . . . . . . . . . . . . . . Class 1 (HBM, 2500V)
NFB Pin Voltage. . . . . . . . . . . . . . . . . . . . . . ±10V (Transient, 10ms)
Operating Conditions
Temperature Range
ISL6401C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Supply Voltage Range (Typical). . . . . . . . . . . . . . . . . . . . . 5V 10%
Thermal Resistance (Typical)
JA
(°C/W)
JC
(°C/W)
14 Lead SOIC (Note 6) . . . . . . . . . . . . 90 NA
16 Lead QFN (Note 7) . . . . . . . . . . . . . 46 9
Maximum Junction Temperature (Plastic Package) . -55°C to 150°C
Maximum Storage Temperature Range . . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
For Recommended soldering conditions see Tech Brief TB389.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
7.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
8.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with direct attach” features.
JC,
the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
9. All voltages are with respect to GND.
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application
schematic. V
CC
= +5.0V ±10%, T
A
= -40 to 85°C (Note 10), Typical values are at T
A
= 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
V
CC
SUPPLY
Supply Voltage Range 4.5 5.0 5.5 V
Shutdown Supply Current SHDN = GND - 55 100 A
Start-Up Current V
CC
< 3.7V - 0.1 0.20 mA
Operating Supply Current (Note 11) - 3.7 6.0 mA
REFERENCE VOLTAGE
Output Voltage 1.237 1.25 1.262 V
Long Term Stability T
A
= 125°C, 1000 hours - 5 - mV
NEGATIVE FEEDBACK
Source Current -1.02.0mA
CURRENT SENSE
Maximum Input Signal 0.2 0.260 0.3 V
Input Bias Current -2.0 0.0 2.0 A
Overcurrent Threshold 0.4 0.52 0.6 V
ERROR AMPLIFIER
Open Loop Voltage Gain -78-dB
Gain-Bandwidth Product 10 - - MHz
Input Voltage 1.225 1.25 1.275 V
Input Bias Current -1.0-A
PWM
Maximum Duty Cycle 47 48 50 %
Minimum Duty Cycle COMP = 0V - 0 - %
UNDERVOLTAGE LOCKOUT
Start Threshold 3.7 4.1 4.3 V
Stop Threshold 3.2 3.6 4.0 V
ISL6401
5
FN9007.8
October 21, 2015
Start to Stop Hysteresis 0.2 0.5 0.8 V
SOFT-START - DIGITAL
COMP Rise Time Rise from 0.5V to REF -1V - 2048 clk -
OSCILLATOR
Gate Output Frequency Ct = 560pF 90 100 108 kHz
Gate Output Frequency Range 50 - 600 kHz
Temperature Stability -5-%
Sync. Frequency Range 1.1 Times the natural switching
frequency.
--1.2MHz
Sync Input HIGH 3.5 - - V
Sync Input LOW --1.5V
Minimum Sync. Input Pulse Duty Cycle - 20 - %
OUTPUT
GATE Low Level -0.20.5V
GATE High V
SAT
4.4 4.9 5.5 V
Rise Time C load = 1500pF - 35 - ns
Fall Time C load = 1500pF - 40 - ns
NOTES:
10. Specifications at -40°C are guaranteed by design, not production tested.
11. This is the V
CC
current consumed when the device is active but not switching. Does not include gate drive current.
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application
schematic. V
CC
= +5.0V ±10%, T
A
= -40 to 85°C (Note 10), Typical values are at T
A
= 25°C (Continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Typical Performance Curves
FIGURE 1. FREQUENCY vs TEMPERATURE FIGURE 2. REFERENCE VOLTAGE vs TEMPERATURE
TEMPERATURE (°C)
-40 -20 25 60 85
120
100
80
60
40
20
0
FREQUENCY (kHz)
TEMPERATURE (°C)
-40 -20 25 60 85
2.0
1.6
1.2
0.8
0.4
0.2
0
VOLTAGE (V)
1.8
1.4
1.0
0.6
ISL6401
6
FN9007.8
October 21, 2015
Pin Descriptions
SD - This pin is logic level compatible and can be pulled
high, tied to V
IN
or left open for normal operation. Logic low
on the SD activates shutdown, reducing the part’s supply
current to approximately 55A.
SYNC - This pin is the input pin for external frequency
synchronization. The switching frequency of the device can
be synchronized by an external clock signal inserted at this
pin. The oscillator timing capacitor, C
T
, is still required, even
if an external clock is used. Program the free-running
frequency to be a minimum of 10% slower than the SYNC
input frequency.
CT - This is the oscillator timing pin. The free-running
frequency can be set by connecting a timing capacitor to this
pin. The oscillator produces a sawtooth waveform with a
programmable frequency range of 100kHz to 1.2MHz.
Figure 4 may be used as a guideline in selecting the
capacitor value required for a given frequency.
COMP - COMP is the output of the error amplifier and input
of the current comparator.
The ISL6401 features built-in full cycle soft-start. Soft-start is
implemented as a clamp on the maximum COMP voltage.
FB - Feedback pin that is used for positive output voltage
sensing. It is the inverting input of the error amplifier. The
non-inverting input of the error amplifier is internally tied to a
reference voltage.
NFB-IN - Negative feedback pin that is used for negative
output voltage sensing. It is connected to the inverting input
of the negative feedback amplifier through a 100K source
resistor.
NFB OUT - This pin is the output of the negative feedback
inverter. This pin should be connected the FB pin with a 10K
series resistor for negative output voltage regulation
applications.
CS - This is the input of the current sense comparator. The
IC has two different comparators: The PWM comparator and
an overcurrent comparator.
The overcurrent comparator is only intended for fault
sensing, and exceeding the overcurrent threshold will cause
a soft-start cycle.
GND - GND is a small signal reference ground for all analog
functions on this part.
PGND - This pin provides a dedicated ground for the output
gate driver. The GND and PGND pins should be connected
externally using a short printed circuit board trace close to
the IC. This is imperative to prevent large, high frequency
switching currents flowing through the ground metallization
inside the IC. (Decouple PV
CC
to PGND with a low ESR
0.1F capacitor.)
GATE - This is the device output. It is a high current power
driver capable of driving the gate of a power MOSFET with
peak currents exceeding 1.0A. This GATE output is actively
held low when V
CC
is below the UVLO threshold (3.7V typ).
The high-current power driver consists of FET output
devices, which can switch all the way to GND and all the way
to V
CC
. The output stage also provides very low impedance
to overshoot and undershoot.
PV
CC
- This pin is for separate collector supply to the output
gate drive. Separate PV
CC
and PGnd helps decouple the
IC’s analog circuitry from the high power gate drive noise.
Connect this pin to V
CC
with external short trace on printed
circuit board.
V
CC
- V
CC
is the power connection for the device. Although
quiescent V
CC
current is very low, total supply current will be
FIGURE 3. SUPPLY CURRENT vs TEMPERATURE FIGURE 4. CAPACITANCE vs FREQUENCY
Typical Performance Curves (Continued)
TEMPERATURE (°C)
-40 -20 25 60 85
5.0
4.0
3.0
2.0
1.0
0.5
0
CURRENT (mA)
4.5
3.5
2.5
1.5
CAPACITANCE (pF)
82 120 180 250
600
500
400
300
200
100
0
FREQUENCY (kHz)
300 390 510 610 820 1200
ISL6401

ISL6401CBZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers RSLIC PWM 0/+70C 14LD
Lifecycle:
New from this manufacturer.
Delivery:
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