PC123XNNSZ0F Series
1
Sheet No.: D2-A09501FEN
Date Sep. 1. 2006
© SHARP Corporation
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PC123XNNSZ0F
Series
DIP 4pin Reinforced Insulation Type
Photocoupler
■
Description
PC123XNNSZ0F Series
contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% at input current of 5mA
■
Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Current transfer ratio (CTR : MIN. 50% at I
F
=
5 mA,
V
CE
=
5V)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(V
iso
(rms) : 5kV)
8. RoHS directive compliant
■
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
fi le No. E64380 (as model No.
PC123
)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 fi le No. 7409, (as model No.
PC123
)
3. Approved by SEMKO, EN60065, EN60950, (as mod-
el No.
PC123
)
4. Approved by DEMKO, EN60065, EN60950, (as mod-
el No.
PC123
)
5. Approved by NEMKO, EN60065, EN60950, (as mod-
el No.
PC123
)
6. Approved by FIMKO, EN60065, EN60950, (as model
No.
PC123
)
7. Recognized by CSA fi le No. CA95323, (as model No.
PC123
)
8. Approved by VDE, DIN EN60747-5-2(
∗
) (as an op-
tion), fi le No. 40008087 (as model No.
PC123
)
9. Package resin : UL fl ammability grade (94V - 0)
(
∗
) DIN EN60747-5-2 : successor standard of DIN VDE0884.
■
Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection
