PC123X2YUP1B Datasheet PC123X2YFZ1B, PC123X2YUP1B, PC123XNYSZ1B | P10-P12

Sheet No.: D2-A09501FEN

PC123XNNSZ0F Series

■

Design Considerations

●

Design guide

While operating at I

<1mA, CTR variation may increase.

Please make design considering this fact.

This product is not designed against irradiation and incorporates non-coherent IRED.

●

Degradation

In general, the emission of the IRED used in photocouplers will degrade over time.

In the case of long term operation, please take the general IRED degradation (50% degradation over 5

years) into the design consideration.

●

Recommended foot print (reference)

SMT Gullwing lead-form Wide SMT Gullwing lead-form

8.2

2.54

1.7

2.2

10.2

2.54

1.7

2.2

(Unit : mm)

✩

For additional design assistance, please review our corresponding Optoelectronic Application Notes.

Sheet No.: D2-A09501FEN

PC123XNNSZ0F Series

■

Manufacturing Guidelines

●

Soldering Method

Reﬂ ow Soldering :

Reﬂ ow soldering should follow the temperature proﬁ le shown below.

Soldering should not exceed the curve of temperature proﬁ le and time.

Please don't solder more than twice.

Flow Soldering :

Due to SHARP's double transfer mold construction submersion in ﬂ ow solder bath is allowed under the be-

low listed guidelines.

Flow soldering should be completed below 270̊C and within 10s.

Preheating is within the bounds of 100 to 150̊C and 30 to 80s.

Please don't solder more than twice.

Hand soldering

Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.

Please don't solder more than twice

Other notice

Please test the soldering method in actual condition and make sure the soldering works ﬁ ne, since the im-

pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.

1234

300

200

100

(˚C)

Terminal : 260˚C peak

(package surface : 250˚C peak)

Preheat

150 to 180˚C, 120s or less

Reflow

220˚C or more, 60s or less

(min)

Sheet No.: D2-A09501FEN

PC123XNNSZ0F Series

●

Cleaning instructions

Solvent cleaning :

Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.

Ultrasonic cleaning :

The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,

size of PCB and mounting method of the device.

Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of

mass production.

Recommended solvent materials :

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.

In case the other type of solvent materials are intended to be used, please make sure they work ﬁ ne in ac-

tual using conditions since some materials may erode the packaging resin.

●

Presence of ODC

This product shall not contain the following materials.

And they are not used in the production process for this product.

Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)

Speciﬁ c brominated ﬂ ame retardants such as the PBB and PBDE are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated

diphenyl ethers (PBDE).

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P16

PC123X2YUP1B

Mfr. #:

Buy PC123X2YUP1B

Manufacturer:

Sharp Microelectronics

Description:

Transistor Output Optocouplers Photocoupler

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

PC123X2YUP1B

PC123X2YUP1B

Products related to this Datasheet