Characteristics STPS20200C
4/15 DocID024382 Rev 2
Figure 1. Average forward power dissipation
versus average forward current (per diode)
Figure 2. Forward voltage drop versus forward
current (per diode)
P (W)
F(AV)
0
1
2
3
4
5
6
7
8
9
10
0123456789101112
T
δ
=tp/T
tp
δ = 1
δ = 0.1
δ = 0.05
δ = 0.5
δ = 0.2
I (A)
F(AV)
I
FM
(A)
0.1
1.0
10.0
100.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
(Maximum values)
(Typical values)
(Maximum values)
T
j
= 25 °C
T
j
= 25 °C
T
j
= 125 °C
T
j
= 125 °C
(Typical values)
V
FM
(V)
Figure 3. Reverse leakage current versus
reverse voltage applied (typical values, per
diode)
Figure 4. Junction capacitance versus reverse
voltage applied (typical values, per diode)
I (mA)
R
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0 20 40 60 80 100 120 140 160 180 200
T
j
=150°C
T
j
=125°C
T
j
=25°C
T
j
=100°C
T
j
=50°C
T
j
=75°C
V (V)
R
C(pF)
10
100
1000
1 10 100 1000
F=1MHz
V
OSC
=30mV
RMS
T
j
=25°C
V(V)
R
Figure 5. Relative variation of thermal
impedance junction to case versus pulse
duration
Figure 6. Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220FPAB)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
TO-220AB / TO-220AB narrow leads / D²PAK
t (s)
p
T
δ
=tp/T
tp
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Single pulse
t (s)
p
T
δ
=tp/T
tp
DocID024382 Rev 2 5/15
STPS20200C Characteristics
Figure 7. Thermal resistance junction to ambient versus copper surface under tab
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
D²PAK
S
Cu
(cm²)
Epoxy printed circuit board FR4
copper thickness = 35 µm
Package information STPS20200C
6/15 DocID024382 Rev 2
2 Package information
Epoxy meets UL94, V0
Lead-free package
Cooling method: by conduction (C)
Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 8. TO-220AB dimension definitions
A
F
D1
J1
H1
P
Q
D
L1
L
b
E
e1
e
L20
L30
b1
c
Resin gate
0.5 mm max.
protrusion
(1)
Resin gate
0.5 mm max.
protrusion
(1)
(1) Resin gate position accepted in each of the two
position shown as well as the symmetrical opposites

STPS20200CG-TR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers 200V Schottky DC DC 45pF TO220PF 2000V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet