HMC8401 Data Sheet
Rev. 0 | Page 16 of 17
Wire Bonding
RF bonds made with 0.003 in. × 0.0005 in. gold ribbon are recom-
mended for the RF ports. These bonds must be thermosonically
bonded with a force of 40 g to 60 g. DC bonds of 1 mil (0.025 mm)
diameter, thermosonically bonded, are recommended. Create ball
bonds with a force of 40 g to 50 g and wedge bonds with a force
of 18 g to 22 g. Create all bonds with a nominal stage temperature
of 150°C. Apply a minimum amount of ultrasonic energy to
achieve reliable bonds. Keep all bonds as short as possible, less
than 12 mil (0.31 mm).
TYPICAL APPLICATION CIRCUIT
Figure 43. Typical Application Circuit
ASSEMBLY DIAGRAM
Figure 44. Assembly Diagram
GG
2
RFIN
RFOUT
DD
0.1µF
100pF
100pF
4.7µF
V
GG
1
4.7µF 0.1µF 100pF
4.7µF 0.1µF 100pF
4.7µF0.1µF
2
1
3
8
7
6
4
5
13850-043
+–
50Ω
TRANSMISSION
LINE
TO V
DD
SUPPLY
TO V
GG
2 SUPPLY
TO V
GG
1 SUPPLY
+
4.7µF
ALL BOND WIRES ARE
1mil DIAMETER
0.1µF
0.1µF
0.1µF
0.1µF
100pF
100pF
100pF
100pF
3mil NOMINAL GAP
+–
4.7µF
4.7µF
13850-044
–+
4.7µF
