7
LTC1645
1645fa
Hot Circuit Insertion
When a circuit board is inserted into a live backplane, the
supply bypass capacitors on the board can draw huge
transient currents from the backplane power bus as they
charge. These transient currents can cause permanent
damage to the connector pins and produce glitches on the
system supply, resetting other boards in the system.
The LTC1645 is designed to turn a board’s supply voltages
on and off in a controlled manner, allowing the board to be
safely inserted or removed from a live backplane. The chip
provides a system reset signal and a spare comparator to
indicate when board supply voltages drop below user-
programmable voltages, and a fault signal to indicate if an
overcurrent condition has occurred.
The LTC1645 can be located before or after the connector
as shown in Figure 1. A staggered PCB connector can
sequence pin connections when plugging and unplugging
circuit boards. Alternatively, the control signal can be
generated by processor control.
Power Supply Tracking and Sequencing
Some applications require that the potential difference
between two power supplies not exceed a certain voltage.
This requirement applies during power-up and power-
down as well as during steady state operation, often to
prevent latch-up in a dual supply ASIC. Other systems
require one supply to come up after another, for example,
if a system clock needs to start before a block of logic.
Typical dual supplies or backplane connections may come
up at arbitrary rates depending on load current, capacitor
size, soft-start rates, etc. Traditional solutions are cum-
bersome and require complex circuitry to meet the power
supply requirements.
The LTC1645 provides a simple solution to power supply
tracking and sequencing needs. The LTC1645 guarantees
supply tracking by ramping the supplies up and down
together (see Figure 15). The sequencing capabilities of
the LTC1645 allow nearly any combination of supply
ramping (e.g., see Figure 17) to satisfy various sequenc-
ing specifications. See the Power Supply Tracking and
Sequencing Applications section for more information.
APPLICATIO S I FOR ATIO
WUUU
SENSE
FAULT
V
CC
V
OUT
FAULT
ON
ON
GND
GATE
LTC1645
BACKPLANE
CONNECTOR
STAGGERED PCB
EDGE CONNECTOR
C
LOAD
+
V
CC
(a) Hot Swap Controller on Motherboard
SENSE
FAULT
V
CC
V
OUT
FAULT
ON
GND
GATE
LTC1645
1645 F01
C
LOAD
+
V
CC
BACKPLANE
CONNECTOR
STAGGERED PCB
EDGE CONNECTOR
(b) Hot Swap Controller on Daughterboard
Figure 1. Staggered Pins Connection
8
LTC1645
1645fa
Power Supply Ramping
The power supplies on a board are controlled by placing
external N-channel pass transistors in the power paths as
shown in Figure 2. Consult Table 1 for a selection of
N-channel FETs suitable for use with the LTC1645. R
SENSE1
and R
SENSE2
provide current fault detection and R1 and R2
prevent high frequency oscillation. By ramping the gates
of the pass transistors up and down at a controlled rate,
the transient surge current (I = C • dv/dt) drawn from the
main backplane supply is limited to a safe value when the
board makes connection.
When power is first applied to the chip, the gates of the
N-channels (GATE1 and GATE2 pins) are pulled low. After
the ON pin is held above 0.8V for at least one timing cycle,
the voltage at GATE1 begins to rise with a slope equal to
dv/dt = 10µA/C1 (Figure 3), where C1 is the external
capacitor connected between the GATE1 pin and GND. If
the ON pin is brought above 2V (and the ON pin has been
held above 0.8V for at least one timing cycle), the voltage
at GATE2 begins to rise with a slope equal to dv/dt =
10µA/C2.
The ramp time for each supply is t = (V
CC
n
• C
n
)/10µA. If
the ON pin is pulled below 2V for GATE2 or 0.8V for GATE1
(but above 0.4V), a 40µA current source is connected from
GATE
n
to GND, and the voltage at the GATE
n
pin will ramp
down, as shown in Figure 4.
Ringing
Good engineering practice calls for bypassing the supply
rail of any circuit. Bypass capacitors are often placed at the
supply connection of every active device, in addition to one
or more large value bulk bypass capacitors per supply rail.
If power is connected abruptly, the bypass capacitors slow
the rate of rise of voltage and heavily damp any parasitic
resonance of lead or trace inductance working against the
supply bypass capacitors.
The opposite is true for LTC1645 Hot Swap circuits on a
daughterboard. In most cases, on the powered side of the
N-channel FET switches (V
CC
n
) there is no supply bypass
capacitor present. An abrupt connection, produced by
plugging a board into a backplane connector, results in a
fast rising edge applied to the V
CC
n
line of the LTC1645.
APPLICATIO S I FOR ATIO
WUUU
Figure 4. Supply Turning Off
Figure 3. Supply Turning On
Figure 2. Typical Hot Swap Connection
R
SENSE2
Q1
Q2
R2
10
C2
C
TIMER
C
LOAD1
C
LOAD2
R1
10
C1
12
1
2
3
8
9
6
5
11 7
1314
10
4
V
CC1
ON
FAULT
SENSE1 GATE2
V
CC2
V
CC2
V
CC1
V
OUT2
V
OUT1
LTC1645
(14-LEAD)
TIMER GND
COMP
+
COMPOUT
FB
SENSE2GATE1
1645 F02
RESET
+
+
R
SENSE1
V
CC
n
V
OUT
n
V
CC
n
+ V
GATE
1645 F03
t
1
t
2
GATE
n
SLOPE = 10µA/C
n
V
CC
n
V
OUT
n
V
CC
n
+ V
GATE
1645 F04
t
3
t
4
GATE
n
SLOPE = 40µA/C
n
9
LTC1645
1645fa
APPLICATIO S I FOR ATIO
WUUU
(a) Undamped V
CC
Waveform (48" Leads) (b) Undamped V
CC
Waveform (8" Leads)
Figure 5. Ring Experiment
No bulk capacitance is present to slow the rate of rise and
heavily damp the parasitic resonance. Instead, the fast
edge shock excites a resonant circuit formed by a combi-
nation of wiring harness, backplane and circuit board
parasitic inductances and FET capacitance. In theory, the
peak voltage should rise to 2X the input supply, but in
practice the peak can reach 2.5X, owing to the effects of
voltage dependent FET capacitance.
The absolute maximum V
CC
n
potential for the LTC1645 is
13.2V; any circuit with an input of 5V or greater should be
scrutinized for ringing. A well-bypassed backplane should
not escape suspicion: circuit board trace inductances of as
little as 10nH can produce sufficient ringing to overvoltage
V
CC
.
Check ringing with a fast storage oscilloscope (such as a
LECROY 9314AL DSO) by attaching coax or a probe to V
CC
and GND, then repeatedly inserting the circuit board into
the backplane. Figures 5a and 5b show typical results in a
12V application with different V
CC
lead lengths. The peak
amplitude reaches 22V, breaking down the ESD protection
diode in the process.
There are two methods for eliminating ringing: clipping
and snubbing. A transient voltage suppressor is an effec-
tive means of limiting peak voltage to a safe level.
Figure␣ 6 shows the effect of adding an ON Semiconductor,
1SMA12CAT3, on the waveform of Figure 5.
Figures 7a and 7b show the effects of snubbing with
different RC networks. The capacitor value is chosen as
10X to 100X the FET C
OSS
under bias and R is selected for
best damping—1 to 50 depending on the value of
parasitic inductance.
V
OUT
0.1µF
1645 F05
10
R1
0.01
12V
IRF7413
C
LOAD
+
+
LTC1645
POWER
LEADS
SCOPE
PROBE
8'
1
µs/DIV
1645 F05a
4V/DIV
0V
24V
1µs/DIV
4V/DIV
1645 F05b
0V
24V

LTC1645CS8#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Hot Swap Voltage Controllers 2x-Ch Hot Swap Cntr/Pwr Sequencer
Lifecycle:
New from this manufacturer.
Delivery:
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