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RTP200HR010SA

P1-P3P4-P5
High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: B
REV DATE: JANUARY 16, 2014
PAGE NO.: 1 OF 5
Specification Status: Released
PIN CONFIGURATION AND DESCRIPTION:
Pth
P Arm
P1
D2 хххх
Note: D2 is product code
xxxx is Batch code
TABLE 1. DIMENSIONS:
A
B
C
D
E
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
11.35
11.85
3.00
3.70
5.70
6.40
7.90
8.40
1.30
1.60
(0.447)
(0.467)
(0.118)
(0.146)
(0.224)
(0.252)
(0.311)
(0.331)
(0.051)
(0.063)
High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: B
REV DATE: JANUARY 16, 2014
PAGE NO.: 2 OF 5
TABLE 2. ABSOLUTE MAX RATINGS:
Absolute Max Ratings
Max
Units
Conditions
Max DC Open Voltage
1
16
V
DC
Max DC Interrupt Current
1
500
A
@ 16 VDC
ESD rating (Human Body Model)
25
KV
Max Reflow Temperature (pre-arming)
260
°C
Operating temperature limits, Junction
(Pth) and Storage Temperature
-55
150
°C
175
°C
10A, 100 h
1. Performance capability at these conditions can be influenced by board design. Performance should be
verified in the user’s system.
TABLE 3. PERFORMANCE CHARACTERISTICS (Typical unless otherwise specified):
Resistance and Open Characteristics
P
1
to P
TH
Min
Typ
Max
Units
R
PP
(Resistance from
P
1
to P
TH
)
@ 23+/-3°C
100
150
µΩ
@ 150+/-3°C
150
250
Operating Voltage
16
V
DC
Open Temperature, post-arming
I
PP
= 0
202
210
218
°C
Installation dependent Operating Current, post-
arming
2
@ 23+/-3°C
90
A
@ 140+/-3°C
45
Moisture Sensitivity Level Rating
3
1
2. Results obtained on 44.4mm x 57.2mm x 1.6mm of 2-sided FR4 board T4350 with 4.0 oz Copper trace.
RTP device pad connection of:
- 283 sq. mm 4.0 oz copper heat spreader connected to I P1 pad.
- 237 sq. mm 4.0 oz copper heat spreader connected to I PTH pad.
Results are highly installation-dependent. Users should confirm for their own applications.
3. As per JEDEC J-STD-020C
High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: B
REV DATE: JANUARY 16, 2014
PAGE NO.: 3 OF 5
TABLE 4. ARMING CHARACTERISTICS:
Arming Characteristics
ARM
Min
Typ
Max
Units
Arming Type
Electronically Armed
R
ARM
(Resistance from
ARM to P
1
or P
TH
)
Pre-Arming
500
mΩ
Post-Arming
10
KΩ
Arming Current (I
ARM
)
4
@ 23 +/-3°C
2
5
A
Arming Time (@23 +/-3°C)
4
@ 2A
0.020
Sec
@ 5A
0.005
4. Results obtained on 44.4mm x 57.2mm x 1.6mm of 2-sided FR4 board T4350 with 4.0 oz Copper trace.
RTP device pad connection of:
- 283 sq. mm 4.0 oz copper heat spreader connected to I P1 pad.
- 237 sq. mm 4.0 oz copper heat spreader connected to I PTH pad.
Solder Reflow Recommendation:
P1-P3P4-P5

RTP200HR010SA

Mfr. #:
Buy RTP200HR010SA
Manufacturer:
Littelfuse
Description:
Thermal Cutoffs Reflowable Thermal Protection
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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