High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: B
REV DATE: JANUARY 16, 2014
PAGE NO.: 5 OF 5
Precedence: This specification takes precedence over documents referenced herein.
Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid.
Important Installation Instructions:
Note 1: RTP200HR010SA devices are to be board-mounted using only solder pastes referenced in Engineering Report: Q40213
Note 2: RTP200HR010SA devices are not compatible with conformal coating. If selective coatings are used, avoid covering the
RTP200HR010SA device.
MATERIALS INFORMATION
RoHS Compliant ELV Compliant Pb-Free Halogen Free*
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test
each product selected for their own applications. Tyco Electronics Corporation and its affiliates in the TE Connectivity Ltd. group of
companies (“TE”) reserves the right to change or update, without notice, any information contained in this publication; to change,
without notice, the design, construction, processing, or specification of any product; and to discontinue or limit production or distribution
of any product. This publication supersedes and replaces all information previously supplied. Without express written consent by an
officer of TE, TE does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in critical
life support devices or systems. TE expressly disclaims all implied warranties regarding the information contained herein, including, but
not limited to, any implied warranties of merchantability or fitness for a particular purpose. TE’s only obligations are those in the TE
Standard Terms and Conditions of Sale and in no case will TE be liable for any incidental, indirect, or consequential damages arising
from the sale, resale, use, or misuse of its products.
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