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ADM3095ETRZ-EP-R7

P1-P3P4-P6P7-P9P10-P12P13-P14
ADM3095E-EP Enhanced Product
Rev. 0 | Page 4 of 14
SPECIFICATIONS
V
CC
= 3.0 V to 5.5 V, T
A
= −55°C (T
MIN
) to 125°C (T
MAX
), unless otherwise noted.
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
DRIVER
Differential Output Voltage (V
OD
)
1.5 5.0 V V
CC
≥ 3.0 V, R = 27 Ω or 50 Ω; see Figure 25
2.1 5.0 V V
CC
≥ 4.5 V, R = 27 Ω or 50 Ω; see Figure 25
Differential Output Voltage over Common
Mode Range |V
OD3
|
1.5 5.0 V V
CC
≥ 3.0 V, V
CM
= −25 V to +25 V; see Figure 26
2.1 5.0 V V
CC
≥ +4.5 V, V
CM
= −25 V to +25 V; see Figure 26
∆|V
OD
| for Complementary Output States 0.2 V R = 27 Ω or 50 Ω; see Figure 25
Common-Mode Output Voltage (V
OC
) 3 V R = 27 Ω or 50 Ω; see Figure 25
∆|V
OC
| for Complementary Output States 0.2 V R = 27 Ω or 50 Ω; see Figure 25
Output Short-Circuit Current (V
OUT
)
High −250 +250 mA −42 V ≤ V
SC
1
≤ +42 V
Low
−250
+250
mA
−42 V ≤ V
SC
1
≤+42 V
DRIVER INPUT LOGIC
Input Logic Threshold Low 0.33 V
IO
V 1.62 V ≤ V
IO
≤ 5.5 V
Input Logic Threshold High 0.7 V
IO
V 1.62 V ≤ V
IO
≤ 5.5 V
Logic Input Current ±1 µA 0 ≤ V
IN
≤ V
IO
RECEIVER
Differential Input Threshold Voltage (V
TH
) −200 −125 −30 mV −25 V ≤ V
CM
≤ +25 V
Input Hysteresis (ΔV
TH
) 30 mV −25 V ≤ V
CM
≤ +25 V
Input Resistance (A, B) 96 kΩ −25 V ≤ V
CM
≤ +25 V
Input Capacitance (A, B) 150 pF T
A
= 25
o
C
Input Current (A, B) −1.0 +1.0 mA DE = 0 V, V
CC
= 0 V or +5 V, V
IN
= ±25 V
−1.0
+1.0
mA
DE = 0 V, V
CC
= 0 V or +5 V, V
IN
= ±42 V
CMOS Logic Input Current (
RE
) ±1 µA
Output Voltage
Low (V
OL
) 0.2 V I
OUT
= 300 µA
High (V
OH
) V
IO
− 0.2 V V
IO
≥ +1.62 V, I
OUT
= −300 µA
Output Short-Circuit Current 4 85 mA V
OUT
= GND or V
IO
,
RE
= 0 V, V
IO
≥ 3.0 V
85 mA V
OUT
= GND/V
IO
,
RE
= 0 V, V
IO
< 3.0 V
Three-State Output Leakage Current ±2 µA
RE
= V
IO
, RxD = 0 V or V
IO
POWER SUPPLY
V
IO
1.62 V
CC
V
Supply Current (I
CC
)
8
mA
No load, DE = V
CC
= V
IO
,
RE
= 0 V
TxD Data Rate = 2.5 Mbps 50 mA No load, DE = V
CC
= V
IO
,
RE
= V
CC
= V
IO
RxD Data Rate = 2.5 Mbps 6 mA No load, DE = 0 V,
RE
= 0 V
TxD/RxD Data Rate = 2.5 Mbps 90 mA No load, DE = V
CC
= V
IO
,
RE
= 0 V
TxD/RxD Data Rate = 2.5 Mbps
130 mA R
L
= 54 Ω, DE = V
CC
= V
IO
,
RE
= 0 V
90 mA R
L
= 54 Ω, DE = V
CC
= V
IO
,
RE
= 0 V, V
CC
= 5.5 V
45 mA R
L
= 54 Ω, DE = V
CC
= V
IO
,
RE
= 0 V, V
CC
= 3.0 V
Supply Current in Shutdown Mode 5 µA DE = 0 V,
RE
= V
CC
= V
IO
1
V
SC
is the short-circuit voltage at the RS-485 A or B bus pin.
Enhanced Product ADM3095E-EP
Rev. 0 | Page 5 of 14
TIMING SPECIFICATIONS
V
CC
= 3.0 V to 5.5 V, V
IO
= 1.62 V to V
CC
, T
A
= −55°C (T
MIN
) to 125°C (T
MAX
), unless otherwise noted.
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
DRIVER
Data Rate 2.5 Mbps
Propagation Delay (t
PLH
, t
PHL
) 35 500 ns R
LDIFF
= 54 Ω, C
L1
= C
L2
= 100 pF; see Figure 2 and Figure 27
Differential Skew (t
SKEW
) 10 50 ns R
LDIFF
= 54 Ω, C
L1
= C
L2
= 100 pF; see Figure 2 and Figure 27
Rise/Fall Times (t
R
, t
F
) 40 130 ns R
LDIFF
= 54 Ω, C
L1
= C
L2
= 100 pF; see Figure 2 and Figure 27
Enable Time (t
ZH
, t
ZL
) 500 2500 ns R
L
= 110 Ω, C
L
= 50 pF, see Figure 4 and Figure 28
Disable Time (t
HZ
, t
LZ
) 500 2500 ns R
L
= 110 Ω, C
L
= 50 pF, see Figure 4 and Figure 28
Enable Time from Shutdown 4000 5500 ns R
L
= 110 Ω, C
L
= 50 pF, see Figure 4 and Figure 28
RECEIVER
Propagation Delay (t
PLH
, t
PHL
) 120 200 ns C
L
= +15 pF, V
ID
1
≥ ±1.5 V; see Figure 3 and Figure 29
140 220 ns C
L
= +15 pF, V
ID
1
≥ ±600 mV; see Figure 3 and Figure 29
Skew (t
SKEW
) 4 40 ns C
L
= +15 pF, V
ID
1
≥ ±1.5 V; see Figure 3 and Figure 29
Enable Time (t
ZH
, t
ZL
) 12 55 ns R
L
= 1 kΩ, C
L
= 15 pF; see Figure 5 and Figure 30
Disable Time (t
HZ
, t
LZ
) 12 55 ns R
L
= 1 kΩ, C
L
= 15 pF; see Figure 5 and Figure 30
Enable Time from Shutdown 3000 4500 ns R
L
= 1 kΩ, C
L
= 15 pF; see Figure 5 and Figure 30
Time to Shutdown 50 330 3000 ns R
L
= 1 kΩ, C
L
= 15 pF; see Figure 5 and Figure 30
Rx, Pulse Width Distortion 40 ns C
L
= +15 pF, V
ID
1
≥ ±1.5 V; see Figure 3 and Figure 29
1
V
ID
is the input differential voltage to the RS-485 receiver.
TIMING DIAGRAMS
V
IO
TxD
V
DIFF
0V
V
OD
+V
OD
–V
OD
A
B
V
O
t
R
t
F
t
PLH
t
PHL
90% POINT
10% POINT
90% POINT
10% POINT
V
DIFF
=
(
V
A
)
–
(
V
B
)
1/2V
OD
1/2V
IO
1/2V
IO
NOTES
1. V
OD
IS THE DIFFERENCE BETWEEN A AND B,
WITH +V
OD
BEING THE MAXIMUM POINT OF V
OD
,
AND –V
OD
BEING THE MINIMUM POINT OF V
OD
.
15680-027
Figure 2. Driver Propagation Delay, Rise/Fall Timing Diagram
1/2V
IO
1/2V
IO
t
PLH
t
PHL
RxD
V
OH
0VA – B
0V
V
OL
t
SKEW
=
|t
PLH
–
t
PHL
|
15680-028
Figure 3. Receiver Propagation Delay Timing Diagram
A OR B
A OR B
DE
V
IO
0V
0V
V
OH
V
OL
1/2V
IO
1/2V
IO
1/2V
CC
1/2V
CC
t
LZ
t
ZL
t
HZ
t
ZH
V
OL
+ 0.5V
V
OH
– 0.5V
15680-029
Figure 4. Driver Enable/Disable Timing Diagram
RxD
RxD
RE
V
IO
0V
0V
1/2V
IO
1/2V
IO
OUTPUT HIGH
OUTPUT LOW
t
LZ
t
ZL
t
HZ
t
ZH
V
OL
+ 0.5V
V
OH
– 0.5V
V
OH
V
OL
1/2V
IO
1/2V
IO
15680-030
Figure 5. Receiver Enable/Disable Timing Diagram
ADM3095E-EP Enhanced Product
Rev. 0 | Page 6 of 14
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
CC
to GND −0.5 V to +7 V
V
IO
to GND −0.5 V to +7 V
Digital Input/Output Voltage (DE,
RE
,
TxD, RxD)
−0.3 V to V
IO
+ 0.3 V
Driver Output/Receiver Input Voltage ±48 V
Military Operating Temperature Range −55°C to +125°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
Continuous Total Power Dissipation 400 mW
Lead Temperature
Soldering (10 sec) 300°C
Vapor Phase (60 sec) 215°C
Infrared (15 sec)
220°C
ESD (A and B pins only)
IEC 61000-4-2 Contact Discharge ±8 kV
IEC 61000-4-2 Air Discharge ±15 kV
Electrical Fast Transients (EFT)
(A and B Pins Only)
IEC 61000-4-4 Level 4 EFT ±2 kV
Surge (A and B pins only)
IEC 61000-4-5 Level 4 Surge ±4 kV
Human Body Model (HBM) ESD Protection
All Pins ±4 kV
A and B Pins Only >±30 kV
Field Induced Charged Device Model
(FICDM) ESD
±1.25 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 4. Thermal Resistance
Package Type θ
JA
1
θ
JC
1
Unit
R-16 50.9 18.9 °C/W
1
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board with no vias. See JEDEC JESD51.
ESD CAUTION
P1-P3P4-P6P7-P9P10-P12P13-P14

ADM3095ETRZ-EP-R7

Mfr. #:
Buy ADM3095ETRZ-EP-R7
Manufacturer:
Analog Devices Inc.
Description:
RS-485 Interface IC Transceiver,Level 5 EMC Protected RS-486
Lifecycle:
New from this manufacturer.
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