PCA9552_5 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 05 — 9 March 2006 25 of 28
Philips Semiconductors
PCA9552
16-bit I
2
C-bus LED driver with programmable blink rates
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
.
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
Table 16: Abbreviations
Acronym Description
CDM Charged Device Model
DSP Digital Signal Processor
ESD ElectroStatic Discharge
HBM Human Body Model
GPIO General Purpose Input/Output
IC Integrated Circuit
I
2
C-bus Inter IC bus
LED Light Emitting Diode
MCU Microcontroller
MM Machine Model
MPU Microprocessor
POR Power-On Reset
PWM Pulse Width Modulation
SMBus System Management Bus
PCA9552_5 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 05 — 9 March 2006 26 of 28
Philips Semiconductors
PCA9552
16-bit I
2
C-bus LED driver with programmable blink rates
17. Revision history
Table 17: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
PCA9552_5 20060309 Product data sheet - - PCA9552_4
Modifications:
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
Table 1 “Ordering information”: changed Topside mark of TSSOP24 package from
‘PCA9552PW’ to ‘PCA9552’
Table 2 “Pin description”: added Table note 1 regarding V
SS
pin on HVQFN24 package
Section 6.6 “External RESET”: changed symbol “t
W
” to “t
w(rst)
Figure 11: changed symbol “t
pv
” to “t
v(Q)
Figure 13: changed symbol “t
ph
” to “t
h(D)
”; changed symbol “t
ps
” to “t
su(D)
Section 8.1 “Minimizing I
DD
when the I/O is used to control LEDs”:
1st paragraph, 3rd sentence: changed symbol “I
DD
” to “I
stb
2nd paragraph, 4th sentence: changed symbol “V
IN
” to “V
I
Table 12 “Limiting values”:
changed parameter description of V
I/O
from “DC voltage on an I/O” to “voltage on an
input/output pin”
changed symbol “I
I/O
(DC output current on an I/O)” to ‘I
O(LEDn)
(output current on pin LEDn)
Table 13 “Static characteristics”:
moved second sentence of description below title to (new)
Table note 1 and added its
reference at column “Typ”
changed symbol “I
DD
” to “I
stb
under subsection “I/Os”, changed symbol “I
L
” to “I
LI
Table 14 “Dynamic characteristics”:
updated parameter descriptions
under subsection “Port timing”: changed symbol “t
PV
” to “t
v(Q)
”; changed symbol “t
PS
” to
“t
su(D)
”; changed symbol “t
PH
” to “t
h(D)
under subsection “Reset”: changed symbol “t
W
”to“t
w(rst)
”; changed symbol “t
REC
”to“t
rec(rst)
”;
changed symbol “t
RESET
” to “t
rst
” (also in Table note 5)
Figure 21 “Reset timing” modified to harmonize letter symbols
PCA9552_4 20041001 Product data sheet - 9397 750 13727 PCA9552_3
PCA9552_3 20030502 Product data 853-2374 29857
of 2003 Apr 24
9397 750 11463 PCA9552_2
PCA9552_2 20030224 Product data 853-2374 29331
of 2002 Dec 20
9397 750 11156 PCA9552_1
PCA9552_1 20020927 Product data 853-2374 28878
of 2002 Sep 09
9397 750 10329 -
Philips Semiconductors
PCA9552
16-bit I
2
C-bus LED driver with programmable blink rates
PCA9552_5 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 05 — 9 March 2006 27 of 28
18. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
20. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
21. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
I
2
C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.
22. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status
[1]
Product status
[2] [3]
Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

PCA9552BS,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
LED Lighting Drivers 16-BIT I2C FM OD LED BLK RST
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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