SI1414DH-T1-GE3

Si1414DH
www.vishay.com
Vishay Siliconix
S14-1224-Rev. C, 16-Jun-14
1
Document Number: 67073
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 30 V (D-S) MOSFET
Marking Code: AP
Ordering Information:
Si1414DH-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
TrenchFET
®
power MOSFET
100 % R
g
tested
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
•DC/DC converters
Boost converters
•Load switches
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 125 °C/W.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A)
a
Q
g
(TYP.)
30
0.046 at V
GS
= 4.5 V 4
5.7 nC0.050 at V
GS
= 2.5 V 4
0.057 at V
GS
= 1.8 V 4
SOT-363
SC-70 Single (6 leads)
Top View
1
D
2
D
3
G
D
6
D
5
S
4
N-Channel MOSFET
G
D
S
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
30
V
Gate-Source Voltage V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
T
F
= 25 °C
I
D
4
a
A
T
F
= 70 °C 4
a
T
A
= 25 °C 4
a, b, c
T
A
= 70 °C 3.7
a, b, c
Pulsed Drain Current I
DM
20
Continuous Source-Drain Diode Current
T
F
= 25 °C
I
S
2.3
T
A
= 25 °C 1.3
b, c
Maximum Power Dissipation
T
F
= 25 °C
P
D
2.8
W
T
F
= 70 °C 1.8
T
A
= 25 °C 1.56
b, c
T
A
= 70 °C 1
b, c
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum Junction-to-Ambient
b, d
t 5 s R
thJA
60 80
°C/W
Maximum Junction-to-Foot (Drain) Steady State R
thJF
34 45
Si1414DH
www.vishay.com
Vishay Siliconix
S14-1224-Rev. C, 16-Jun-14
2
Document Number: 67073
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 30 - - V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 μA
-31-
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
--2.7-
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 0.4 - 1 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 8 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 30 V, V
GS
= 0 V - - 1
μA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C - - 10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V 10 - - A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 4.5 V, I
D
= 4 A - 0.037 0.046
ΩV
GS
= 2.5 V, I
D
= 2 A - 0.041 0.050
V
GS
= 1.8 V, I
D
= 1 A - 0.046 0.057
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 4 A - 30 - S
Dynamic
b
Input Capacitance C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
- 560 -
pFOutput Capacitance C
oss
-60-
Reverse Transfer Capacitance C
rss
-27-
Total Gate Charge Q
g
V
DS
= 15 V, V
GS
= 8 V, I
D
= 3.4 A - 10 15
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 3.4 A
-5.78.6
Gate-Source Charge Q
gs
-0.85-
Gate-Drain Charge Q
gd
-0.75-
Gate Resistance R
g
f = 1 MHz 0.6 3 6 Ω
Turn-On Delay Time t
d(on)
V
DD
= 15 V, R
L
= 4.3 Ω
I
D
3.5 A, V
GEN
= 4.5 V, R
g
= 1 Ω
-612
ns
Rise Time t
r
-1020
Turn-Off Delay Time t
d(off)
-2040
Fall Time t
f
-1020
Turn-On Delay Time t
d(on)
V
DD
= 15 V, R
L
= 4.3 Ω
I
D
3.5 A, V
GEN
= 8 V, R
g
= 1 Ω
-510
Rise Time t
r
-1020
Turn-Off Delay Time t
d(off)
-1730
Fall Time t
f
-1020
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
T
C
= 25 °C - - 1.5
A
Pulse Diode Forward Current I
SM
--20
Body Diode Voltage V
SD
I
S
= 3.5 A, V
GS
= 0 V - 0.8 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= 3.5 A, dI/dt = 100 A/μs, T
J
= 25 °C
-1530ns
Body Diode Reverse Recovery Charge Q
rr
- 6 12 nC
Reverse Recovery Fall Time t
a
-8-
ns
Reverse Recovery Rise Time t
b
-7-
Si1414DH
www.vishay.com
Vishay Siliconix
S14-1224-Rev. C, 16-Jun-14
3
Document Number: 67073
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
4
8
12
16
20
0 0.5 1.0 1.5 2.0 2.5 3.0
V
GS
=5 Vthru2V
V
GS
=1V
V
GS
=1.5V
V
GS
=0.5V
V
DS
- Drain-to-Source Voltage (V)
I
D
- Drain Current (A)
0.02
0.03
0.04
0.05
0.06
048121620
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
V
GS
=4.5V
V
GS
=1.8V
V
GS
=2.5V
0
2
4
6
8
0246810
I
D
=4.3A
V
DS
=15V
V
DS
=24V
V
DS
=7.5V
Q
g
- Total Gate Charge (nC)
V
GS
- Gate-to-Source Voltage (V)
0
2
4
6
8
10
0 0.3 0.6 0.9 1.2 1.5
T
C
= 125 °C
T
C
= 25 °C
T
C
= - 55 °C
V
GS
- Gate-to-Source Voltage (V)
I
D
- Drain Current (A)
C
rss
0
200
400
600
800
0 5 10 15 20 25 30
C
iss
C
oss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)

SI1414DH-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 78-SI1416EDH-T1-GE3
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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