NFW31SP507X1E4L Datasheet NFW31SP507X1E4L, NFW31SP157X1E4L, NFW31SP506X1E4L | P7-P9

Spec. No. JENF243E-0009J-01 P7/ 10

MURATA MFG. CO., LTD.

Reference Only

13.3. Attention Regarding P.C.B. Bending

The following shall be considered when designing P.C.B.'s and laying out products.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

〔Products direction〕

Products shall be located in the sideways direction

(Length: a < b) to the mechanical stress.

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1

(2) Add slits in the board separation part. A > B

(3) Keep the mounting position of the component away from the board separation surface. A > C

*1 A > D is valid when stress is added vertically to the perforation as with

Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB,

therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.

13.4. Attention Regarding P.C.B. Design

< The Arrangement of Products >

•P.C.B. shall be designed so that products are

far from the portion of perforation.

•The portion of perforation shall be designed

as narrow as possible, and shall be designed

so as not to be applied the stress in the case

of P.C.B. separation.

•Products shall not be arranged on the line of a series of holes

when there are big holes in P.C.B..

(Because the stress concentrate on the line of holes.)

〈

Poor example

〉

〈

Good example

〉

Product

P.C.B.

Hole

○

Perforation

Slit

Screw Hole

Recommended

Spec. No. JENF243E-0009J-01 P8/ 10

MURATA MFG. CO., LTD.

Reference Only

< Products Placing >

•Support pins shall be set under P.C.B. to prevent causing a warp to

P.C.B. during placing the products on the other side of P.C.B.

< P.C.B. Separation >

•P.C.B. shall not be separated with hand.

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.

13.5. Standard Soldering Conditions

On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, and

solder temperature and immersion time (melting time) because longer soldering time may cause the corrosion of

the electrode.

On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, and

preheat and so on because de-wetting may be caused.

Standard soldering profile and the limit soldering profile is as follows.

The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

< Flow Soldering Profile >

Standard Profile Limit Profile

Pre-heating 150°C , 60s min.

Heating 250°C , 4s ~ 6s 265°C ± 3°C, 5s max.

Cycle of flow 2 times 1 time

< Reflow Soldering Profile >

Standard Profile Limit Profile

Pre-heating 150°C ~ 180°C , 90s ± 30s

Heating above 220°C , 30s ~ 60s above 230°C , 60s max.

Peak temperature 245°C ± 3°C 260°C , 10s

Cycle of reflow 2 times 1 time

Pick-up nozzle

Support pin

P.C.B.

265°C±3°C

250°C

60s min.

150

Limit Profile

Time.(s)

(

°C

)

Temp.

Heating Time

Standard Profile

Limit Profile

Standard Profile

90s±30s

230°C

260°C

245°C±3°C

220°C

30s

～

60s

60s max.

180

150

Temp.

Time.(s)

(°C)

Spec. No. JENF243E-0009J-01 P9/ 10

MURATA MFG. CO., LTD.

Reference Only

13.6. Printing of Adhesive (Flow Soldering)

Adhesive amount shall be about 0.2 mg per chip to obtain enough adhesive strength.

The adhesive position is as follows.

13.7. Solder paste printing for reflow <Standard printing pattern of solder paste. >

・Standard thickness of solder paste should be

150 to 200 µm.

・Use the solder paste printing pattern of the right pattern.

・For the resist and copper foil pattern, use standard

land dimensions.

13.8. Reworking with Soldering iron

The following conditions shall be strictly followed when using a soldering iron.

• Pre-heating : 150°C, 1 min • Soldering iron output : 30W max.

• Tip temperature : 350°C max. • Tip diameter : φ3mm max.

• Soldering time : 3(+1,-0) s • Times : 2times max.

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on

the ceramic material due to the thermal shock.

13.9. Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60 °C max. (40°C max. for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at

the mounted products and P.C.B..

Power: 20W / l max. Frequency: 28kHz ~ 40kHz Time: 5 minutes max.

(3) Cleaner

1. Cleaner

· Isopropyl alcohol (IPA)

2. Aqueous agent

· PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to

remove the cleaner.

(5) Other cleaning

Please contact us.

13.10. Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the performance, such as

insulation resistance may result from the use.

(1) in the corrodible atmosphere (acidic gases , alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

13.11. Resin coating

In case of coating/molding products the products with the resin, an open circuit issue may occur by mechanical

stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some

impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause

corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case

of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is

observed by evaluating products mounted on your board.

(in mm)

0.6

2.2

4.2

2.6

0.6

1.0

Adhesive

Position of adhesive

P1-P3 P4-P6 P7-P9 P10-P10

NFW31SP507X1E4L

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EMI Filter Circuits 500MHZ C/O 25V 0.2A

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NFW31SP507X1E4L

NFW31SP507X1E4L

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