7
FN9257.2
March 7, 2008
reference input (positive terminal of error amp) from GND to
VREF (0.597V nominal). If the ISL8104 is utilizing an
externally supplied reference, when the voltage on the SS pin
reaches 1V, the internal reference input (into the error amp)
ramps from GND to the externally supplied reference at the
same rate as the voltage on the SS pin. Figure 3 shows a
typical soft-start interval. The rise time of the output voltage is,
therefore, dependent upon the value of the soft-start
capacitor, C
SS
. If the internal reference is used, then the
soft-start capacitance value can be calculated through
Equation 3:
If an external reference is used then the soft-start
capacitance can be calculated through Equation 4:
Prebiased Load Start-up
Drivers are held in tri-state (TGATE pulled to LX, BGATE
pulled to PGND) at the beginning of a soft-start cycle until
two PWM pulses are detected. The bottom-side MOSFET is
turned on first to provide for charging of the bootstrap
capacitor. This method of driver activation provides support
for start-up into prebiased loads by not activating the drivers
until the control loop has entered its linear region, thereby
substantially reducing output transients that would otherwise
occur had the drivers been activated at the beginning of the
soft-start cycle.
SSDONE
Soft-start done is only available in the 16 Ld QFN packaging
option of the ISL8104. When the soft-start pin reaches 4V, an
open drain signal is provided to support sequencing
requirements. SSDONE is deasserted by disabling of the part,
including pulling SS low, and by POR and OCP events.
Oscillator
The oscillator is a triangular waveform, providing for leading
and falling edge modulation. The peak-to-peak of the ramp
amplitude is set at 1.9V and varies as a function of frequency.
At 50kHz the peak to peak amplitude is approximately 1.8V
while at 1.5MHz it is approximately 2.2V. In the event the
regulator operates at 100% duty cycle for 64 clock cycles an
automatic boot cap refresh circuit will activate turning on
BGATE for approximately 1/2 of a clock cycle.
Overcurrent Protection
The OCP function is enabled with the drivers at start-up.
OCP is implemented via a resistor (R
TSOC
) and a capacitor
(C
TSOC
) connecting the TSOC pin and the drain of the
top-side MOSEFT. An internal 200
mA current source
develops a voltage across R
TSOC
, which is then compared
with the voltage developed across the top-side MOSFET at
turn on as measured at the LX pin. When the voltage drop
across the MOSFET exceeds the voltage drop across the
resistor, a sourcing OCP event occurs. C
TSOC
is placed in
parallel with R
TSOC
to smooth the voltage across R
TSOC
in
the presence of switching noise on the input bus.
A 120ns blanking period is used to reduce the current
sampling error due to leading-edge switching noise. An
additional simultaneous 120ns low pass filter is used to
further reduce measurement error due to noise.
OCP faults cause the regulator to disable (top- and
bottom-side drives disabled, SSDONE pulled low, soft-start
capacitor discharged) itself for a fixed period of time, after
which a normal soft-start sequence is initiated. If the voltage
on the SS pin is already at 4V and an OCP is detected, a
30μA current sink is immediately applied to the SS pin. If an
OCP is detected during soft-start, the 30µA current sink will
not be applied until the voltage on the SS pin has reached 4V.
This current sink discharges the C
SS
capacitor in a linear
fashion. Once the voltage on the SS pin has reached
approximately 0V, the normal soft-start sequence is initiated. If
the fault is still present on the subsequent restart, the ISL8104
C
SS
30μAt
SS
2V
----------------------------
=
(EQ. 3)
C
SS
30μAt
SS
V
REFEXT
----------------------------
=
(EQ. 4)
FIGURE 3. TYPICAL SOFT-START INTERVAL
V
EN
V
OUT
V
SS
t
SS
FIGURE 4. TYPICAL OVERCURRENT PROTECTION
V
SSDONE
V
SS
I
LOAD
t
HICCUP
I
OCP
ISL8104
8
FN9257.2
March 7, 2008
will repeat this process in a hiccup mode. Figure 4 shows a
typical reaction to a repeated overcurrent condition that
places the regulator in a hiccup mode. If the regulator is
repeatedly tripping overcurrent, the hiccup period can be
approximated by Equation 5:
The OCP trip point varies mainly due to MOSFET r
DS(ON)
variations and layout noise concerns. To avoid overcurrent
tripping in the normal operating load range, find the R
OCSET
resistor from the following equations with:
1. The maximum r
DS(ON)
at the highest junction
temperature
2. The minimum I
TSOC
from the specification table
Determine the overcurrent trip point greater than the
maximum output continuous current at maximum inductor
ripple current.
High Speed MOSFET Gate Driver
The integrated driver has the same drive capability and
feature as the Intersil’s 12V gate driver, ISL6612. The PWM
tri-state feature helps prevent a negative transient on the
output voltage when the output is being shut down. This
eliminates the Schottky diode that is used in some systems
for protecting the loads from reversed-output-voltage
damage. See the ISL6612 data sheet FN9153 for
specification parameters that are not defined in the current
ISL8104 “Electrical Specifications” table on page 4.
Reference Input
The REFIN pin allows the user to bypass the internal 0.597V
reference with an external reference. If REFIN is NOT above
~2.2V, the external reference pin is used as the control
reference instead of the internal 0.597V reference. When not
using the external reference option, the REFIN pin should be
left floating. An internal 6µA pull-up keeps this REFIN pin
above 2.2V in this situation.
Internal Reference and System Accuracy
The Internal Reference is set to 0.597V. The total DC system
accuracy of the system is to be within 1.5% over the industrial
temperature range. System Accuracy includes Error Amplifier
offset, and Reference Error. The use of REFIN may add up to
3mV of offset error into the system (as the Error Amplifier
offset is trimmed out via the internal System reference).
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible using ground
plane construction or single point grounding.
A multi-layer printed circuit board is recommended. Figure 5
shows the critical components of the converter. Note that
capacitors C
IN
and C
OUT
could each represent numerous
physical capacitors. Dedicate one solid layer (usually a middle
layer of the PC board) for a ground plane and make all critical
component ground connections with vias to this layer.
Dedicate another solid layer as a power plane and break this
plane into smaller islands of common voltage levels. Keep the
metal runs from the LX terminals to the output inductor short.
t
HICCUP
24VC
SS
⋅⋅
30μA
--------------------------------
=
(EQ. 5)
R
TSOC
I
OC_SOURCE
IΔ
2
-----
+
⎝⎠
⎛⎞
r
DS ON()
I
TSOC
N
T
--------------------------------------------------------------------------------- -
=
N
T
NUMBER OF TOP-SIDE MOSFETs=
R
TSOC
I
OC_SOURCE
r
DS ON()
200μA
----------------------------------------------------------------
=
SIMPLE OCP EQUATION
DETAILED OCP EQUATION
ΔI =
V
IN
- V
OUT
f
SW
L
OUT
--------------------------------
V
OUT
V
IN
----------------
f
SW
Regulator Switching Frequency=
(EQ. 6)
V
OUT
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT AND/OR POWER PLANE LAYER
L
OUT
C
OUT
C
IN
VIN
KEY
FIGURE 5. PRINTED CIRCUIT BOARD POWER PLANES
AND ISLANDS
VIA CONNECTION TO GROUND PLANE
LOAD
Q
1
Q
2
+14V
C
BP_VCC
C
BP_PVCC
C
IN
C
SS
ISL8104
TGATE
LX
GND
PVCC
BGATE
VCC
BOOT
SS
PGND
TRACE SIZED FOR 3A PEAK CURRENT
SHORT TRACE, MINIMUM IMPEDANCE
ISL8104
9
FN9257.2
March 7, 2008
The power plane should support the input power and output
power nodes. Use copper filled polygons on the top and
bottom circuit layers for the LX nodes. Use the remaining
printed circuit layers for small signal wiring.
Locate the ISL8104 within 2 to 3 inches of the MOSFETs, Q
1
and Q
2
(1 inch or less for 500kHz or higher operation). The
circuit traces for the MOSFETs’ gate and source connections
from the ISL8104 must be sized to handle up to 3A peak
current. Minimize any leakage current paths on the SS pin and
locate the capacitor, C
ss
close to the SS pin as the internal
current source is only 30µA. Provide local V
CC
decoupling
between VCC and GND pins. Locate the capacitor, C
BOOT
as
close as practical to the BOOT pin and the phase node.
Compensating the Converter
This section highlights the design consideration for a voltage
mode controller requiring external compensation. To address a
broad range of applications, a type-3 feedback network is
recommended (see Figure 6).
Figure 7 highlights the voltage-mode control loop for a
synchronous-rectified buck converter. The output voltage is
regulated to the reference voltage level. The error amplifier
output is compared with the oscillator triangle wave to
provide a pulse-width modulated wave with an amplitude of
V
IN
at the LX node. The PWM wave is smoothed by the
output filter. The output filter capacitor bank’s equivalent
series resistance is represented by the series resistor ESR.
The modulator transfer function is the small-signal transfer
function of V
OUT
/V
COMP
. This function is dominated by a
DC gain and shaped by the output filter, with a double pole
break frequency at F
LC
and a zero at F
CE
. For the purpose
of this analysis, L and DCR represent the output inductance
and its DCR, while C and ESR represents the total output
capacitance and its equivalent series resistance.
The compensation network consists of the error amplifier
(internal to the ISL8104) and the external R
1
to R
3
, C
1
to C
3
components. The goal of the compensation network is to
provide a closed loop transfer function with high 0dB crossing
frequency (F
0
; typically 0.1 to 0.3 of f
SW
) and adequate phase
margin (better than 45°). Phase margin is the difference
between the closed loop phase at F
0dB
and 180°. The
equations that follow relate the compensation network’s poles,
zeros and gain to the components (R
1
, R
2
, R
3
, C
1
, C
2
, and
C
3
) in Figures 6 and 7. Use the following guidelines for
locating the poles and zeros of the compensation network:
1. Select a value for R
1
(1kΩ to 10kΩ, typically). Calculate
value for R
2
for desired converter bandwidth (F
0
). If
setting the output voltage to be equal to the reference set
voltage as shown in Figure 7, the design procedure can
be followed as presented in Equation 8.
As the ISL8104 supports 100% duty cycle, D
MAX
equals 1.
The ISL8104 uses a fixed ramp amplitude (V
OSC
) of 1.9V,
Equation 8 simplifies to Equation 9:
2. Calculate C
1
such that F
Z1
is placed at a fraction of the F
LC
,
at 0.1 to 0.75 of F
LC
(to adjust, change the 0.5 factor in
Equation 10 to the desired number). The higher the quality
factor of the output filter and/or the higher the ratio
F
CE
/F
LC
, the lower the F
Z1
frequency (to maximize
phase boost at F
LC
).
3. Calculate C
2
such that F
P1
is placed at F
CE
.
4. Calculate R
3
such that F
Z2
is placed at F
LC
. Calculate C
3
such that F
P2
is placed below f
SW
(typically, 0.3 to 1.0
FIGURE 6. COMPENSATION CONFIGURATION FOR THE
ISL8104 CIRCUIT
ISL8104
COMP
C
1
R
2
R
1
FB
VOUT
C
2
R
3
C
3
FIGURE 7. VOLTAGE-MODE BUCK CONVERTER
COMPENSATION DESIGN
-
+
E/A
VREF
COMP
C
1
R
2
R
1
FB
C
2
R
3
C
3
L
C
V
IN
PWM
CIRCUIT
HALF-BRIDGE
DRIVE
OSCILLATOR
ESR
EXTERNAL CIRCUITISL8104
V
OUT
V
OSC
DCR
TGATE
LX
BGATE
GND
F
LC
1
2π LC
---------------------------
=
F
CE
1
2π C ESR⋅⋅
---------------------------------
=
(EQ. 7)
R
2
V
OSC
R
1
F
0
⋅⋅
D
MAX
V
IN
F
LC
⋅⋅
----------------------------------------------
=
(EQ. 8)
R
2
1.9 R
1
F
0
⋅⋅
V
IN
F
LC
-------------------------------
=
(EQ. 9)
C
1
1
2π R
2
0.5 F
LC
⋅⋅
-----------------------------------------------
=
(EQ. 10)
C
2
C
1
2π R
2
C
1
F
CE
1⋅⋅⋅
--------------------------------------------------------
=
(EQ. 11)
ISL8104

ISL8104IRZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers PWM CNTRLR DDRG 16LD 4X4 IND GEN
Lifecycle:
New from this manufacturer.
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