1. General description
The TFF1024HN is an integrated downconverter for use in Low Noise Block (LNB)
convertors in a 10.70 GHz to 12.85 GHz K
u
band satellite receiver system.
2. Features and benefits
Low current consumption integrated pre-amplifier, mixer, buffer amplifier and
PLL synthesizer
Flat gain over frequency
Single 5 V supply pin
Low cost 25 MHz crystal
Crystal controlled LO frequency generation
Switched LO frequency (selectable to 9.75 GHz, 10.00 GHz, 10.25 GHz, 10.55 GHz,
10.60 GHz, 10.75 GHz, 11.25 GHz or 11.30 GHz) with a 25 MHz crystal as reference
Other LO frequencies within the 9.75 GHz to 11.30 GHz range can be realized by
using an alternative reference frequency
Low phase noise
Low spurious
Low external component count
Alignment-free concept
ESD protection on all pins
3. Applications
K
u
band LNB converters for VSAT and digital satellite reception (DVB-S / DVB-S2)
4. Quick reference data
TFF1024HN
Integrated mixer oscillator PLL for satellite LNB
Rev. 1 — 13 January 2015 Product data sheet
'
+
9
4
)
1
Table 1. Quick reference data
9.75 GHz
f
LO
11.30 GHz; operating conditions of Table 6 apply.
Symbol Parameter Conditions Min Typ Max Unit
V
CC
supply voltage RF input and IF output AC coupled
[1]
4.5 5 5.5 V
I
CC
supply current RF input and IF output AC coupled
[1]
-5670mA
NF
SSB
single sideband noise figure f
IF
= 1450 MHz; T
amb
= 25 C;
10.55 GHz f
LO
10.60 GHz
-9.011.0dB
f
RF
RF frequency
[2]
10.70 - 12.85 GHz
TFF1024HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 1 — 13 January 2015 2 of 16
NXP Semiconductors
TFF1024HN
Integrated mixer oscillator PLL for satellite LNB
[1] DC values.
[2] See Table 4
for specific values at certain settings of pins HB0, HB1 and HB2.
5. Ordering information
6. Functional diagram
G
conv
conversion gain f
IF
= 1450 MHz
f
LO
= 10.55 GHz 29.8 34.3 38.8 dB
f
LO
= 10.60 GHz 29.8 34.3 38.8 dB
s
11
input reflection coefficient 10.70 GHz f
RF
12.85 GHz - 10 - dB
s
22
output reflection coefficient 950 MHz f
IF
2150 MHz; Z
0
=75 - 10 - dB
IP3
o
output third-order intercept point carrier power = 10 dBm (measured at output)
f
IF
= 1450 MHz; 9.75 GHz f
LO
10.75 GHz 14 18 - dBm
f
IF
= 1250 MHz; 11.25 GHz f
LO
11.30 GHz 14 18 - dBm
Table 1. Quick reference data
…continued
9.75 GHz
f
LO
11.30 GHz; operating conditions of Table 6 apply.
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Ordering information
Type number Package
Name Description Version
TFF1024HN DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad flat
package; no leads;16 terminals; body 2.5 3.5 0.85 mm
SOT763-1
Fig 1. Functional diagram
3//
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;2
5)
9
&&
,)
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*+]WR
*+]
DDD
TFF1024HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 1 — 13 January 2015 3 of 16
NXP Semiconductors
TFF1024HN
Integrated mixer oscillator PLL for satellite LNB
7. Pinning information
7.1 Pinning
7.2 Pin description
[1] The distance between the outer edges of pin 2 and pin 3 is 740 m. This gives an optimum transition from a 1.1 mm wide, Z
0
= 50 line
to the TFF1024HN on a Rogers RO4223 Printed-Circuit Board (PCB) material of 0.5 mm height.
Fig 2. Pin configuration
DDD
QF +%
+% ;2
5)B*1'
;2
5) +%
QF ,)
5)B*1' ,)B*1'
/)
95(*
5)B*
1'
9
&&
7UDQVSDUHQWWRSYLHZ







WHUPLQDO
LQGH[DUHD
Table 3. Pin description
Symbol Pin Description
GND 0 ground (exposed die pad)
RF_GND3 1 RF ground. Connect this pin to the exposed die pad landing.
RF_GND1 2 RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
n.c. 3 not connected. Connect to RF on PCB.
[1]
RF 4 RF input.
RF_GND2 5 RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
HB0 6 LO frequency selection, LSB. Connect this pin to GND for "0", leave open for "1". Also see Table 4
.
n.c. 7 not connected. Use this pin to route the ground layer on top of the PCB to the exposed die pad.
LF 8 Loop filter PLL. Connect loop filter between this pin and VREG (pin 9).
VREG 9 Regulated output voltage for PLL loop filter. Connect loop filter to this pin. Decouple against die pad via
pin 7.
HB2 10 LO frequency selection, MSB. Connect this pin to GND for "0", leave open for "1". Also see Table 4
.
XO2 11 Crystal connection 2. Connect crystal between this pin and XO1 (pin 12).
XO1 12 Crystal connection 1. Connect crystal between this pin and XO2 (pin 11).
HB1 13 LO frequency selection. Connect this pin to GND for "0", leave open for "1". Also see Table 4
.
IF 14 IF output
IF_GND 15 IF output ground. Connect this pin to the exposed die pad landing and the output transmission line ground.
V
CC
16 Supply voltage

TFF1024HN/N1,135

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Up-Down Converters TFF1024HN/N1/
Lifecycle:
New from this manufacturer.
Delivery:
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