MC14551B
http://onsemi.com
7
TYPICAL RESISTANCE CHARACTERISTICS
Figure 10. V
DD
@ 7.5 V, V
EE
@ – 7.5 V Figure 11. V
DD
@ 5.0 V, V
EE
@ – 5.0 V
350
300
250
200
150
100
50
0
- 8.0- 10 - 6.0 - 4.0 - 2.0
0 2.0 4.0 6.0 8.0 10
V
in
, INPUT VOLTAGE (VOLTS)
R
ON
, “ON” RESISTANCE (OHMS)
T
A
= 125°C
- 55°C
350
300
250
200
150
100
50
0
- 8.0- 10 - 6.0 - 4.0 - 2.0
0 2.0 4.0 6.0 8.0 10
V
in
, INPUT VOLTAGE (VOLTS)
R
ON
, “ON” RESISTANCE (OHMS)
T
A
= 125°C
25°C
25°C
- 55°C
700
600
500
400
300
200
100
0
- 8.0- 10 - 6.0 - 4.0 - 2.0
0 2.0 4.0 6.0 8.0 10
V
in
, INPUT VOLTAGE (VOLTS)
R
ON
, “ON” RESISTANCE (OHMS)
T
A
= 125°C
- 55°C
25°C
350
300
250
200
150
100
50
0
- 8.0- 10 - 6.0 - 4.0 - 2.0
0 2.0 4.0 6.0 8.0 10
V
in
, INPUT VOLTAGE (VOLTS)
R
ON
, “ON” RESISTANCE (OHMS)
T
A
= 25°C
V
DD
= 2.5 V
5.0 V
7.5 V
Figure 12. V
DD
@ 2.5 V, V
EE
@ – 2.5 V
Figure 13. Comparison at 25_C, V
DD
@ – V
EE
MC14551B
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8
APPLICATIONS INFORMATION
Figure A illustrates use of the onchip level converter
detailed in Figure 2. The 0to5.0 V Digital Control signal is
used to directly control a 9 V
pp
analog signal.
The digital control logic levels are determined by V
DD
and
V
SS
. The V
DD
voltage is the logic high voltage; the V
SS
voltage is logic low. For the example, V
DD
= + 5.0 V = logic
high at the control inputs; V
SS
= GND = 0 V = logic low.
The maximum analog signal level is determined by V
DD
and V
EE
. The V
DD
voltage determines the maximum
recommended peak above V
SS
. The V
EE
voltage determines
the maximum swing below V
SS
. For the example, V
DD
– V
SS
= 5.0 V maximum swing above V
SS
; V
SS
– V
EE
= 5.0 V
maximum swing below V
SS
. The example shows a ± 4.5 V
signal which allows a 1/2 V margin at each peak. If voltage
transients above V
DD
and/or below V
EE
are anticipated on the
analog channels, external diodes (D
x
) are recommended as
shown in Figure B. These diodes should be small signal types
able to absorb the maximum anticipated current surges during
clipping.
The absolute maximum potential difference between V
DD
and V
EE
is 18 V. Most parameters are specified up to 15 V
which is the recommended maximum difference between
V
DD
and V
EE
.
Balanced supplies are not required. However, V
SS
must be
greater than or equal to V
EE
. For example, V
DD
= + 10 V, V
SS
= + 5.0 V, and V
EE
= – 3.0 V is acceptable. See the table below.
Figure A. Application Example
EXTERNAL
CMOS
DIGITAL
CIRCUITRY
9 V
p-p
ANALOG SIGNAL
0-TO-5 V DIGITAL
CONTROL SIGNAL
V
DD
V
SS
V
EE
SWITCH
I/O
COMMON
O/I
CONTROL
MC14551B
-5 V+ 5 V
9 V
p-p
ANALOG SIGNAL
+ 4.5 V
- 4.5 V
GND
V
DD
V
DD
V
EE
V
EE
D
x
D
x
D
x
D
x
SWITCH
I/O
COMMON
O/I
Figure B. External Schottky or Germanium Clipping Diodes
+ 5 V
POSSIBLE SUPPLY CONNECTIONS
V
DD
In Volts
V
SS
In Volts
V
EE
In Volts
Control Inputs
Logic High/Logic Low
In Volts
Maximum Analog Signal Range
In Volts
+ 8 0 – 8 + 8/0 + 8 to – 8 = 16 V
p–p
+ 5 0 – 12 + 5/0 + 5 to – 12 = 17 V
p–p
+ 5 0 0 + 5/0 + 5 to 0 = 5 V
p–p
+ 5 0 – 5 + 5/0 + 5 to – 5 = 10 V
p–p
+ 10 – 5 + 10/ + 5 + 10 to – 5 = 15 V
p–p
MC14551B
http://onsemi.com
9
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
T
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
PDIP16
CASE 64808
ISSUE T
SOEIAJ16
CASE 96601
ISSUE A
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 0.78 --- 0.031
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z

MC14551BFG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC MUX/DEMUX QUAD 2X1 16SOEIAJ
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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